助手标题
全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多
查询帮助
意见反馈
共[19]条 当前为第1条到19条
 

相关语句
覆铜箔
    Application of Chinese Aluminium Hydrorides to CEM-3 Type Copper Clad laminate
    国产氢氧化铝填料在CEM-3型覆铜箔层压板中的应用
    Synthesis and reaction kinetics of diglycidyl ether of bisphenol-A for copper clad laminates
    覆铜箔层压板专用双酚A二缩水甘油醚的合成及反应动力学
    Cure kinetics of diglycidyl ether of bisphenol-A/dicyandiamide system for copper clad laminates
    覆铜箔层压板专用双酚A二缩水甘油醚/双氰胺体系的固化反应动力学
    Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000
    印制线路板用无卤型覆铜箔层压板——玻纤布·环氧树脂 JPCA-ES-04-2000
    Halogen-free Copper Clad Laminate for Multilayer PCB-JPCA-ES-05-2000
    多层印制线路板用无卤型覆铜箔层压板——玻纤布基材环氧树脂 JPCA-ES-05-2000
    Halogen-free Copper Clad Laminate for Test Method-JPCA-ES-01-1999
    无卤型覆铜箔层压板的试验方法——玻纤布基材环氧树脂 JPCA-ES-01-1999
    Trial of Test Methods for Bow and Twist of as Received and After Heated Cellulose Paper and Composite Copper Clad Laminates
    纸基·复合基覆铜箔板常态及受热后的翘曲测试方法的试用
    This article introduces the performance of chinese alumnium hydroxides(Al 2O 3·nH 2O) and its application to CEM 3 type Copper Clad laminate(CCL).
    本文介绍了国产氢氧化铝 ( Al2 O3· n H2 O)填料的性能指标及其在 CEM- 3型覆铜箔层压板 ( CCL)中的应用工艺、CCL性能。
    APPLICATION OF STYRENE-MALEIC ANHYDRIDE COPOLYMER(SMA) RESIN IN COPPER CLAD LAMINATE
    苯乙烯-马来酸酐树脂在覆铜箔板中的应用
    STUDY ON THE CURE KINETICS OF BROMINATED EPOXY RESIN/ DICYANDIAMIDE SYSTEM FOR COPPER CLAD LAMINATES
    覆铜箔层压板专用低溴环氧树脂/双氰胺体系的固化反应动力学
    Studies on a novel non-halogen flame-retarding copper clad laminate
    一种新型无卤阻燃覆铜箔板基板材料的制备
    The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates
    覆铜箔层压板专用环氧树脂的合成与性能
    Using the modifiedresin system as matrix, and the glass fiber as reinforcement, and acetone as mainsolvent, the impregnant and half-cured sheet with fine properties are prepared, what’smore, the copper clad laminate based on the modified resin system show goodmechanical and dielectrical properties.
    以玻璃纤维为增强材料,改性树脂体系为基体树脂,丙酮作为主要溶剂,制备了储存稳定性优良的胶液和半固化片,压制得到的覆铜箔层压板具有良好的力学性能和电气性能。
    The finest resin system is settled down through experiment and analysis. Thesolubility, curing kinetic and mechanism of the modified resin are studied by FTIRinfrared and DSC apparatus, as well as the confect of impregnant, impregating, drynessand laminate processing of the copper clad laminate.
    通过实验及分析确定了最佳的树脂配方体系,利用傅立叶红外光谱仪、差示扫描量热分析仪等分析手段对改性树脂体系的凝胶特性、反应特性、固化机理及反应动力学进行了详细的研究,并对覆铜箔层压板成型工艺中胶液的配制、浸胶、干燥以及热压工艺进行了深入研究,确定了各道工序的主要影响因素并最终确定了适宜的成型工艺。
    A basic material for copper clad laminates, diglycidyl ether of bisphenol-A (DGEBA) was synthesized through two-step method. The technological process which proved mature had been realized in industry and filled the vacancy of China.
    本文采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚(DGEBA),探索出其成熟的工艺路线,此工艺已在苏州树脂厂实现工业化,填补了国内空白。
    After the progress of the long time heat-treatment; the fabric intensity is lost seriously. And it is no problem to the copper clad laminate, but it is difficult to satisfy with the fiber glass of three spinning axises for the tremendous loss of the fabric intensity.
    并且该布在连续热处理、长时间焖炉焖烧后布面强度损失很大,这点虽对覆铜箔板用玻纤基布不存在问题,但对承受较大应力的结构材料用纱强度损失太大,难于满足玻纤纱三向织物编织的工艺要求。
    A basic material for copper clad laminates, diglycidyl ether of bisphenol A (DGEBA), was synthesized through a two step method. The effect of reaction conditions on chloride content, epoxy equivalent weight, molecular weight and its distribution of products was investigated.
    采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚 ,考察了不同反应条件对产物的总氯含量、环氧值、分子量及分子量分布的影响。
    This study will provide an accurate research method of the cure kinetics and a theoretical guide for the manufacture of epoxy/glass fabric based copper clad laminates.
    本研究为环氧树脂 /玻纤布基覆铜箔层压板及多层印刷电路板的制作工艺提供了理论指导
    This paper introduces the test methods and try using for bow and twist as received and after heated forcellulose paper and composite copper clad laminated sheets.
    概述了一种纸基·复合基覆铜箔板常态及受热后的翘曲测试方法及试用情况。
 

首页上一页1下一页尾页 

 
CNKI主页设CNKI翻译助手为主页 | 收藏CNKI翻译助手 | 广告服务 | 英文学术搜索
版权图标  2008 CNKI-中国知网
京ICP证040431号 互联网出版许可证 新出网证(京)字008号
北京市公安局海淀分局 备案号:110 1081725
版权图标 2008中国知网(cnki) 中国学术期刊(光盘版)电子杂志社