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hygrothermal aging
Effects of hygrothermal aging on anisotropic conductive adhesive joints: Experiments and theoretical analysis
      
The long-term hygrothermal aging will induce irreversible changes to epoxy resin systems due to susceptibility of the polymer resin to hydrolysis, oxidation, etc.
      
The results show that the strength of ACF joints decreases and the fracture mechanism gradually changes with hygrothermal aging.
      
The hygrothermal aging due to climatic variations implies an evolution of rheological parameters depending upon moisture content and temperature.
      
Their use is demonstrated by showing the effects of hygrothermal aging on the toughness of the composites.
      
Impact of hygrothermal aging on the dynamic mechanical properties of Sheet Molding Compound
      
In the current study, hygrothermal aging is used to accelerate normal environmental aging and dynamic mechanical thermal analysis (DMTA) is used to study the mechanical and chemical changes as a function of temperature and aging time.
      
The interfacial-adhesion performance between the lead frame and molding compound was studied after temperature cycles and hygrothermal aging, simulating a typical package-assembly process.
      
The hygrothermal aging involved a treatment at 85°C and 85% relative humidity (RH) for 168 h and three cycles of infrared (IR) solder-reflow condition.
      
Hygrothermal aging was detrimental to the interfacial-bond strength, especially for hydrophilic or polar surfaces, such as bare Cu, Ag, Pd/Ni, and Au/Ni coated lead frames.
      
The introduction of tiny dimples etched on the lead frame was effective in mitigating the reduction in interfacial-bond strength arising from hygrothermal aging.
      
 

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