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They contained from 75.0 up to 89.0 μg Cd/mg protein, from 7.5 up to 28.0 μg Cu/mg, and from 1.5 up to 12.0 μg Zn/mg protein.
      
and not Cu|Mg|O...; this result is achieved without any deconvolution of the experimental data.
      
Up to 1,373 As, 680 Pb, 376 Zn, 4.8 Cd, 169 Cu mg?kg-1 in fronds of P.
      
vittata and 358 As, 2,290 Pb, 23,403 Zn, 708 Cd, 342 Cu mg?kg-1 in shoots of S.
      
The adsorbed CuF of 125 ppm ai fungicide subsequently decreased from 7.5 ± 0.5 to 2.1 ± 0.1 μmol Cu (mg dry wt)-1 after 12 h incubation.
      
The presence of 50 mM CaCl2 resulted in a decrease of the adsorbed CuF to 3.5 ± 0.5 μmol Cu (mg dry wt)-1 and solubilizedcopper in the medium increased to 5.9 ± 0.8 μ mol Cu ml-1.
      
Additionally, the cellular copper contents attained after 2 h were 0.08 ± 0.01 and 0.16 ± 0.007 μmol Cu (mg dry wt)-1 in absence and presence of calcium, respectively.
      
Unstarved cyanobacterial cells assimilated 97.0 nmol Cu mg-1 protein within 1 h when incubated in medium containing 40 μM Cu.
      
The metallic sites in the based like-hydrotalcite catalysts Cu/Mg-Al enhance the formation of methylamines.
      
These tests revealed that the peak-aged alloys exhibited relatively high stability up to 160 °C, with greater reductions in strength being observed at 200 °C (especially for the high Mn, low Cu/Mg ratio (6.7) alloy 251).
      
Impact of Cu/Mg Ratio on Thermal Stability of Hot Extrusion of Al-4.6 Pct Cu-Mg-Ag Alloys
      
This work explores how the Cu/Mg ratio affects the thermal stability of the extrusion of Al-4.6 pct Cu-Mg-Ag alloys at aerodynamic heating temperatures of up to 155 °C for 1000 hours.
      
The Cu/Mg ratio was modified by adding various amounts of elemental Mg.
      
Results of this study also demonstrate that the hot-extruded low Cu/Mg alloy satisfies the requirement of the material thermal stability of commercial supersonic aerial applications.
      
The effect of O2 ambient annealing on the microstructure of Cu(Mg) in the form of a Cu(Mg)/SiO2/Si multilayer
      
The effect of annealing in an O2 ambient on Cu(Mg)/SiO2/Si multilayer films was investigated.
      
As-deposited Cu(Mg)/SiO2/Si multilayer samples with film thicknesses in the 1,000-3,000 ? range were annealed for 30 min in oxygen ambients at pressures ranging from vacuum to 100 mtorr.
      
A dry-patterned Cu(Mg) alloy film as a gate electrode in a thin-film transistor liquid crystal display
      
The resultant MgO/Cu structure, with a taper slope of about 30°, shows the feasibility of dry etching of Cu(Mg) alloy films using a surface MgO mask scheme.
      
A novel process for the dry etching of Cu(Mg) alloy films that eliminates the use of a hard mask, such as Ti, and results in a reduction in the process steps is reported for the first time in this work.
      
 

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