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   体硅工艺 的翻译结果: 查询用时:0.942秒
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体硅工艺     
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  bulk silicon process
     Micro-vibration sensors fabricated by bulk silicon process have the advantage of high sensitivity and low noise compared with the surface micromachining.
     体硅工艺微振动传感器与表面工艺微振动传感器相比,具有灵敏度高、噪声低等优点.
短句来源
     This method is completely compatible with the conventional bulk silicon process.
     这项技术与体硅工艺完全兼容.
短句来源
  bulk silicon technology
     Micro-vibration sensors fabricated by bulk silicon technology
     体硅工艺微振动传感器的研制
短句来源
  silicon bulk micromachining
     Fabrication process analysis for electrostatically actuated microgripper based on silicon bulk micromachining
     基于体硅工艺的静电致动微夹持器制作工艺分析
短句来源
     Microgripper based on silicon bulk micromachining
     基于体硅工艺的微夹持器设计
短句来源
  body silicon technology
     Bulk micromachining mainly includes combination of bonding and deep etching, pursuit to big mass and small stress, and three dimensional fabrications technology which is the developing direction of new body silicon technology.
     体硅工艺主要表现为键合与深刻蚀技术的组合 ,追求大质量块和低应力以及三维加工。 SOI技术是新一代的体硅工艺发展方向 ;
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  bulk silicon process
The device is fabricated with standard bulk silicon process and bonding technology based on parameters that have been theoretically calculated to get the stiffness and friction forces.
      
  bulk micro-machining
The use of completely CMOS compatible TMAH-based bulk micro-machining techniques during the fabrication process, allows easy smart gas sensor integration in SOI-CMOS technology.
      
Bulk micro-machining techniques provide promise, but may impede multi-axis measurement.
      
MEMS Technology Fabrication resources for both surface and bulk micro-machining in Silicon, quartz and glass.
      
Stiction problem, which happened often in SOI bulk micro-machining processes and so need special treatment, is avoided.
      
  bulk silicon technology
One drawback of the SOI approach is that it has been somewhat more difficult to implement than bulk silicon technology.
      
  bulk silicon micromachining
Fibre-optical MEMS switches based on bulk silicon micromachining
      
This paper presents the modeling of the detection capacitance analysis for a tuning fork vibratory microgyroscope fabricated by the bulk silicon micromachining technology.
      
CPMS were fabricated on four-inch diameter and double side polished (100) silicon wafers and using anisotropic bulk silicon micromachining for membrane formation and etched well.
      
Tunneling accelerometers are based on bulk silicon micromachining, normally incorporating boron etch-stop wafer processes.
      
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