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铜包铝
    Standardization for copper clad aluminium wire
    铜包铝线标准化
    MACHINING PROCEDURE AND SOLID-STATE BONDING MECHANISM OF CLAD-PROCESS WELDING COPPER CLAD ALUMINUM WIRE
    包复焊接铜包铝线加工工艺与固相结合机理研究
    Quality analysis and production process of T2 Copper Clad Aluminum
    铜包铝紫铜带的生产工艺与质量分析
    The present and future of the manufacturing technology for copper clad aluminium bimetallic wires
    铜包铝复合线材制造技术的发展现状与前景
    Microstructure and mechanical properties of copper clad aluminum wire by drawing at room temperature
    铜包铝线材室温拉变形后的显微组织和力学性能
    This paper introduces the principle in the development of Electronics Industry Standard for copper clad aluminium wire. The classes, quality, properties, testing, and applications of copper clad aluminium wire are also presented.
    本文介绍了我国《铜包铝线》电子行业标准制定的原则,铜包铝线的类别、质量和性能以及试验、应用等情况。
    The construction and application of copper clad aluminium bimetallic wires are presented.
    介绍了铜包铝复合线材的性能构特点与应用情况。
    Application advantage of CCAW(copper clad aluminum wire) and processing technology of clad-process welding CCAW were introduced. The effect factor of solid-state bonding during drawing the bimetal wire was analyzed.
    介绍了铜包铝线的使用优点和包复焊接铜包铝线加工工艺过程,分析了通过双金属拉拔实现金属间固相结合的影响因素;
    This article introduces the production process of T2 Copper Clad Aluminum Analyses the factors influence surface quality of T2 CCA ,and puts forward the control measure also.
    本文简述了铜包铝紫铜带的生产工艺,并对生产中影响铜包铝紫铜带表面质量的主要因素和控制措施进行了论述。
 

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