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覆铜箔层压板
    Synthesis and reaction kinetics of diglycidyl ether of bisphenol-A for copper clad laminates
    覆铜箔层压板专用双酚A二缩水甘油醚的合成及反应动力学
    Cure kinetics of diglycidyl ether of bisphenol-A/dicyandiamide system for copper clad laminates
    覆铜箔层压板专用双酚A二缩水甘油醚/双氰胺体系的固化反应动力学
    STUDY ON THE CURE KINETICS OF BROMINATED EPOXY RESIN/ DICYANDIAMIDE SYSTEM FOR COPPER CLAD LAMINATES
    覆铜箔层压板专用低溴环氧树脂/双氰胺体系的固化反应动力学
    The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates
    覆铜箔层压板专用环氧树脂的合成与性能
    A basic material for copper clad laminates, diglycidyl ether of bisphenol-A (DGEBA) was synthesized through two-step method. The technological process which proved mature had been realized in industry and filled the vacancy of China.
    本文采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚(DGEBA),探索出其成熟的工艺路线,此工艺已在苏州树脂厂实现工业化,填补了国内空白。
    A basic material for copper clad laminates, diglycidyl ether of bisphenol A (DGEBA), was synthesized through a two step method. The effect of reaction conditions on chloride content, epoxy equivalent weight, molecular weight and its distribution of products was investigated.
    采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚 ,考察了不同反应条件对产物的总氯含量、环氧值、分子量及分子量分布的影响。
    This study will provide an accurate research method of the cure kinetics and a theoretical guide for the manufacture of epoxy/glass fabric based copper clad laminates.
    本研究为环氧树脂 /玻纤布基覆铜箔层压板及多层印刷电路板的制作工艺提供了理论指导
 

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