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电互连     
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  electrical interconnection
     To meet the requirements of high compunication in 21 century and to solve a variety of limitations existed in today's electrical interconnection and information processing technology,optical interconnection and optical computing have become more and more attractive.
     为了适应21世纪高度信息化社会的需要,解决目前电子系统中电互连和信息处理技术带来的种种局限,光互连与光计算已成为跨世纪引人注目的话题。
短句来源
     From the practical request of computer with optical interconnection. integrated transmitter and receiver with fiber coupler have been used in 4×4 multiprocessor system,so as to be well replaced the electrical interconnection by the optical inter-connection.
     从对计算机光互连的实用要求出发,实现了用集成化的发送器和接收器经光纤连接器组成收发对后,能很好地在4×4多处理机系统内用光互连代替电互连
短句来源
     The energy required by free-space optical interconnection in OEMCM is analyzed and compared with that of inter chip in MCMs. And the break even line length of optical and electrical interconnection is presented.
     分析了光电子多芯片组件内自由空间光互连的单位比特能量需求 ,并与片间电互连情况进行了对比 ,最后给出了多芯片组件内光 -电互连能量平均转效的互连线长( break- even 1 ine)。
短句来源
     The paper discusses the disadvantages of electrical interconnection and advantages of optical interconnection,and introduces the presently basic conditions of optical interconnection.
     讨论了电互连方式的缺陷以及光互连方式的优点,介绍了当前光互连的基本情况。
短句来源
     This paper compares optical interconnection with electrical interconnection in VLSI, summarizes the different kinds of optical interconnection and their development, discusses the difficulties of optical interconnection, and shows the prospect of the optical interconnection.
     文章首先比较了在超大规模集成系统 (VL SI)中光互连和电互连的优劣 ,总结了各种类的光互连及近年取得的新进展 ,并分析了光互连遇到的困难和未来前景。
短句来源
  electronic interconnects
     Using optical interconnects instead of electronic interconnects has potential advantages in the communication of multiprocessing computer systems.
     用光互连取代电互连实现多处理机系统的互连通信具有潜在的优势。
短句来源
     The advantages of reconfigurable optical interconnects within massively parallel systems can be used as alternatives to electronic interconnects within computer vision systems which require high communication and computing speed.
     在大规模并行系统中具有很大的优势,可以作为电互连的替代技术应用于计算机视觉这一类计算机和通信速度很高的系统中。
短句来源
  electric interconnection
     This paper is devoted to analyze the problems of electric interconnection in VLSI,discuss the advantages of optical interconnection .
     本文首先分析了在超大规模集成电路中电互连所遇到的困难,讨论了光学互连的优点。
短句来源
     A new scheme which was used to interconnect routers was proposed using very short reach(VSR) optical prallel link to replace the traditional electric interconnection.
     利用甚短距离(VSR)并行光传输技术取代传统的电互连技术,用以构建路由器之间的互连。
短句来源
  “电互连”译为未确定词的双语例句
     And also, we introduced some advantages of Optical Interconnects over Electric Interconnects.
     同时,简单介绍了光互连相对于电互连的优势,分析了在高密度、高带宽和低损耗通信领域光互连取代电互连的必然性。
短句来源
     Metallic Film Deposited by Evaporation Method for MEMS Interconnection Technology
     蒸发制备金属薄膜实现MEMS工艺中电互连
短句来源
     It is a common sense that optical interconnection and optical switching will replace electronic interconnection and switching as its advantages of high transmission capability, high speed, no interfere, low loss, powerful I/O function.
     光互连和光交换以其传输容量大、速率高、无干扰、低功耗、I/O 功能强大等优点,必将取代电互连与交换已成为人们的共识。
短句来源
     Electrical and Optical Interconnections
     电互连和光互连
短句来源
     Optics is gradually being introduced into intrasystem interconnections to replace electrcal cables for virtue of their high-bandwidth, high-density and lack of electromagnetic interference (EMI).
     因为光具有带宽高、密度高、没有电磁干扰(EMI)等优势,因此正逐步用于系统内互连代替电互连
短句来源
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  electrical interconnection
Low melting point solder droplets, selectively patterned on the faces of the blocks, were employed to drive the sequential alignment, registration, linking and electrical interconnection of each block.
      
Flip chip electrical interconnection by selective electroplating and bonding
      
This work presents a parallel electrical interconnection process by means of flip-chip, selective electroplating and bonding.
      
The electrical interconnection lines are built on a glass substrate made of 500/2000 ? of Cr/Au with 3150 μm in length and 10 μm in width.
      
External electric leads, soldered into plated-through-holes (PTHs) of a printed circuit board (PCB), provide, in addition to electrical interconnection, also mechanical support for heavy (high mass) electronic components mounted on the board.
      
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  electronic interconnect
CMC Interconnect Technologies is a technology services business focused on electronic interconnect and advanced materials.
      
Our well developed technologies for electronic interconnect and packaging also find interesting applications in this area.
      
This literature survey will give an overview of electronic interconnect patterns, polymer waveguides and FPGA's.
      
This purpose of this literature survey was to give an overview of electronic interconnect patterns, polymer waveguides and FPGA's.
      
  electronic interconnects
Material issues in electronic interconnects and packaging
      
The most common failures in electronic interconnects arise from thermomechanical fatigue of the solder joints.
      
In this paper, we introduce a novel approach of using π-conjugated molecular wires to improve the electrical properties of nonconductive films (NCFs) for the electronic interconnects.
      
The improved electrical conduction and current carrying capability enables the application of the NCF in fine pitch and high performance electronic interconnects in microelectronics.
      
Current electronic interconnects will be limited in speed both at chip and board level in the near future.
      
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  electric interconnection
There is currently no on-line coordination of individual control areas within an electric interconnection.
      


The advantages,and disadvantages of both electrical and optical intercon- nections are outlined.From the state-of-the-art point of view,The relatively feasible application of optical interconnections lies in the interconnections between computers as well as interchip interconnections.A problem that should be solved is the compati- bility of fabrication technology for interconnectionand Si integrated circuis.

论述了电互连和光互连的优缺点。从现在工艺水平来看,光互连技术比较可行的应用是解决计算机之间以及内部芯片的互连,以及解决光互连器件与硅集成电路工艺相容性问题。

Based on the principle of binary full adder implemented by the mere optical butterfly in terconnection network (BIN), a new idea of combining optics and electronics, i. e. the idea of substituting the optoelectronic BIN for the mere optical BIN is proposed in this paper to implement binary full addition. This revised BIN structure not only keeps up the advantages of parallel calculation,but also overcomes the disadvantages of implementation of the original optical BIN by applying electronical BIN. In addition,...

Based on the principle of binary full adder implemented by the mere optical butterfly in terconnection network (BIN), a new idea of combining optics and electronics, i. e. the idea of substituting the optoelectronic BIN for the mere optical BIN is proposed in this paper to implement binary full addition. This revised BIN structure not only keeps up the advantages of parallel calculation,but also overcomes the disadvantages of implementation of the original optical BIN by applying electronical BIN. In addition, the optoelectronic processing circuit for implementing "AND" and "OR" logic operations is designed, and optoelectronic experimental results and the computer simulation results obtained by using the optoelectronic interconnection networks are given.

以纯光学蝶互连结构实现的二进制全加器为基础,提出光电混合互连的新构想,即用光电混合的蝶互连网络取代纯光蝶互连网络以实现二进制全加运算。这种改进的蝶互连结构,既发挥了光互连网络在并行运算中的优势,又利用了电互连网络来弥补光互连网络实现上的不足。另外还设计了用以实现“与”、“或”逻辑运算的光电处理电路,给出其实验结果及用此结构实现二进制全加运算的计算机模拟结果。

In this paper,we present an optoelectronic butterfly interconnection network for imp-

本文介绍了一种用来实现并行数字运算的光电蝶互连结构。将这种光电结构应用到并行运算MSD(modified signed-digit)算法中,可以使任意n 位数字的相加运算都分三级并行地同时完成。用光栅互连来完成MSD 算法中各级之间的连接,借助电互连实现MSD 的空间编码及分配。这样,既充分发挥了光互连的高度并行性及空间传输无干扰特性,又充分利用了短离距内电互连的方便性。用这种光电蝶互连结构,可以实现并行加减运算及快速乘除法运算。

 
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