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   宽带综合 在 无线电电子学 分类中 的翻译结果: 查询用时:0.788秒
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宽带综合
相关语句
  broadband integrated
    It is applied in device of broadband integrated service access, such as DSLAM, wireless station of 3G, and all kinds of optical access system.
    该产品主要应用于数字用户线访问复用器(DSLAM) 、第三代无线地面机站、及各类光接入系统等宽带综合业务接入设备。
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  “宽带综合”译为未确定词的双语例句
    This paper originated from the high-tech project of Jiangsu province and its CODE is BG2001046.The paper introduced the functional block schematic of realizing the whole ONT in APON based on the network model of B-ISDN and bring forward path layer system design according to the protocol.
    本课题源于江苏省高技术研究计划项目,项目代号:BG2001046。 文中在讨论宽带综合业务数据网(B-ISDN)网络分层模型的基础上,介绍了实现APON系统中ONT的总体方案功能模块图,并根据协议和ONT技术要求提出了通道层硬件电路设计。
短句来源
    In this paper, we will introduce the design of one high speed Ethernet switch, SW224, with the background of Community Broadband Network System with Integrated Services.
    本文就以社区宽带综合业务网络系统为背景,阐述了一款高速以太网交换机——SW224的硬件设计实现。
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  broadband integrated
The tool was designed to study the characteristics of variable bit rate video sources for transmission over asynchronous transfer mode (ATM) based broadband integrated services digital network (B-ISDN).
      
Broadband integrated services user part (B-ISUP) is an internodal signalling protocol defined by the International Telecommunications Union (ITU-T).
      
This paper addresses in the design of thin film filter for IR broadband integrated photonic amplifiers.
      
Broadband integrated services digital networks (B-ISDN) must handle multiclass traffic with diverse quality of service requirements.
      
Broadband Integrated Services Digital Networks (BISDN) should be capable of supporting a variety of traffic classes (e.
      
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The use of modules consisting of multiple semiconductor chipsmounted directly on circuit boards(multichip modules)holds promise for shorter circuitline lengths,with higher operating speeds and higher detisity in broadband integratedservices digital network(B ISDN)applications. However,as more highly integratedsemiconductors and denser module configurations are developed,power consumption insuch modules increases,making thermal design increasingly important.The boundary conditions of models for finite element...

The use of modules consisting of multiple semiconductor chipsmounted directly on circuit boards(multichip modules)holds promise for shorter circuitline lengths,with higher operating speeds and higher detisity in broadband integratedservices digital network(B ISDN)applications. However,as more highly integratedsemiconductors and denser module configurations are developed,power consumption insuch modules increases,making thermal design increasingly important.The boundary conditions of models for finite element analysis of the thermal designof high speed high density multichip modules are examined, principally the thermalvia and heat sink,and means of improving the accuracy of heat transfer analysis simula-tion are investigated.

由多个芯片直接安装在电路基片上的多芯片模块(MCM)可望缩短布线长度,提高运算速度和组装密度,从而应用于宽带综合服务数字网络(B—ISDN)中。然而,随着半导体器件储存成度和组装密度的提高和模块外形尺寸的缩小,功耗密度随之增加。这使得热设计显得更加重要。本文介始了在高速高密度多芯片模块的热设计中应用有限元分析法模型的边界条件。着重研究了热路、散热片以及提高热传递模拟精度的方示。

 
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