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界面微观结构     
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  interfacial microstructure
     Study on Interfacial Microstructure of K_2O·6TiO_2(W) /ZA27 Alloy Composite
     K_2O·6TiO_(2(W))/ZA27合金复合材料界面微观结构
短句来源
     THE INTERFACIAL MICROSTRUCTURE OF CF/AL COMPOSITES
     CF/Al复合材料的界面微观结构
     The interfacial microstructure and reaction of K 2O·6TiO 2(W) /ZA27 alloy composite by means of squeeze casting was investigated in this paper.
     采用挤压铸造工艺制备出复合良好的K2 O·6TiO2 (W) /ZA2 7合金复合材料 ,对该复合材料的微观组织、界面微观结构、界面反应等进行了研究。
短句来源
     Si3N4 ceramic is brazed with Ti40Zr25Ni15Cu20 amorphous filler metal,and the effect of brazing parameter on interfacial microstructure and joint strength was discussed. The interfacial microstructure is composed of two parts which are TiN and Ti-Si,Zr-Si compound respectively with the SEM,EDX etc.
     采用Ti40Zr25Ni15Cu20非晶钎料进行了Si3N4陶瓷真空钎焊连接,利用SEM、EDX等微观分析手段,研究了钎焊界面的微观结构,得出界面反应层有两部分组成,接头界面微观结构为Si3N4/TiN/Ti Si,Zr Si化合物/钎缝中心;
短句来源
     Interfacial Microstructure of advanced ceramic tool material JX-2-I have been studied with TEM and elec-tron diffraction spectrum.
     利用TEM和电子衍射图谱分析,研究了新型陶瓷刀具材料JX-2-I的界面微观结构
短句来源
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  interface microstructure
     Analysis on Interface Microstructure of Multiphase Ceramic-lined Composite Pipes Prepared by SHS
     SHS制备复相陶瓷内衬管界面微观结构分析
     Study of Adhesion Interface Microstructure
     粘接界面微观结构研究
短句来源
     2. Establishing 6 primary bonding interface microstructure models, revealing the mechanism why the cement mantle in well cementation is out of work and the mechanism how the YLD-1 bridging particle increase the bonding strength on interface, thereby, presents the enhanced microstructure models on the bonding interface and the mechanism of reinforced bonding strength on interface.
     2.建立了6个主要的胶结界面微观结构模型,揭示了固井水泥环窜漏失效的机制和 YLD.1堵漏剂界面胶结强度增强机制,由此推出了胶结界面微观结构增强模型和界面胶结强度增强机理。
短句来源
     Investigations of Preparation Technology and Interface Microstructure of SHS Composite Pipes
     SHS复合管制备工艺及界面微观结构研究
短句来源
     The interface microstructure of SiC particle reinforced LD2 based composite has been investigated u-tilizing optical microscope,TEM and EDAX.
     本文利用金相显微镜、透射电镜及能谱仪研究了SiC颗粒增强LD_2基复合材料的界面微观结构
短句来源
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  interfacial microstructures
     Raman Spectroscopy Study on Interfacial Microstructures of SiC Reinforced Composites
     SiC纤维增强复合材料界面微观结构的Raman光谱研究
短句来源
     The interfacial microstructures of the B/Al composites have been investigated with transmission electron microscope and Xray energy dispersive spectrometer.
     利用透射电镜及X-射线能谱仪研究了B/Al复合材料的界面微观结构
短句来源
     PROPERTIES AND INTERFACIAL MICROSTRUCTURES FOR NANOSTRUCTURED MATERIALS
     纳米固体材料的性能与界面微观结构
短句来源
     The periodicity,thickness of the individual layers,interface roughness and its interfacial microstructures of the typical samples were systematically studied with low-angle X-ray diffraction (LXD) technique.
     利用小角度X射线衍射技术(LXD),详细研究了其中典型的多层膜的调制周期性,各子层的厚度及界面平整度等界面微观结构
短句来源
     This paper introduces first the features of interfacial microstructures and failure modes of polymer composites. The progress of experimental study on the interfacial properties of particle-filled polymers and blended polymers,as well as the testing methods and results obtained for interfacial properties are reviewed. The testing methods from macro-tension to in-situ meso-tension are discussed,as well as the analytical methods from fractured surface micrographs to strength and energy calculation.
     本文首先介绍了高聚物复合材料界面微观结构的特点和界面破坏的微观形式,在此基础上,详细回顾了粒子填充高分子复合材料和共混高分子合金两类材料的界面力学性能实验研究的进展,总结了研究粒子/基体界面力学性能的实验方法和用这些方法获得的实验结果。
短句来源
  “界面微观结构”译为未确定词的双语例句
     Study on the effect of additive Nb on the interfacial Microstructine and Microtardness Ti/Al_2O_3 by Spark Plasma Sintering
     Nb对Ti/Al_2O_3界面微观结构与显微硬度的影响
短句来源
     Microstructure of double PTLP bonding Si_3N_4/Ti/Cu/Ni interface is Si_3N_4/ reaction layer / Cu-Ni solid solution(a small quantity of Cu-Ni-Ti)/Ni.
     S i3N4/Ti/Cu/N i二次PTLP连接界面微观结构为S i3N4/反应层/Cu-N i固溶体层(少量的Cu-N i-Ti)/N i。
短句来源
     Molecular Simulation on Microcosmic Interfacial Structure of CF/PPEK Comosites
     CF/PPEK复合材料界面微观结构的分子模拟
短句来源
     Investigation of kinetics associated with Si_3N_4/Ti/Cu/Ti/Si_3N_4 PTLP bonding process demonstrated that the growth of interface reaction layer obeyed the parabola law governed by the diffusion of participating elements.
     采用Ti/Cu/Ni/Cu/Ti中间层对Si_3N_4陶瓷进行二次PTLP连接,界面微观结构为Si_3N_4/反应层/Cu-Ni固溶体层(少量的Cu-Ni-Ti)/Ni;
短句来源
     STUDY ON SUBSTRUCTURE OF INTERFACE BETWEEN 40Cr MATRIX AND TiN FILM
     40Cr基体与TiN膜层界面微观结构研究
短句来源
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  interfacial microstructure
Interfacial microstructure of TiB/Ti in a Ti-TiB-TiC in situ composite
      
Interfacial Microstructure and Reaction Phases of Solid State Bonded at SiC/V Joints
      
Auger sputtering depth profile and Transmission Electron Microscopy (TEM) were used to analyze the interfacial microstructure.
      
By correlating the interfacial microstructure to the electronical properties, InxGa1-xAs phases with a large fractional area grown epitaxially on GaAs were found to be essential for reduction of the contact resistance.
      
Interfacial microstructure and reaction at the spin-coated fluorinated polyimide/Al interface: surface-enhanced X-ray diffract
      
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  interface microstructure
Investigations on the Interface Microstructure of Stainless Steel/Aluminum Joints Created by the Surface Activated Bonding Metho
      
Both transmission electron microscopy (TEM)and scanning electron microscopy (SEM) have been used to investigatethe interface microstructure of the as-bonded and annealed joints.
      
The interface microstructure of AlAs/GaAs quantum wells grown by molecular beam epitaxy (MBE) was investigated by transmission electron microscopy (TEM).
      
Interface microstructure in epitaxial YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox ramp-type Josephson junctions
      
On diffusion-controlled interface microstructure of vapor deposited bilayer thin film of Sn/Cu
      
更多          
  interfacial microstructures
The interfacial microstructures in CaTiO3/YBa2Cu3O7-x/SrTiO3/LaAlO3/CaRuO3 multilayers grown on (001) LaAlO3 substrates has been characterized using transmission electron microscopy in combination with scanning electron microscopy.
      
After low angle ion milling for a short time, many regions across several dielectric and electrode layers are electron transparent, which makes it possible to characterize the cofired interfacial microstructures.
      
The interaction phenomenon of solid iron with molten copper was studied by investigating the interfacial microstructures of Cu/Fe and Cu-Ag/Fe and the migration mechanism of molten copper and Cu-Ag alloy into the solid iron.
      
The interfacial microstructures and intermetallic compounds produced by plasma arc butt fusion welding of aluminium to mild steel have been investigated.
      
A lower or a higher joining temperature and a shorter or a longer holding time were disadvantageous for a stable and high reliable joined interface from the point of view of interfacial microstructures and morphologies.
      
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Scanning and Transmisson electron microscopic investigations were carried out on explosively cladded Ag/Cu system.Experimental results show that the“metallu- rgical bond”achieved in the cladding process consists of small equiaxed recryst- allized grains which form the center of the bond zones.It has also found that there are several regions within a bond zone,such as small equiaxed grains, elongated grains,dislocation cells and twinning networks.

用扫描电镜和剪切拉伸技术研究了爆炸复合材料波状界面的结合强度与波纹走向之间的关系,表明结合强度是各向同性的,与波纹走向无关。用扫描电镜和透射电镜技术研究了波状结合界面的微观结构。结果表明其界面是由等轴细晶粒区、拉长晶粒区、位胞区、孪晶区等组成的一个带状区。本文用固体中应力波传播理论解释了带状复合界面的形成机理。

The low resistance aluminium top ring armature called aluminium-steel bimetal composite material is mainly applied in the new type of electro-magnetic slip speed control motor.It canincrease the motor speed or decrease the slip frequency,increase the efficiency,decrease both ofvolume and weight of motor itself,and save the raw material for manufacturing motor.Consequently,It makes the speed control motor light duty,high speed and high efficiency.First the steel was immersed into the liquid aluminium bath,after...

The low resistance aluminium top ring armature called aluminium-steel bimetal composite material is mainly applied in the new type of electro-magnetic slip speed control motor.It canincrease the motor speed or decrease the slip frequency,increase the efficiency,decrease both ofvolume and weight of motor itself,and save the raw material for manufacturing motor.Consequently,It makes the speed control motor light duty,high speed and high efficiency.First the steel was immersed into the liquid aluminium bath,after the surface of steel waspenetrated with aluminium,put it into the metallic mould,then pour pure liquid aluminium on thepenetrated surface,thus the aluminium and steel would be made metallurgical Combining.Thistechnology is reliable and the combining is secure.The effects of penetrating temperature and time on the combining strength have been investigated,and the microstructures in the interface are also examined by using optical microscope,SEM andelectron microprobe.In this work,the combining trength can reach 2.gkg/mm~(?)and the τ_(m?)is about 6.6kg/mm~2。The combining process of aluminium and steel obeys the laws of reacting diffusion.The structureof reacting diffusion layer is metallic compound Fe_2Al,.The silicon obstructs the diffusion betweniron and aluminlum The surface of steel electroplated with copper,chromium,or nickel has littleinfluence on the combining strength between aluminium and steel.

铝、钢双金属复合材料低电阻铝端环电枢用于新型滑差电磁调速电机,可使其转速增加,效率提高,电机体积缩小,自重减轻,材料节省,达到高速、轻型、高效率。采用钢基表面热渗铝后浇注纯铝的方法使铝、钢熔合,工艺可靠,结合牢固,研究了渗铝温度和时间对铝、钢结合强度的影响,本试验中的主要强度指标已达到:σ_b~2.5Kg/mm~2,τ_(max)~6.6kg/mm~2。用光学显微镜,扫描电镜和电子探针观察和检验了熔合界面的微观结构。铝、钢熔合过程符合反应扩散的规律。反应扩散层为金属间化合物Fe_2Al_2。硅对铁和铝之问的扩散有阻碍作用,钢基表面电镀元素Cu、Cr 和Ni 对铝、钢的结合强度的影响不明显。

The breakdown characteristics of very thin nitrided silicon oxide film have teen exammed. The breakdown mechanism of this film and the factors affecting the breakdown characteristics have been explored. It has been found that the improvement of breakdown properties of this nitrided oxide depended greatly on the changes of the microstructure of the film and interface, as well as the composition of the film. The narrowing of the band gap width of the film after nitridation makes the electric field for intrinsic...

The breakdown characteristics of very thin nitrided silicon oxide film have teen exammed. The breakdown mechanism of this film and the factors affecting the breakdown characteristics have been explored. It has been found that the improvement of breakdown properties of this nitrided oxide depended greatly on the changes of the microstructure of the film and interface, as well as the composition of the film. The narrowing of the band gap width of the film after nitridation makes the electric field for intrinsic breakdown decrease, but the occurrence of breadown may be greatly postponed by the dense material, the smoothed interface and the effect of traps. Experimental evidences confirmed that the im-pact-ionization exists in the intrinsic type of breakdown, but the permanent breakdown is caused by the heat transfer for all cases.

本文在研究极薄Si_xO_yN_x膜击穿特性的基础上,探讨了氮化SiO_2膜的击穿机构,讨论了氮化影响击穿性能的因素。实验结果与理论分析表明,氮化后的SiO_2膜击穿性能的改善主要决定于膜中及表界面的微观结构的改善及成分的改变。虽然,氮化引起介质膜带隙宽度的变窄将导致击穿电场的下降,但致密的材料结构、变得平整的表界面及陷阱的影响将大大推迟击穿的发生。实验结果表明,氮化SiO_2膜的本征型击穿仍是由碰撞电离引起的;但是,在任何情况下,引起破坏性的永久击穿的原因仍是热传递。

 
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