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   楔形焊接 的翻译结果: 查询用时:0.114秒
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楔形焊接
相关语句
  相似匹配句对
     Industrial Engineering of Welding
     焊接工业工程
短句来源
     SELF - PROPAGATING HIGH - TEMPERATURE SYNTHESIS WELDING
     自蔓延高温合成焊接
短句来源
     APPLICATION OF WELDING SCREEN CLOTH WITH WEDGED STRIP WELD ON REFORMING REACTOR
     楔形条缝焊接筛网在重整反应器中的应用
短句来源
     (2) wedge-shaped diffuser;
     (2)楔形扩压器;
短句来源
     The Design on Wedge Lock
     楔形锁紧装置的研制
短句来源
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  wedge bonding
Wires (typically, ?=25μm) made of this alloy are widely used in the wedge bonding of cryogenic detectors.
      
Platinum wire wedge bonding: A new IC and microsensor interconnect
      
Ultrasonic ball or wedge bonding of Au or Al has been the traditional method for mak-ing electrical interconnects between die and chip header for most Integrated Circuit (IC) and microsensor devices.
      
Deformation and bonding processes in aluminum ultrasonic wire wedge bonding
      
Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires
      
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After reviewing current wire bonding technology,wire bonding technology development trends are discussed.Ball bonding has more advantages than wedge bonding,so that it is widely used in IC Packaging. Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.Integrated forward looping and reverse looping,complex multi layer wire bonding and multi chip packaging can be achieved.Summarily,with continuously...

After reviewing current wire bonding technology,wire bonding technology development trends are discussed.Ball bonding has more advantages than wedge bonding,so that it is widely used in IC Packaging. Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.Integrated forward looping and reverse looping,complex multi layer wire bonding and multi chip packaging can be achieved.Summarily,with continuously developing wire bonding technology,it can meet advanced packaging requirement and provide a low cost solution for packaging.

在回顾现有的引线键合技术之后,文章主要探讨了集成电路封装中引线键合技术的发展趋势。球形焊接工艺比楔形焊接工艺具有更多的优势,因而获得了广泛使用。传统的前向拱丝越来越难以满足目前封装的高密度要求,反向拱丝能满足非常低的弧高的要求。前向拱丝和反向拱丝工艺相结合,能适应复杂的多排引线键合和多芯片封装结构的要求。不断发展的引线键合技术使得引线键合工艺能继续满足封装日益发展的要求,为封装继续提供低成本解决方案。

 
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