 全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多   对偶积分方程组 的翻译结果: 查询用时：0.449秒 在分类学科中查询 所有学科 数学 更多类别查询 历史查询  对偶积分方程组  dual integral equations
 A Method of Solving a Kind on Dual Integral Equations Via Decoupling Into Canonical Cauchy Singular Integral Equations 一类对偶积分方程组正则化为Cauchy奇异积分方程组解法 短句来源 Based on method of Mellin transform, the dual integral equations of complex and more general form is solved. 本文基于Mellin变换法求解复杂更一般形式的对偶积分方程组. 短句来源 Based on the method of Titchmarsh  and Busbridge  for solving dual integral equations, improvement and generalization are made for solving complex and more general form of the equations. 基于 Titchmarsh和 Busbridge求解对偶积分方程的解法 ,进行研究改进和推广 ,应用于更一般形式的复杂对偶积分方程组的求解 . 短句来源 Based on Copson method, the dual integral equations of more general form is solved. 将 Copson法推广、应用于一般形式的对偶积分方程组的求解 . 短句来源 The method presented here for solving complex dual integral equations provides a reference for solving the problems of mixed boundary values in mathematics,physics and engineering mechanics. 本文提供的求解复杂对偶积分方程组的方法 ,可供求解复杂的数学、物理、工程力学中的混合边值问题的参考 . 短句来源 更多 “对偶积分方程组”译为未确定词的双语例句
 ON A FORMAL SOLUTION OF DUAL INTEGRAL EQUATION SYSTEM IN MEASUREMENT OF SEMICONDUCTORS 半导体电磁测量中一个对偶积分方程组的形式解 短句来源 The Solution of a Dual Integral Equation System with the Method of Gaussian Integration Gauss权重法求解半导体电磁测量中的一个对偶积分方程组 短句来源 In this paper a dual integral equation system in the measurement of semiconductors is suggested. 本文提出一个半导体测量中对偶积分方程组,经适当的积分变换,实现其退耦; 短句来源 Using Abel anti transformation, the equations are further reduced to the second kind of Fredholm canonical integral equations. 应用 Abel反演变换 ,使方程组正则化为 Fredholm第二类积分方程组 ,并由此给出对偶积分方程组的一般性解 . 短句来源 相似匹配句对
 Theoretical Solutions of General Dual Integral Equations with Trigonometric Functions 含三角函数的一般形式对偶积分方程组的理论解 短句来源 S-Integral S积分 短句来源 THEORETICAL SOLUTIONS OF COMPLEX DUAL INTEGRAL EQUATIONS ON THE MORE GENERAL FORM WITH TRIGONOMETRIC FUNCTION 含三角函数的一般形式复杂对偶积分方程组的理论解 短句来源 Orthogonal Polynomial Solving Method of General Singular Dual Integral Equations 一般形式的奇异对偶积分方程组正交多项式求解法 短句来源 ON A FORMAL SOLUTION OF DUAL INTEGRAL EQUATION SYSTEM IN MEASUREMENT OF SEMICONDUCTORS 半导体电磁测量中一个对偶积分方程组的形式解 短句来源 查询“对偶积分方程组”译词为用户自定义的双语例句

我想查看译文中含有：的双语例句  dual integral equations
 By use of the Fourier transform, the problem can be solved with the help of a pair of dual integral equations, in which the unknown variable was the displacement on the crack surfaces. To solve the dual integral equations, the displacement on the crack surfaces was expanded in a series of Jacobi polynomials. Through the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations, in which the unknown variables were the jumps of the displacements across the crack surfaces. To solve the dual integral equations, the jumps of the displacements across the crack surfaces were expanded in a series of Jacobi polynomials. This problem is reduced by means of Fourier transforms to the standard set of dual integral equations with two variables. 更多 For a strip wall erected on a rigid strip foundation and supported on the surface of the ground, the dynamic soil-structure interaction under the action of the horizontal ground motion is investigated. The ground motion is idealized as vertically propagating, horizontal steady-state motion. Because the horizontal ground motion brings about the sliding vibration of the foundation as well as the rocking vibration, the coupled rocking and sliding vibration of the soil-structure system is considered in the present... For a strip wall erected on a rigid strip foundation and supported on the surface of the ground, the dynamic soil-structure interaction under the action of the horizontal ground motion is investigated. The ground motion is idealized as vertically propagating, horizontal steady-state motion. Because the horizontal ground motion brings about the sliding vibration of the foundation as well as the rocking vibration, the coupled rocking and sliding vibration of the soil-structure system is considered in the present paper. For the contact between the ground and foundation, the following assumptions are made:1)the contact is assumed to be welded, that is to say, the motion of the foundation is consistent with the ground; 2) the horizontal translation at each point on the bottom surface of the foundation is equal to a constant; 3) the distribution of the normal displacements under the foundation remains to be linear in the rocking vibration. For comparison, the case of uncoupled vibration is considered also. The use of Fourier transform method yields dual integral equations (for the case without coupled effect) or simultaneous dual integral equations (for the case with coupled effect)). Both of them are solved by means of infinite series of orthogonal functions, the Jacobi polynomials. The numerical results show that there is significant difference between the displacements of the foundation, the relative disp acements of the top of the wall with respect to its base, and the distribution of contact stresses beneath the foundation, for the cases with and without coupled effect. 本文研究了在水平地面运动情况下,墙——刚性条形基础——地基系统的动力相互作用问题.文中考虑了土——结构物系统摆动和移动的耦联振动.对于地基与基础间的接触,作了如下一些假定:1)接触是焊固的,即基础的运动与地面运动相一致;2)基础底面上各点的水平位移是一常数;3)在摆动中,基础垂直位移的分布保持为一直线.为了比较起见,同样研究了非耦联情形.利用富里叶变换,问题归结为对偶积分方程(对于无耦联情形)和对偶积分方程组(对于耦联情形).借助于雅可比多项式的无限级数对此二种方程进行求解.数值结果表明,对于存在和不存在耦联影响,基础位移、墙顶对其底部的相对位移、基础底面的接触应力分布等等之间,存在着相当大的差异. In this paper a dual integral equation system in the measurement of semiconductors is suggested. The system is decoupled to be an equation of double integral by an integral transformation.According to Schlomilch theorem, the 2-dimensional problem is reduced to be a one dimensional Fredholm equation. An exact formal solution is obtained and a criterion is suggested to prove the uniqueness of the formal solution. In addition, the relation between the current and transformation function and explicit expression... In this paper a dual integral equation system in the measurement of semiconductors is suggested. The system is decoupled to be an equation of double integral by an integral transformation.According to Schlomilch theorem, the 2-dimensional problem is reduced to be a one dimensional Fredholm equation. An exact formal solution is obtained and a criterion is suggested to prove the uniqueness of the formal solution. In addition, the relation between the current and transformation function and explicit expression of solution for small r0 are also derived. 本文提出一个半导体测量中对偶积分方程组,经适当的积分变换,实现其退耦;运用Schl(?)milch定理及适当变换,使二重积分方程化为一维的Fredholm方程,并获得严格的形式解,还提出一个判别法,并用以证明解的唯一性.此外还得到电流与转换函数的关系以及小(?)时的显式解. A method for studying the penny-shaped cracks configuration in functionally graded material (FGM) structures subjected to dynamic or steady loading is provided. It is assumed that the FGMs is transversely isotropic and all the material properties only depend on the axial coordinate z. In the analysis, the elastic region is treated as a number of layers. The material properties are taken to be constants for each layer. By utilizing the Laplace transform and Hankel transform technique,the general solutions for... A method for studying the penny-shaped cracks configuration in functionally graded material (FGM) structures subjected to dynamic or steady loading is provided. It is assumed that the FGMs is transversely isotropic and all the material properties only depend on the axial coordinate z. In the analysis, the elastic region is treated as a number of layers. The material properties are taken to be constants for each layer. By utilizing the Laplace transform and Hankel transform technique,the general solutions for layers are derived. The Dual integral equations are then obtained by introducing the mechanical boundary and layer interface conditions via the flexibility/stiffness matrix approach. The stress intensity factors are computed by solving Dual integral equations numerically in Laplace transform domain. The solution in time domain is obtained by utilizing numerical Laplace inverse. The main advantage of the present model is its ability for treating multiple crack configurations in FGMs with arbitrarily distributed and continuously varied material properties by dividing the FGMs into a number of layers, the properties of each layer is slightly different from that of nergbouring ones. 研究了动态载荷下功能梯度材料中的圆币形裂纹问题．假设材料为横观各向同性，并且含有多个垂直于厚度方向的裂纹，材料参数沿轴向（与裂纹面垂直的方向）为变化的，沿该方向将材料划分为许多单层，各单层材料参数为常数，利用Hankel变换祛，在Laplace域内推导出了控制问题的对偶积分方程组．利用Laplace数值反演，得出了裂纹尖端的动态应力强度因子和能量释放率．研究了含两个裂纹的功能梯度接头结构，分析了材料非均匀性参数对应力强度因子和能量释放率的影响． << 更多相关文摘 相关查询

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