助手标题  
全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多
查询帮助
意见反馈
   铜空腔 的翻译结果: 查询用时:0.226秒
图标索引 在分类学科中查询
所有学科
金属学及金属工艺
更多类别查询

图标索引 历史查询
 

铜空腔
相关语句
  copper hohlraum
     Study of Electroless Plating Technology for Copper Hohlraum
     化学镀方法制备铜空腔工艺
短句来源
  相似匹配句对
     COPPER
    
短句来源
     Within the layer the copper?
     ?
短句来源
     Study of electroless plating for copper hohlraum fabrication
     空腔靶的化学镀制研究
短句来源
     Study of Electroless Plating Technology for Copper Hohlraum
     化学镀方法制备空腔工艺
短句来源
     7. empty cavity.
     7.空腔
短句来源
查询“铜空腔”译词为用户自定义的双语例句

    我想查看译文中含有:的双语例句
例句
为了更好的帮助您理解掌握查询词或其译词在地道英语中的实际用法,我们为您准备了出自英文原文的大量英语例句,供您参考。
  copper hohlraum
Results are presented of experiments using targets in the form of a spherical copper hohlraum coated with gold on the inside, with six laser entrance holes and a glass microtarget filled with DT gas located at the center.
      


This paper introduces the electroless plating technique to fabricate integral Cu hohlraum on the surface of pretreated PMMA axis.Some parameters effect on the deposition rate and solution stability,such as the CuSO_4 content,reducing agent content,pH value and temperature were studied.The optimized mass concentration of CuSO_4 is 10~20 g/L,TART·K·Na is 10~30 g/L,EDTA·2Na is 10~28 g/L,additive is 10 mg/L,the volumic concetration of HCHO is 10~25 mL/L,pH value is 12~13,and the base temperature is 35~65 ℃.The feasible...

This paper introduces the electroless plating technique to fabricate integral Cu hohlraum on the surface of pretreated PMMA axis.Some parameters effect on the deposition rate and solution stability,such as the CuSO_4 content,reducing agent content,pH value and temperature were studied.The optimized mass concentration of CuSO_4 is 10~20 g/L,TART·K·Na is 10~30 g/L,EDTA·2Na is 10~28 g/L,additive is 10 mg/L,the volumic concetration of HCHO is 10~25 mL/L,pH value is 12~13,and the base temperature is 35~65 ℃.The feasible technics of electroless Cu plating are confirmed base on experimental result.According to the technics,Cu hohlraum with thickness of 10~25 μm was obtained and there were not flaw and indentations on the surface.After the axis was removed by chemical etching,the load-free Cu holraum was obtained.It provides a new way to fabricate metal and alloy material for ICF target fabrication.

介绍了在预处理芯轴(聚甲基丙烯酸甲酯)表面采用化学镀的方法制备铜空腔的技术,研究了镀液中硫酸铜含量、甲醛含量,镀液pH值、温度等对化学镀铜沉积速率和溶液稳定性的影响。根据实验确定了适宜的化学镀铜工艺规范:硫酸铜质量浓度10~20 g/L,TART.K.Na质量浓度10~30 g/L,EDTA.2Na质量浓度10~28 g/L,甲醛体积浓度10~25 mL/L,添加剂质量浓度10 mg/L,pH值12~13,温度35~65℃。通过该工艺制备出的镀层厚度达到10~25μm,均匀性达到95%,表面无砂眼、裂纹等缺陷,刻蚀芯轴后空腔能自持。该方法为ICF研究制备金属或合金材料靶提供了新的途径。

Electroless plating was performed to fabricate integral copper hohlraum on the surface of pretreated core axis made of polymethyl methacrylate (PMMA) used for a laser device. The effects of the content of formaldehyde as the reducing agent and pH value and temperature of the plating bath on the deposition rate and bath stability were studied. The optimization of the bath formulation and plating parameters was established. As the results, the optimized bath was suggested to be composed of 10 g/L CuSO_ 4, 20 g/L...

Electroless plating was performed to fabricate integral copper hohlraum on the surface of pretreated core axis made of polymethyl methacrylate (PMMA) used for a laser device. The effects of the content of formaldehyde as the reducing agent and pH value and temperature of the plating bath on the deposition rate and bath stability were studied. The optimization of the bath formulation and plating parameters was established. As the results, the optimized bath was suggested to be composed of 10 g/L CuSO_ 4, 20 g/L Na_ 2EDTA, 40 g/L potassium and sodium tartarate, 0.1 g/L stabilizing agent, 10~20 mL/L formaldehyde; while the optimal pH value and temperature of the plating bath were suggested to be 12.0~13.0 and 40~70 ℃, respectively. The copper coating prepared under the optimized conditions had a wall thickness as much as 25 μm and was free of cavities and cracks. After removal of the core axis by chemical etching, the remaining copper hohlraum was able to keep its shape in the absence of external load.

激光试验装置中的整体式铜腔靶精度要求高,现有机加工方法不能满足要求。为此,在预处理芯轴(聚甲基丙烯酸甲酯)表面采用化学镀法制备铜空腔,研究了镀液中甲醛含量、pH值、温度等对镀速和镀液稳定性的影响。确定了适宜的化学镀铜工艺为:10g/L硫酸铜,10~20mL/L甲醛,40g/L酒石酸钾钠,20g/L乙二胺四乙酸二钠,0.1g/L稳定剂(2,2-联吡啶),pH值12.0~13.0,温度40~70℃。制备的铜空腔壁厚达25μm,表面无砂眼、裂纹等缺陷,刻蚀芯轴后空腔能自持。

 
图标索引 相关查询

 


 
CNKI小工具
在英文学术搜索中查有关铜空腔的内容
在知识搜索中查有关铜空腔的内容
在数字搜索中查有关铜空腔的内容
在概念知识元中查有关铜空腔的内容
在学术趋势中查有关铜空腔的内容
 
 

CNKI主页设CNKI翻译助手为主页 | 收藏CNKI翻译助手 | 广告服务 | 英文学术搜索
版权图标  2008 CNKI-中国知网
京ICP证040431号 互联网出版许可证 新出网证(京)字008号
北京市公安局海淀分局 备案号:110 1081725
版权图标 2008中国知网(cnki) 中国学术期刊(光盘版)电子杂志社