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切屑体积
相关语句
  chip volume
     Amorphous phase transformation, chip volume change, no dislocations and no elastic recovery in silicon were observed by analyses of chip and machined surface , energy and cutting forces, but these were not so for aluminum.
     通过对切削过程中切屑和加工表面、能量和切削力的分析,发现硅发生非晶态相位变换和切屑体积改变,但没有位错和弹性恢复产生;
短句来源
     Amorphous phase transformation,chip volume change, no dislocations and no elastic recovery in silicon were observed by analyses of chip and machined surface, energy and cutting forces, but these were not so for aluminum.
     通过对切削过程中切屑和加工表面、能量和切削力的分析,发现硅发生非晶态相位变换和切屑体积改变,但没有位错和弹性恢复产生; 而铝发生的现象却与硅相反.
短句来源
  相似匹配句对
     Chip Control
     切屑控制
短句来源
     Get Volume Cleverly
     巧求体积
短句来源
     OMNIPOTENT VOLUME FORMULA
     万能体积公式
短句来源
     Computer Simulation for Serrated Chip Formation
     锯齿形切屑的计算机仿真
短句来源
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  chip volume
Also, there is an instantaneous increase in the chip volume and the resultant forces acting on the cutting tool.
      
Optimum tool path maintains uniform cutting force with constant chip volume.
      


A threedimensional model of molecular dynamics (MD) was employed to study the nanometric cutting mechanism of monocrystalline silicon. The model included the utilization of the Morse potential function to simulate the interatomic force between the workpiece and a tool, and the Tersoff potential function between silicon atoms. By analyses of nanometric cutting process, energy and cutting forces, amorphous phase transformation and chip volume change are observed,but dislocations and elastic recovery behind the...

A threedimensional model of molecular dynamics (MD) was employed to study the nanometric cutting mechanism of monocrystalline silicon. The model included the utilization of the Morse potential function to simulate the interatomic force between the workpiece and a tool, and the Tersoff potential function between silicon atoms. By analyses of nanometric cutting process, energy and cutting forces, amorphous phase transformation and chip volume change are observed,but dislocations and elastic recovery behind the tool do not appear. Cutting forces initiate the amorphous phase transformation, and thrust forces play an important role in driving the further transformation development. Nanometric cutting mechanism of monocrystalline silicon is not the plastic deformation produced by the generation and propagation of dislocations, but the deformation via amorphous phase transformation.

采用分子动力学三维模型研究单晶硅纳米切削机理,工件原子间相互作用力和工件与刀具原子间相互作用力分别采用Tersoff势和Morse势计算。通过切削过程中瞬间原子图像、能量和切削力的分析,发现在整个切削过程中,发生了非晶态相位的变换和切屑体积的改变,但没有明显的位错和弹性恢复产生。其中切削力的一个分力切向力在非晶态相位变换形成时起主要作用,另一分力轴向力是非晶态扩展的主要因素。单晶硅纳米切削机理不是位错在晶体中运动产生的塑性变形,而是非晶态相位变换产生的变形。

A three - dimensional model oi molecular dynamics ( MD) was employed to study the nanometnc cutting processes for monocrystalline silicon and aluminm. The model included the utilization of the Tersoff potential function to simulate the interatomic force between silicon atoms, and the Morse potential function between the workpiece and a tool and between aluminum atoms. Amorphous phase transformation, chip volume change, no dislocations and no elastic recovery in silicon were observed by analyses of chip and machined...

A three - dimensional model oi molecular dynamics ( MD) was employed to study the nanometnc cutting processes for monocrystalline silicon and aluminm. The model included the utilization of the Tersoff potential function to simulate the interatomic force between silicon atoms, and the Morse potential function between the workpiece and a tool and between aluminum atoms. Amorphous phase transformation, chip volume change, no dislocations and no elastic recovery in silicon were observed by analyses of chip and machined surface , energy and cutting forces, but these were not so for aluminum. Nanometric cutting mechanism of mono-crystalline aluminum is the plastic deformation involving the generation and propagation of dislocations, and silicon deformation via amorphous phase transformation.

采用分子动力学模拟方法进行了单晶硅和单晶铝纳米切削过程的比较研究,硅原子间相互作用力采用Tersoff势计算,铝原子间和工件与刀具原子间相互作用力采用Morse势计算。通过对切削过程中切屑和加工表面、能量和切削力的分析,发现硅发生非晶态相位变换和切屑体积改变,但没有位错和弹性恢复产生;而铝发生的现象却与硅相反。

A three-dimensional model of molecular dynamics (MD) is employed to study the nanometric cutting process of monocrystalline copper. The model includes the utilization of the Morse potential function to simulate the interatomic force between the workpiece and a tool. By analysises of nanometric cutting process, cutting forces, cutting force per unit volume and the ratio of the thrust force to the cutting force, dislocations and elastic recovery behind the tool are observed, but chip volume changes do not appear,...

A three-dimensional model of molecular dynamics (MD) is employed to study the nanometric cutting process of monocrystalline copper. The model includes the utilization of the Morse potential function to simulate the interatomic force between the workpiece and a tool. By analysises of nanometric cutting process, cutting forces, cutting force per unit volume and the ratio of the thrust force to the cutting force, dislocations and elastic recovery behind the tool are observed, but chip volume changes do not appear, and the material removal occurs by the cluster.The cutting force per unit volume and the ratio of the thrust force to the cutting force in nanometric cutting are larger than conventional cutting. Nanometric cutting process of monocrystalline copper is the plastic deformation involving the generation and propagation of dislocations.

采用分子动力学三维模型研究单晶铜纳米切削过程 ,工件原子间相互作用力和工件与刀具原子间相互作用力采用Morse势计算 .通过分析切削过程中瞬间原子图像、切削力、单位切削力和轴向切削力与切向切削力比值 ,发现在整个切削过程中有位错产生 ,在加工表面发生弹性恢复 ,但未发生切屑体积的改变 ,切屑以原子团方式去除 ,单位切削力和轴向切削力与切向切削力的比值比传统切削时大得多 .单晶铜纳米切削过程是位错在晶体中运动产生的塑性变形

 
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