The structure of the electroless Ni P plating prepared in acidic bath,the effect and action mechanism of RE ions(La 3+ ?Y 3+ )and oxides(CeO 2?Y 2O 3)on Ni P plating were investigated. The optimum formula of composite RE in plating bath was achieved by means of orthogonal experiments.
Based upon the economic concept of income to cost ratio Rn,the model for the analysis of economic profitability of multiple reuse of acidic bath for electroless Ni-P plating was established and interactions between the formulation of the plating, process and market factor were obtained.
The experimental analysis of activation energy of electroless deposition reaction shows that acidic bath reaction system possesses a low activation energy and a high deposition rate.
The formation mechanism of Sn-Ce-Sb alloy, the bath stability and weldability of deposit were studied. The results prove that adding Ce and Sb into acidic bath can improve the bath stability and weldability and oxidation resistance of deposit.
This paper studies the high corrosion resistance of electroless Ni-P alloy plating on aluminium and its alloy from a acid bath which contains multi m_1 and m_2, approches the factors influencing the high corrosion resistance of electroless Ni-P alloy piating and determines the components of electroless Ni-P alloy plating and the relationship of the structure with the high corrosion resistance by means of X-ray diffraction and Auger Electron Spectroscopy(AES).
The Fe-Nd-P alloy deposits with different Nd content were obtained by electrodeposition at constant current from acidic solution containing NdCl3. The variations.
The Fe Nd P alloy deposits with different Nd content were obtained by electrodeposition at constant current from acidic solution containing NdCl 3. The variations of Nd amount contained in deposited alloys were studied by changing the ratio of salts, the concentration of ligand, current density, and pH value.
Light catalysis electroless plating Ni-P alloy can take place at the room temperature in the acidic solution containing the dye as photosensitizer under illumination(pH=5.2).
The Fe-Nd-P alloy deposits with different Nd content were obtained by electrodeposition from acidic solution containing NdCl_3 at constant current density, and their morphologies and components were studied by SM and EDS.
The experiment results show that the plating quality of Ni P PTFE can reach the level of excellence when the parameters of the acid plating solution of the electroless Ni P alloy are: pH is at 5.0, atmospheric temperature at 85～90 °C, and the dosage amount of the surface active agent, of JFC, and of PTFE is 4.5 mL·L 1 , 6 mL·L 1 and 4～5 g·L 1 respectively.
The results of experimenting four compositions of acid plating bath have proved that,in order to have a good coating both in brightness and solderability,it is quite important to add Ce(SO_4)_2 to the acidic bath,control the current density and be careful to use the necessary additives.
Making use of the corrosive liquid of lemon acid with Sic grains, the behaviour of amorphous Ni-P coating, which was deposited by impulse electroless plating and electroless plating in the same acid plating liq-uid, was studied.
Use of a highly acidic bath leads to nonuniform deposits, even in the presence of gluconate; at pH 4 deposits are uniform, brilliant and suitable for finishing applications.
Zn-Mn alloys containing up to 25?at.% Mn in the alkaline bath and 12?at.% in the acidic bath could be obtained at the cost of very low current efficiencies.
Spherical cellulose beads having narrow particle-size distribution were prepared by the coagulation/regeneration method for small viscose droplets formed by centrifugal force in an acid bath.
Poly(4-vinyl pyridine-co-methyl methacrylate), which is soluble in water in its protonated form and insoluble as a neutral molecule, has been synthesized and introduced into an acid bath for copper deposition.
The method is based on the catalytic effect of iodide ions on the oxidation reaction of o-phenylenediamine with Chloramine B in an acidic solution and has a detection limit of 1 × 10-4 μg/mL.
A member of this family of reactions studied here, the Cu(II)-catalyzed oxidation of thiosulfate by hydrogen peroxide in acidic solution, is known to display a rich variety of oscillatory dynamics.
Copper deposition in an acid plating bath occurs readily on the oxidized ruthenium, but the presence of oxide is known to have a detrimental effect both on the copper superfilling process and copper adhesion at the Ru/Cu interface.
After the acrylic spheres were cleaned, sensitized and activated successively, they were put into an acid plating bath containing sodium hypophosphite as reducing agent for the electroless Ni deposition.
The results of experimenting four compositions of acid plating bath have proved that,in order to have a good coating both in brightness and solderability,it is quite important to add Ce(SO_4)_2 to the acidic bath,control the current density and be careful to use the necessary additives. The relationship between the additives used and solderability is also discussed.)
Based on experiments, it is found that mirror bright silver deposit can be obtained from acid Ag plating bath consisting of sodium thiosulfate added with additive ZV-19, under certain clectrolytic conditions (pH:4.2-4.6; bath temp:10-25℃; cd:0.4-1.6A/cm~2; plating time: 10-15min), It is considered that the bath is stabilized by common ion effect of sodium pyrosulfite, and the main reaction product of Ag ion with thiosulfate ion is a complex of [Ag(S_2O_3)_2]~(3-). At the same time, electrotytic conditions a...
This paper studies the high corrosion resistance of electroless Ni-P alloy plating on aluminium and its alloy from a acid bath which contains multi m_1 and m_2, approches the factors influencing the high corrosion resistance of electroless Ni-P alloy piating and determines the components of electroless Ni-P alloy plating and the relationship of the structure with the high corrosion resistance by means of X-ray diffraction and Auger Electron Spectroscopy(AES).
酸性镀液
acidic bath
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