助手标题  
全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多
查询帮助
意见反馈
   集成组装 的翻译结果: 查询用时:0.007秒
图标索引 在分类学科中查询
所有学科
更多类别查询

图标索引 历史查询
 

集成组装
相关语句
  “集成组装”译为未确定词的双语例句
     LD-BRM provides the ability to define and interpret the business process, which enables designers to integrate the defined business rules and concrete data process codes into LD-BRM, and then construct a new application system.
     LD-BRM提供了业务流程的定义和解释能力,使得设计人员在定义了业务规则和编写具体的数据处理代码后,就可以与LD-BRM集成,组装成为一个新的应用系统。
短句来源
     Web Services is a network can be named resources for the establishment of an open distributed system components, as a deployed at the Web can use the components, Web Service with good packaging nature, and can be described by standard agreements with other components of integrated assembly for the new applications.
     Web Services是一种可命名的网络资源,是用于创建开放的分布式系统的构件,作为一种部署在Web上的可复用构件,Web Service具备良好的封装性,可以通过标准协议描述并与其它构件集成组装为新的应用系统。
短句来源
     2. Accelarate the research and exploitation of ecological and economical technology applied in Agricultural Engineering;
     2)加速研究开发和集成组装生态的和经济的农业工程适用技术;
     After that, a component model supporting interface connection architecture and plug and socket architecture, and an architecture based component assembling framework are proposed, and the building and assembling process of reusable software components is specified.
     然后提出了支持接口连接式和插头插座式体系结构类型的构件模型以及基于体系结构的构件集成组装框架 ,并给出了构件的制作和组装过程 ;
短句来源
     The product turns round with is refers turns round with already the software component which has, obtains the new system through the component integration assembly.
     产品复用是指复用已有的软件构件,通过构件集成组装得到新系统。
短句来源
更多       
  相似匹配句对
     3) the development of practical assembly and integration.
     3)实际的组装集成开发过程。
短句来源
     Technology of integrating and assembling and installing the ecology concrete
     生态混凝土集成组装技术
短句来源
     Logarithmic Amplifiers and Their Integration
     集成对数放大器
短句来源
     Integrated optics
     集成光学
短句来源
     Assembly of functional nanostructure
     功能纳米结构的组装
短句来源
查询“集成组装”译词为用户自定义的双语例句

    我想查看译文中含有:的双语例句
例句
没有找到相关例句


This article analyses and discusses the design features of an improved emitter feedback data amplifier with excellent technical characteristics. Its temperature drift of input offset voltage is not greater than O. 5μV/℃. The linearity of closed loop gain is not worse than ×0.01%. The common mode rejection ratio reaches 30dB. The closed loop differential mode input resistance is no less than 1000M. The effective low frequency input voltage noise is not larger than 1μV(p-p) in 0-2Hz.These characteristics have...

This article analyses and discusses the design features of an improved emitter feedback data amplifier with excellent technical characteristics. Its temperature drift of input offset voltage is not greater than O. 5μV/℃. The linearity of closed loop gain is not worse than ×0.01%. The common mode rejection ratio reaches 30dB. The closed loop differential mode input resistance is no less than 1000M. The effective low frequency input voltage noise is not larger than 1μV(p-p) in 0-2Hz.These characteristics have been gained through a simply-constructed circuit based on advanced principles. The whole amplifier can be easily divided into several independent sections. As a result, except a few components, it can not only be integrated monolithicly, but also be assembled with multichip integrated circuits. At the same time, it can also be assembled hybridly with discrete components and integrated circuit operational amplifier easily. All these advantages will make this data amplifier the best circuit in the data acquisition system.

本文对一种经改进的射极反馈数据放大器的设计进行了分析和讨论。这种数据放大器具有优良的技术性能。它的输入失调电压温漂不大于0.5μV/℃,闭环增益线性不劣于±0.01%,共模抑制比可达130dB,闭环差模输入电阻不小于1000MΩ,0~2Hz的低频输入电压噪声不大于1μV(峰-峰值)。 这样的指标是通过一个结构简单的电路而取得的,整个放大器易于划分成几个相互独立的部分,因而除个别元件外,既便于单片集成,又便于分片集成组装,同时也易于用分立元件与集成运放混合组装。所有这些优点将使这种数据放大器有望成为数据采集系统中的优选电路。

In this paper, the development of multichip module and the integrated package technique of multilayer wiring are described. These features of the technique and design consideration are introduced. The fabrication process of multilayer wiring on silicon based board, and some problems in the process are also discussed.

本文叙述了多芯片组件和多层布线集成组装技术的研究和进展,介绍了硅基多层布线集成组装技术的特点和设计考虑,扼要地叙述了硅基多层布线的制造工艺,并讨论了工艺中所出现的问题。

Metallic oxide nanopowders are prepared by sol gel method. They are applied to NTC thermistors. The experimental result shows application of metallic oxide nanopowders have improved the quality, such as consistence, of NTC thermistors.

以高稳定,易重现瓷料为基础,运用特性互补偿原理和集成组装技术,设计高精密度可互换NTC热敏电阻器。着重阐述了互换精度达0.2级的高精密可互换NTC热敏电阻的设计要点及质控技术。

 
<< 更多相关文摘    
图标索引 相关查询

 


 
CNKI小工具
在英文学术搜索中查有关集成组装的内容
在知识搜索中查有关集成组装的内容
在数字搜索中查有关集成组装的内容
在概念知识元中查有关集成组装的内容
在学术趋势中查有关集成组装的内容
 
 

CNKI主页设CNKI翻译助手为主页 | 收藏CNKI翻译助手 | 广告服务 | 英文学术搜索
版权图标  2008 CNKI-中国知网
京ICP证040431号 互联网出版许可证 新出网证(京)字008号
北京市公安局海淀分局 备案号:110 1081725
版权图标 2008中国知网(cnki) 中国学术期刊(光盘版)电子杂志社