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bulk silicon
    A Tunneling-Based Accelerometer in Bulk Silicon Processes
    体硅隧道加速度计
    A method to make blazed silicon gratings is designed. The fabrication of (100) and (111) silicon wafer grating is performed by bulk silicon techniques. The surfaces of silicon gratings have been tested by AFM.
    设计了一种制作闪耀硅光栅的方法,利用体硅加工技术分别进行了(100)面硅片和(111)面硅片光栅的制作,对光栅的表面进行了测试。
    2) The introduction of the principles of capacitive principle, piezoresistive principle, electrostatics principle, piezoelectric principle, stunning principle and shape memory alloy principle. The fabrication processes of the MEMS are discussed, and emphasized on the silicon surface sacrificial, bulk silicon fabrication, LIGA technology and molecule manipulating technology. The fields of the MEMS, which demand further study, are put forwarded.
    2)系统分析了MEMS的压容原理、压阻原理、静电原理、压电原理、隧道原理和形状记忆合金原理等工作原理:介绍了MEMS的平面加工工艺、体硅加工工艺、LIGA技术、准分子激光加工技术、分子操纵技术等MEMS工艺,提出了MEMS有待进一步研究的领域。
    Results show that, the surface micro-machined structure has good thermal isolation and temperature uniformity in vacuum, excellent mechanical strength and good IC process compatibility, which make it better match the requirements of microcalorimeters than the bulk silicon fabricated structure.
    结果表明,表面加工型结构在真空中绝热性能优良、样品区温度分布较均匀,同时,它机械强度高、与IC工艺兼容性好,比体硅加工结构更符合微量热计的需要。
    Different V-shaped electrothermal actuators are designed and fabricated using the surface and bulk silicon micromachining process respectively. And the design experience is improved.
    采用表面硅牺牲层工艺和体硅腐蚀工艺分别设计、制造了具有不同结构参数的V型电热微致动器,经过几次版图设计和流片制作,积累了两种工艺条件下硅微机构设计方面的经验。
    I summarize and compare the features of three kinds of variable-capacitance micromechanical accelerometer, and on the basis of mechanics characteristic of several kinds of beams structure, it is shown that the best structure of variable-capacitance micromechanical accelerometer is the bias stationary finger-shaped structure with folded beams fabricated by bulk silicon micromechining process by analysis and comparison.
    综合比较了三种类型电容加速度计的特点,并根据各种梁结构的力学性能,通过分析比较,得出了折叠梁支撑的体硅加工定齿偏置梳齿结构为电容加速度计的最优结构。
    Using the bulk silicon fabrication technology and the silicon/glass electrostatic bonding process, a sandwich structure tunneling accelerometer was fabricated and tested.
    利用体硅微机械加工工艺和硅 /玻璃静电键合技术成功研制出了一种三明治结构的隧穿加速度计 .
    The characteristic of Z-axis micromachined gyroscope from DDSOG process is introduced. The Z-axis micromachined gyroscopes from DDSOG process and bulk silicon dissolved wafer process are compared in residual stress, quality factor and sensitivity. By calculation, the drive quality factor of the gyroscope from DDOSG process is 1.45 times of that from bulk silicon dissolved wafer process, but the sense quality factor of the former is only 0.11 times of the latter.
    介绍了采用DDSOG工艺加工的Z轴微机械振动陀螺的特点,并与采用体硅薄片融解工艺加工的相同Z轴微机械振动陀螺进行了残余应力、品质因数及灵敏度等性能参数的比较,采用DDSOG工艺后陀螺的驱动品质因数是原来体硅薄片融解工艺的1.45倍,而检测品质因数是原来的0.11倍.
    Finally the experiment results of both kinds of gyroscope are compared and it is indicated that the sensitivity of the gyroscope from DDSOG process is about ten times greater than that from bulk silicon dissolved wafer process.
    最后,比较了采用2种不同工艺加工后Z轴微机械陀螺的实验结果,结果表明采用DDSOG工艺加工后陀螺的灵敏度比原来采用体硅薄片融解工艺加工的陀螺的灵敏度提高了近10倍.
    In this system,the loading structure,frictional pair and force sensors are all integrated on a single chip using bulk silicon processing and bonding technologies.
    利用微机械体硅工艺及键合技术,把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
 

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