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回复温度
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  recovery temperature
     NT-PC contained Ni 50. 8-51. 8 at% with shape recovery temperature at 30 ± 2℃ consists of 1-2 base claws,2 - 3 apes claws and a waist part.
     NT—PC含Ni50.3~51.8at%,具有1~2、2~3个髌底、髌尖枝钩和1个腰部,回复温度30±2℃.
短句来源
     The influences of such factors as PA6 content and polymerization degree, deformation stretch and recovery temperature, recovery times on the shape memory function were studied.
     研究了PA6含量与聚合度、形变拉伸温度与形变回复温度及回复次数等因素对形状记忆功能的影响。
短句来源
     The shape recovery temperature of SMPU extended by FA and HD is lower than that of others,whereas the fixity of HD and DE extended SMPU is good,at the same time,the FA and DE extended SMPU shows excellent cycle using properties.
     FA、HD的SMPU具有较低的形状回复温度和较快的形状回复速率,HD、DE扩链的则具有较好形状固定性能,FA、DE扩链的SMPU循环使用性能较好;
短句来源
     The recovery temperature range of vacancies is 73-260℃; the annealing of dislocations and vacancy clusters occur in the range of 350-670℃.
     单空位的回复温度范围为73—260℃,位错和空位团的退火发生在350—670℃温度范围。
短句来源
     The result showed that the shape recovery rate was maximum when recovery temperature ranged from 80℃ to 100℃. The shape recovery increased with the increase of PA6 contents, and decreased with the increase of recovery times.
     结果表明,形状回复率随着PA6含量的增加而上升,在形变回复温度为80~100℃时达到最大值(大于 95% ),并随着回复次数的增多而显著下降。
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  “回复温度”译为未确定词的双语例句
     Comparing to the liner shape memory polyurethane, The shape recovering temperature of the crosslinked polyurethane was randomly controlled and the crosslinked polyurethane has completely shape memory behavior.
     深入探讨了交联型形状记忆聚氨酯的结构对其形状记忆性能和其它性能的影响,通过与线型聚氨酯的比较,发现交联型聚氨酯具有形状回复温度可以任意调节以及可完全回复形状的特点。
短句来源
     The kinetic equation of the DO_3 process can beexpressed as S=101·T·exp(-Q/RT)·t,where Q is the activation energyabout 12,6kcal/mol(53kJ/mol).
     关系,Q 为 DO_3有序过程的激活能,约为12.6kcal/mol(53kJ/mol)。 形状回复温度 T(?)
短句来源
     By rewarming(37℃)cells within 15—30 minutes,thisstructural changes of keratin filaments inPcaSE-1 cells and BEL-7404 cells are rea-dily reversed.
     当回复温度到37℃15—30 min 时,PcaSE-1 和BEL-7404细胞的这种结构转化能快速回复。
短句来源
     Thermostimulative Shape Memory Polymer Materials have the advantages of large deformation,light mass,rich variety,good processability,convenient to deform and easy regulate shape memory temperature.
     热感性型形状记忆高分子材料(thermostimulative shape memory polymer,TSMP)不仅具有形变量大、赋形容易,形状回复温度便于调节、加工方便等特点,而且种类丰富。
短句来源
     The properties of polyurethane were studied, including calorifics, dynamic mechanism and shape memory.
     最后,从形状记忆聚氨酯的形状记忆原理出发,合成了一种可调节形状回复温度并可完全回复形状的新型交联型形状记忆聚氨酯,在合成交联型形状记忆聚氨酯的基础上,详细研究了它的热学性能、动态力学性能、形状记忆性能。
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  相似匹配句对
     T is temperature, ℃.
     T为温度,℃。
短句来源
     The suitable recovery strain anealing temperature was 500℃.
     适宜的回复应变退火温度为500℃。
短句来源
     When heat treatment temperature is rising, the recovery strain is increasing
     随热处理温度升高,回复应变增加。
短句来源
     temperature 20 ℃;
     温度常温;
短句来源
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  recovery temperature
The 50% compressed PLA-PUs could recover almost 100% to their original shape within 10°C from the lowest recovery temperature (22°C-37°C).
      
At either recovery temperature, cells which had been cultured before irradiation at 37°C are able to sustain less uv damage prior to inactivation than those cultured at 25°C.
      
Evidence of this was observed in 1940 by low values of the recovery temperature on the downstream side of a cylinder normal to a high velocity air stream.
      
In the first case, the detection of recovery temperature is circumvented; in the second case, pressure distribution of higher resolution is attained in regions of unfavorable wall geometry.
      
In the ternary alloys, the recovery temperature was found to be dependent essentially on the tin content, with bismuth virtually having no effect.
      
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A theoretical model concerning the interaction between a very little amount of alloy additions and crystal defects during recovery and recrystallization in Cu has been given. Alloy atoms reactive with point defects result in stable atom groups which may hinder the polygonization and recovery. Alloy atoms meeting the dislocations give "atomsphere" just like the Cottrell atomsphere, which will offer a larger resistance against the thermo-activated glide of dislocations, thus raising the recrystallization temperatures....

A theoretical model concerning the interaction between a very little amount of alloy additions and crystal defects during recovery and recrystallization in Cu has been given. Alloy atoms reactive with point defects result in stable atom groups which may hinder the polygonization and recovery. Alloy atoms meeting the dislocations give "atomsphere" just like the Cottrell atomsphere, which will offer a larger resistance against the thermo-activated glide of dislocations, thus raising the recrystallization temperatures. Theoretical results obtained are in good agreement with the experiment.

提出了一个Cu中回复再结晶过程中微量杂质与晶体缺陷的相互作用的理论模型。杂质原子和点缺陷形成稳定的集团,杂质原子富集在位错线上起钉扎作用。据此计算了回复温度、形变合金电阻率、形变层错率、位错密度以及再结晶开始温度。理论结果和实验符合得较好。

Elnectrical properties and radiation defect annealing behavior of NTD Si grown by floating zone method in hydrogen atmosphere were studied by Hall coefficient-resistivity measurements, minority carrier lifetime measurements and deep level transient spectroscopy (DLTS). The neutron doping was performed at temperature~30℃ and~200℃ separately in our swimming pool type research reactor,the Cd-ratio is~10. The concentration of transmuted ~(81)p is~6x10~(13) atoms cm~(-3). One hour isochronal annealing from 400℃ to...

Elnectrical properties and radiation defect annealing behavior of NTD Si grown by floating zone method in hydrogen atmosphere were studied by Hall coefficient-resistivity measurements, minority carrier lifetime measurements and deep level transient spectroscopy (DLTS). The neutron doping was performed at temperature~30℃ and~200℃ separately in our swimming pool type research reactor,the Cd-ratio is~10. The concentration of transmuted ~(81)p is~6x10~(13) atoms cm~(-3). One hour isochronal annealing from 400℃ to 1200℃ was carried out in a quartz-tube furnace with high pure nitrogen atmosphere. In this paper the isochronal annealing results of free carrier conceutration, mobility and DLTS measurements were given, and, the energy level, capture section and concetration of deep level defects remaining were calculated. Preliminary experimental results indicate that because of existence of hydrogen this NTD Si exhibits some obvious characters. For example, the temperature of P→N type transformation and recovery temperature of carrier concentration and mobility is lower than those of the samples grown in argon atmosphere. After annealing at~450℃ an excess donor concentration and a high concentration of DLTS defects have been observed. At higher doping temperature the concentrations of above mentioned donor and DLTS defects are higher, and, the mobility and minority carrier lifetime are lower than those at lower temperature. The isochronal annealing curves of free carrier concentration and mobility have a greater waving when annealing temperatare is lower than 850℃. The results also indicate that annealing behavior of deep level defects has a good agreement with the changes of lifetime and carrier mobility. It is pointed out that after annealing for one hour at 800~850℃ the radiation defects in this NTD Si can be removed, electrical properties can be recovered. The experimental results have been discussed briefly.

用霍尔系数——电阻率测量、少子寿命测量和深能級瞬态谱(DLTS)测量研究了中子掺杂氢气氛区熔单晶硅的电学性能和輻照缺陷的高溫退火行为。给出了自由载流子浓度和迁移率的等时退火曲綫和DLTS等时退火譜,計算了DLTS譜峯相应的缺陷能級、俘获截面和浓度。初步结果表明,由于氢的存在,这种NTD Si退火时有一些显著特点,如P→N轉型温度低,自由载流子浓度和迁移率回复溫度較低,在~450℃时存在着浓度很大的过量施主和DLTS缺陷。結果还表明,DLTS缺陷的退火行为与寿命和迁移率的变化间有較好的对应性,800—850℃,1小时退火能够基本消除这种NTD Si中的輻照缺陷,使电学性能回复。

A kinetic and thermodynamic analysis of B_2→DO_3 ordering process ina Cu-25.83Zn-3.96Al(wt-%)alloy has been made.It is shown that the shaperecovery rate η,which is directly correlated with the ordering degree S,increases near linearly with the holding time at,the fixed temperature beforereaching its maximum value.The kinetic equation of the DO_3 process can beexpressed as S=101·T·exp(-Q/RT)·t,where Q is the activation energyabout 12,6kcal/mol(53kJ/mol).The shape recovery temperatiure T_s decreaseswith the holding...

A kinetic and thermodynamic analysis of B_2→DO_3 ordering process ina Cu-25.83Zn-3.96Al(wt-%)alloy has been made.It is shown that the shaperecovery rate η,which is directly correlated with the ordering degree S,increases near linearly with the holding time at,the fixed temperature beforereaching its maximum value.The kinetic equation of the DO_3 process can beexpressed as S=101·T·exp(-Q/RT)·t,where Q is the activation energyabout 12,6kcal/mol(53kJ/mol).The shape recovery temperatiure T_s decreaseswith the holding time,and the relationship between T_s and ordering degreeS deducted as T_s=(A+BS~2)/(1+CS~2)and T_s(K)=384·(1+106S~2)/(1+122.8S~2)when the experimental data put into.

对 Cu-25.83 Zn-3.96Al(wt-%)形状记忆合金在分级淬火时发生的 B_2→DO_3,有序转变过程进行了初步的动力学和热力学分析。结果表明在一定温度下,有序度 S 随分级等温时间的增加几乎呈线性地上升,满足 S=101T·exp(—Q/RT)·t(?)关系,Q 为 DO_3有序过程的激活能,约为12.6kcal/mol(53kJ/mol)。形状回复温度 T(?)则随等温时间增加而降低,并与 S 有以下关系:T:=A+BS~2/1+CS~2,由实验数据回归,可得 T(?)(K)=348(1+106S~2/1+122.8S~2

 
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