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   连接温度 的翻译结果: 查询用时:0.032秒
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连接温度
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  bonding temperature
     The shear strength was 103 MPa when directly diffusion bonding with bonding temperature T =1 223 K,bonding time t =1.8 ks and bonding pressure p =80 MPa,and the shear strength was 110 MPa by using Ni layer with T = 1 223 K, t =1.8 ks and p =80 MPa.
     直接扩散连接时 ,连接温度T =12 2 3K ,时间t=1.8ks,压力p =80MPa时接头强度为 10 3MPa ; 采用Ni为中间层时 ,连接温度T =12 73K ,时间t=1.8ks,压力p =80MPa时接头强度为 110MPa。
短句来源
     The effects of bonding temperature and bonding time on the microstructure and mechanical property of diffusion bonded aluminium-based metal matrix composite Al_2O_(3P)/6061Al joint with Ni interlayer have been investigated.
     采用纯金属Ni作中间层扩散连接氧化铝颗粒增强铝基复合材料(Al2O3P/6061Al),探究了连接温度和保温时间对接头显微结构与力学性能的影响。
短句来源
     When bonding temperature and time was not changed and the process of isothermal solidification was carried completely,interface structure, reaction layer thickness and isothermal solidification thickness were changed with the change of Ti foil thickness.
     PTLP连接时,当连接温度和时间不变,且连接时间能保证等温凝固过程充分进行的条件下,Si3N4/Ti/Cu/Ti/Si3N4连接界面结构、反应层厚度、等温凝固层厚度随着Ti箔厚度改变而改变。
短句来源
     The results showed that the bonding strength at room temperature increases with second bonding temperature and second holding time, and bonding parameters have slight influence on thickness of reaction layer in Si3N4/Ti/Cu/Ni interface of double PTLP bonding.
     结果表明,在该试验条件下,室温连接强度随着二次连接温度的提高和二次保温时间的延长而提高,改变连接工艺参数对Si3N4/Ti/Cu/Ni二次PTLP连接界面反应层厚度无明显影响;
短句来源
     Under conditions of bonding temperature 825℃, pulse pressure 8~50MPa, pulse pressuring cycles 30 cycles, frequency 0.5Hz, preserved temperature for 0s before pulsing and 120s after pulsing.
     得到了优化的工艺条件为:连接温度T=825℃、脉冲压力P=8~50MPa、脉冲次数N=30次、脉冲频率f=0.5Hz、脉冲前保温时间t1=0s、脉冲后保温时间t2=120s,在此工艺下得到的接头强度达到321MPa,连接用时仅为180s。
短句来源
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  joining temperature
     The joining temperature of 1360℃, holding time of 5 min and filler mass of 350 mg are a set of optimum technological parameters ,under which the maximum bending strength of joints, 74.2 MPa, is achieved.
     在本试验中,当连接温度为1360℃,保温时间为5min,焊料量为350mg时得到的接头三点抗弯强度最高,为74.2MPa。
短句来源
     To the brazing filler CuP, the optimum parameters are joining temperature T=1223K, joining time t=5min, and the maximum shear strength is 98.6MPa.
     对于CuP钎料, 当连接温度为1 223 K, 连接时间为5 min时, 接头的最高剪切强度为 98 6 MPa; 采用 TiZrNiCu
短句来源
     To the brazing filler AgCuZn, the optimum parameters are joining temperature T=(1173K), joining time t=5min, and the maximum shear strength is 125.4MPa.
     对于AgCuZn钎料,当连接温度为1 173 K, 连接时间为5 min时, 接头的最高剪切强度为125 4 MPa;
短句来源
     The analysis also indicates that using brazing filler NiCrSiB, the optimum brazing parameters for the joint are joining temperature T=1373K, joining time t=5min, and the maximum shear strength is 219.6MPa.
     对于NiCrSiB钎料, 当连接温度为1 373 K, 连接时间为5 min时, 接头的剪切强度最高为219 6 MPa;
短句来源
     Results showed joints of laminated C/SiC composite and Nb had been disjoined during the joints were cooled from the joining temperature to room temperature.
     结果表明二维C/SiC复合材料与金属Nb不能得到较好的连接,整个连接件在由连接温度降温到室温过程中已发生脱离现象;
短句来源
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  “连接温度”译为未确定词的双语例句
     2. TP304H: Bond made at 1220℃ for 4min under 6MPa with BNi2 interlayer ;
     2.TP304H:连接温度1220℃,中间层为BNiZ,等温时间4分钟,压力6MPa。
短句来源
     The interface structure of one side was TiAl/AlCuTi/AlCu_2Ti/Ag-based solid solution/AlCu_2Ti/TiCu/Ti_2Cu(symmetrical structure). The AlCu_2Ti/TiCu/Ti_2Cu structure in the center of the joint changed to evenly distributed AlCu_2Ti phase with the brazing temperature increased.
     此时界面一侧结构为TiAl/AlCuTi/AlCu_2Ti/Ag基固溶体/ AlCu2Ti/TiCu/Ti_2Cu(对称结构),随着连接温度的升高,接头中心的AlCu_2Ti/TiCu/Ti_2Cu组织转变为弥散分布的AlCu_2Ti相。
短句来源
     When the heating temperature was increased, Ti2Ni and Ti(Cu,Al)2 increased and Ti[s,s] decreased.
     随着连接温度的增加,Ti2Ni和Ti(Cu,Al)2增加,Ti基固溶体减少;
短句来源
     For the joint bonded at 630℃/5min-120min,shear strength is 93-97MPa and fracture occurs at alumina particle segregation region.
     连接温度630℃、保温时间5~120min条件下,接头抗剪强度93~97MPa,断裂于增强相偏聚区。
短句来源
     The joints with shear strength higher than 100 MPa could be achieved by brazing with Ag-Cu-Ti at the temperature of 825-875 ℃ and the holding time of 15-20 min.
     用Ag-Cu-Ti钎料钎焊高纯氧化铝陶瓷与金属钛,钎焊温度为825~875℃,保温时间为15~20 min,陶瓷表面为烧结自然表面时,钎焊接头抗剪强度可达到100 MPa以上,连接温度过低或过高,保温时间过短或过长均对接头强度不利。
短句来源
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  bonding temperature
The peel strength of fusion bonded layers of PP/AA-g-PP blends with PA 6 strongly depends on bonding temperature and time, as well as on the molecular weight of the functionalized polymer.
      
The adhesion strength between PE and PET films increased with increasing bonding temperature, bonding time and elastomer concentration.
      
The results show that the bonding strength is the greatest when the bonding temperature is 830 °C, holding time is 3 min and the reduction rate is 9%.
      
At the bonding temperature of 1373 K the cubic Cr23C6phase formed next to Cr, and the hexagonal Cr7C3 phase formed next to SiC.
      
A better understanding about the decisive parameters in anodic bonding was obtained by varying the bonding temperature and the thickness of the gold layer.
      
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  joining temperature
Upon increasing the joining temperature beyond 1573 K all the chromium was consumed, and Cr23C6 and Cr3SiCx dissolved.
      
The deposition temperature has to be lower than the later joining temperature and lower than the melting points of the solder materials.
      
The joining strength was increased with increases in joining temperature, joining pressure and holding time.
      
A lower or a higher joining temperature and a shorter or a longer holding time were disadvantageous for a stable and high reliable joined interface from the point of view of interfacial microstructures and morphologies.
      
A higher bonding strength and lower joining temperature were obtained with titanium coating compared to that for the non-coated sample.
      
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Silicon nitride and low carbon steel can be well bonded with an aluminum alloy inter layer using proper bonding processes and parameters in Thermorestor-W weld thermal simulator. At the bonding temperature, the aluminum alloy enters the porosities in silicon nitride to make a mechanical bonding, the main mechanism of bonding being the forming of aluminum nitride. When the bonding temperature exceeds 530"C ,the thickness of Al,Si diffusion layer changes a little as the temperture increses. The shear strength...

Silicon nitride and low carbon steel can be well bonded with an aluminum alloy inter layer using proper bonding processes and parameters in Thermorestor-W weld thermal simulator. At the bonding temperature, the aluminum alloy enters the porosities in silicon nitride to make a mechanical bonding, the main mechanism of bonding being the forming of aluminum nitride. When the bonding temperature exceeds 530"C ,the thickness of Al,Si diffusion layer changes a little as the temperture increses. The shear strength of the bond depends upon that of the aluminum/steel interface and increases as the temperature rises.

利用Thermorestor-W焊接热模拟试验机,采用适当的焊接参数和工艺,能够用铝合金中间层固相扩散连接Si_3N_4和低碳钢。在连接温度下,铝合金Si_3N_4进入孔洞中形成机械连接,而铝合金与Si_3N_4连接的主要机理是铝与Si_3N_4发生固相反应生成AlN。当温度大于530℃时,铝合金/Si_3N_4界面Al,Si扩散层厚度基本上不随温度升高而变化。Si_3N_4/铝合金/低碳钢接头的剪切强度取决于铝合金/钢界面强度,且随扩散连接温度上升而增加。

he technology of the HIP diffusion bonding of YG 15C cemented carbide to 45# carbon steel has been studied. The effects of bonding temperature. pressure time.interlayer and its thickness. residual thermal stress on bonding strength have been researched. The results show that: In the HIP diffusion bonding of YG 15C to 45# carbon steel, the bonding strength depends on bonding temperature strongly and is controlled by the residual thermal stress d ne to the therm al expansion mismatch after honding. By using N...

he technology of the HIP diffusion bonding of YG 15C cemented carbide to 45# carbon steel has been studied. The effects of bonding temperature. pressure time.interlayer and its thickness. residual thermal stress on bonding strength have been researched. The results show that: In the HIP diffusion bonding of YG 15C to 45# carbon steel, the bonding strength depends on bonding temperature strongly and is controlled by the residual thermal stress d ne to the therm al expansion mismatch after honding. By using N i asinterlayer, the effect of residual thermal stress on bonding can be diminished effectively sothat the bonding strength can be improved apparently.

研究了硬质合金YG15C与45~#碳钢的热等静压扩散连接工艺,探讨厂连接温度、压力、保温保压时间、中间夹层及其厚度和连接残余热应力等对接合强度的影响.结果表明:热等静压扩散连接强度强烈依赖于连接温度,受控于连接后因YG15C与45~#钢热膨胀失配而产生的残余热应力。采用镍箔作中间夹层可有效地减小残余热应力对连接的影响,显著提高接合强度.

Silicon nitride and low carbon steel can be well bonded with an aluminum alloy interlayer u#ing proper bonding processes and parameters in Thermorestor-W weld thermal simulator. At the bonding temperature,the aluminum alloy enters the porosities in silicon nitride to make a mechanical bonding,the main mechanism of bonding being the forming of aluminum nitride. When the bonding temperature exceeds 530C,the thickness of Al,Si diffusion layer changes a little as the temperature increases.The shear strength of...

Silicon nitride and low carbon steel can be well bonded with an aluminum alloy interlayer u#ing proper bonding processes and parameters in Thermorestor-W weld thermal simulator. At the bonding temperature,the aluminum alloy enters the porosities in silicon nitride to make a mechanical bonding,the main mechanism of bonding being the forming of aluminum nitride. When the bonding temperature exceeds 530C,the thickness of Al,Si diffusion layer changes a little as the temperature increases.The shear strength of the bond depends upon that of the aluminum/steel interface and increases as the temperature rises.

利用Thermorestor-W焊接热模拟试验机,采用适当的焊接参数和工艺,能够用铝合金中间层固相扩散连接Si3N4和低碳钢。在连接温度下,铝合金进入Si3N4孔洞中形成机械连接,而铝合金与Si3N4连接的主要机理是铝与Si3N4发生固相反应生成AlN。当温度大于530℃时,铝合金/Si3N4界面Al、Si扩散层厚度基本上不随温度升高而变化。Si3N4/铝合金/低碳钢接头的剪切强度取决于铝合金/钢界面强度,且随扩散连接温度上升而增加。

 
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