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导线接点
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     Line-shaped conductor
     线形导线
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     An Introduction of New Type Conductors
     新型导线的介绍
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     Study on retardance of retarders to neuromuscular junction
     N-M接点阻滞剂的阻滞作用研究
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     Application of the AC-DC joint changer
     交直流接点转换器的应用
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Electromigration is the movement of metal atoms in the direction of current flow. It is caused by thetransfer of momentum from the passing electrons to atoms in the lattice. This paper addresses the physics ofelectromigration in solders, and presents the effects of crowding current. The dissolution of UBM and the evolution ofIMC in lead-free solders are analyzed. Results of recent experiments on the electromigration of lead-free solder bumpsare reviewed. The reliability of lead-free solder bump is also discussed....

Electromigration is the movement of metal atoms in the direction of current flow. It is caused by thetransfer of momentum from the passing electrons to atoms in the lattice. This paper addresses the physics ofelectromigration in solders, and presents the effects of crowding current. The dissolution of UBM and the evolution ofIMC in lead-free solders are analyzed. Results of recent experiments on the electromigration of lead-free solder bumpsare reviewed. The reliability of lead-free solder bump is also discussed.

电迁移是金属原子沿着电流方向的移动。阐述了无铅焊料中电迁移的物理特性,由于焊点的特殊几何形状,电流拥挤效应将发生在焊点与导线的接点处;电迁移效应导致无铅焊料中金属间化合物(IMC)的生成与溶解,以及焊点下的金属化层(UBM)的溶解和消耗,使原子发生迁移并会产生孔洞,造成焊点破坏,缩短了焊点平均失效时间(MTTF),从而带来可靠性问题。

>=Electromigration is the movement of metal atoms in the direction of current flow. It is caused by the transfer of momentum from the passing electrons to atoms in the lattice. This paper addresses the physics of electromigration in solders, and presents the effects of crowding current. The dissolution of UBM and the evolution of IMC in lead-free solders are analyzed. Results of recent experiments on the electromigration of lead-free solder bumps are reviewed. The reliability of lead-free solder bump is also...

>=Electromigration is the movement of metal atoms in the direction of current flow. It is caused by the transfer of momentum from the passing electrons to atoms in the lattice. This paper addresses the physics of electromigration in solders, and presents the effects of crowding current. The dissolution of UBM and the evolution of IMC in lead-free solders are analyzed. Results of recent experiments on the electromigration of lead-free solder bumps are reviewed. The reliability of lead-free solder bump is also discussed.

电迁移是金属原子沿着电流方向的移动。本文阐述了无铅焊料中电迁移的物理特性, 由于焊点的特殊几何形状,电流拥挤效应将发生在焊点与导线的接点处:电迁移效应导致无铅焊料中金属间化合物(IMC)的生成与溶解,以及焊点下的金属化层(UBM)的溶解和消耗,使原子发生迁移并会产生孔洞,造成焊点破坏,缩短了焊点平均失效时间(MTTF),从而带来可靠性问题。

 
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