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bonding layer
In this work, a smart cure cycle with cooling, polymerization and reheating was devised to nearly completely eliminate thermal residual stresses in the bonding layer of the co-cure bonded hybrid structure.
      
The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY-Y2O3 stabilized ZrO2 transition layer and Y2O3 stabilized ZrO2 ceramic layer are prepared on nickel alloy substrates using the plasma spray technique.
      
The technology relies on a temporary adhesive bonding layer between SMA film/foil and an auxiliary substrate, which can be removed by laser ablation.
      
During vulcanization of sulfur-cure mixtures in contact with brass, a bonding layer consisting of sublayers of copper and zinc sulfides and oxides is formed.
      
Sublayers were found in the bonding layer between rubber and brass.
      
Different crystallographic phases were identified in an etched bonding layer by electron diffraction.
      
The bonding agents of the ormocers formed layers with unacceptable features (pores, fractures) whereas that of the hybrid composite achieved perfect bonding layer even after loading.
      
Double plate system with a discontinuity in the elastic bonding layer
      
The double plate system with a discontinuity in the elastic bonding layer of Winker type is studied in this paper.
      
Chopping also seems to increase oxygen affinity of both metallic and dielectric films for growth of interfacial bonding layer.
      
The stability of a laminated elastic coating with a polymeric bonding layer is considered within the framework of a piecewise-homogeneous model.
      
The dielectric constant distribution over the bonding layer was then obtained by inverting the two-dimensional signals.
      
The inverted distribution of the dielectric constants over the bonding layer agreed very well with the actual distribution of the disbonds in both positions and sizes.
      
Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects
      
A silver layer is deposited as a bonding layer on the surface of copper pads.
      
The silver bonding layer improves bonding between the gold ball and copper pads.
      
This use of a silver bonding layer may make the fabrication of copper chips simpler than by other protective schemes.
      
Computational investigations of the bonding layer in CVD-coated WC+Co cutting tools
      
The effect of processing parameters on the bonding layer structure of the chemical vapor deposition (CVD) coated cemented carbide inserts was investigated through thermodynamics calculations.
      
The composite cylinder is composed of two different piezoelectric materials belonging to 6 mm class and a hypothetical Linear Elastic Material with Voids (LEMV) as bonding layer.
      
 

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