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电互连    
相关语句
  electrical interconnection
    From the practical request of computer with optical interconnection. integrated transmitter and receiver with fiber coupler have been used in 4×4 multiprocessor system,so as to be well replaced the electrical interconnection by the optical inter-connection.
    从对计算机光互连的实用要求出发,实现了用集成化的发送器和接收器经光纤连接器组成收发对后,能很好地在4×4多处理机系统内用光互连代替电互连
短句来源
  electronic interconnects
    Using optical interconnects instead of electronic interconnects has potential advantages in the communication of multiprocessing computer systems.
    用光互连取代电互连实现多处理机系统的互连通信具有潜在的优势。
短句来源
  electrical interconnection
    From the practical request of computer with optical interconnection. integrated transmitter and receiver with fiber coupler have been used in 4×4 multiprocessor system,so as to be well replaced the electrical interconnection by the optical inter-connection.
    从对计算机光互连的实用要求出发,实现了用集成化的发送器和接收器经光纤连接器组成收发对后,能很好地在4×4多处理机系统内用光互连代替电互连
短句来源
  electric interconnection
    A new scheme which was used to interconnect routers was proposed using very short reach(VSR) optical prallel link to replace the traditional electric interconnection.
    利用甚短距离(VSR)并行光传输技术取代传统的电互连技术,用以构建路由器之间的互连。
短句来源

 

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  electrical interconnection
Low melting point solder droplets, selectively patterned on the faces of the blocks, were employed to drive the sequential alignment, registration, linking and electrical interconnection of each block.
      
Flip chip electrical interconnection by selective electroplating and bonding
      
This work presents a parallel electrical interconnection process by means of flip-chip, selective electroplating and bonding.
      
The electrical interconnection lines are built on a glass substrate made of 500/2000 ? of Cr/Au with 3150 μm in length and 10 μm in width.
      
External electric leads, soldered into plated-through-holes (PTHs) of a printed circuit board (PCB), provide, in addition to electrical interconnection, also mechanical support for heavy (high mass) electronic components mounted on the board.
      
更多          
  electronic interconnects
Material issues in electronic interconnects and packaging
      
The most common failures in electronic interconnects arise from thermomechanical fatigue of the solder joints.
      
In this paper, we introduce a novel approach of using π-conjugated molecular wires to improve the electrical properties of nonconductive films (NCFs) for the electronic interconnects.
      
The improved electrical conduction and current carrying capability enables the application of the NCF in fine pitch and high performance electronic interconnects in microelectronics.
      
Current electronic interconnects will be limited in speed both at chip and board level in the near future.
      
更多          
  electrical interconnection
Low melting point solder droplets, selectively patterned on the faces of the blocks, were employed to drive the sequential alignment, registration, linking and electrical interconnection of each block.
      
Flip chip electrical interconnection by selective electroplating and bonding
      
This work presents a parallel electrical interconnection process by means of flip-chip, selective electroplating and bonding.
      
The electrical interconnection lines are built on a glass substrate made of 500/2000 ? of Cr/Au with 3150 μm in length and 10 μm in width.
      
External electric leads, soldered into plated-through-holes (PTHs) of a printed circuit board (PCB), provide, in addition to electrical interconnection, also mechanical support for heavy (high mass) electronic components mounted on the board.
      
更多          
  electric interconnection
There is currently no on-line coordination of individual control areas within an electric interconnection.
      
  其他


Based on the principle of binary full adder implemented by the mere optical butterfly in terconnection network (BIN), a new idea of combining optics and electronics, i. e. the idea of substituting the optoelectronic BIN for the mere optical BIN is proposed in this paper to implement binary full addition. This revised BIN structure not only keeps up the advantages of parallel calculation,but also overcomes the disadvantages of implementation of the original optical BIN by applying electronical BIN. In addition,...

Based on the principle of binary full adder implemented by the mere optical butterfly in terconnection network (BIN), a new idea of combining optics and electronics, i. e. the idea of substituting the optoelectronic BIN for the mere optical BIN is proposed in this paper to implement binary full addition. This revised BIN structure not only keeps up the advantages of parallel calculation,but also overcomes the disadvantages of implementation of the original optical BIN by applying electronical BIN. In addition, the optoelectronic processing circuit for implementing "AND" and "OR" logic operations is designed, and optoelectronic experimental results and the computer simulation results obtained by using the optoelectronic interconnection networks are given.

以纯光学蝶互连结构实现的二进制全加器为基础,提出光电混合互连的新构想,即用光电混合的蝶互连网络取代纯光蝶互连网络以实现二进制全加运算。这种改进的蝶互连结构,既发挥了光互连网络在并行运算中的优势,又利用了电互连网络来弥补光互连网络实现上的不足。另外还设计了用以实现“与”、“或”逻辑运算的光电处理电路,给出其实验结果及用此结构实现二进制全加运算的计算机模拟结果。

Using optical interconnects instead of electronic interconnects has potential advantages in the communication of multiprocessing computer systems. This paper presents the matrix representation forms for logical name structures of interconnection networks, and obtains four sets of logical name matrices of modified manipulators topologically equivalent with flip networks by using the Graph Anlysis Method, which provides theoretical basis for improving the interconnection functions and the performance-cost ratio...

Using optical interconnects instead of electronic interconnects has potential advantages in the communication of multiprocessing computer systems. This paper presents the matrix representation forms for logical name structures of interconnection networks, and obtains four sets of logical name matrices of modified manipulators topologically equivalent with flip networks by using the Graph Anlysis Method, which provides theoretical basis for improving the interconnection functions and the performance-cost ratio of optical intercon- nection modified manipulator systems.

用光互连取代电互连实现多处理机系统的互连通信具有潜在的优势。本文提出了互连网络逻辑名结构的矩阵表示形式,并采用互连网络拓扑等价的图分析法获得了简化数据变换网络与Flip网络拓扑等价的四套逻辑名矩阵,为拓展光互连简化数据变换网络系统的互连功能,提高其性能价格比提供了理论依据。

From the practical request of computer with optical interconnection.integrated transmitter and receiver with fiber coupler have been used in 4×4 multiprocessor system,so as to be well replaced the electrical interconnection by the optical inter-connection.Moreover,the selection of interconnection device has been developed emphatically as well as its structure,design,pack and test.

从对计算机光互连的实用要求出发,实现了用集成化的发送器和接收器经光纤连接器组成收发对后,能很好地在4×4多处理机系统内用光互连代替电互连。着重探讨了发送器和接收器的结构、设计,以及工艺改进途径,对互连器件的配套选择、性能测试作了一定工作,使之能方便使用。

 
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