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粘接可靠性
相关语句
  bonding reliability
     A Study of the Bonding Reliability for the Anisotropic Conductive Adhesive Film
     各向异性导电胶膜粘接可靠性的研究
短句来源
     Research Progress in Bonding Reliability of Electrically Conductive Adhesives
     导电胶的粘接可靠性研究进展
短句来源
     The electrical conduction mechanisms and bonding process of Anisotropic Conductive Adhesives (ACA) in electronics application are presented. Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.
     介绍各向异性导电胶导电机理和粘接工艺,以及影响它的粘接可靠性因素和最佳参数的研究,如粘接温度、固化时间、粘接压力、粒子含量等。
短句来源
     Bonding reliability of electrically conductive adhesives(ECAs)is very important to their application.
     导电胶的粘接可靠性是制约其应用的主要影响因素。
短句来源
     Nowadays,bonding reliability of electrically conductive adhesives(ECAs) has become one of the difficulties in its application.
     导电胶的粘接可靠性是制约其应用的主要影响因素。
短句来源
  “粘接可靠性”译为未确定词的双语例句
     A Reliable Design of HgCdTe Chips Attachment
     HgCdTe芯片粘接可靠性设计
短句来源
  相似匹配句对
     A Reliable Design of HgCdTe Chips Attachment
     HgCdTe芯片粘接可靠性设计
短句来源
     Research Progress in Bonding Reliability of Electrically Conductive Adhesives
     导电胶的粘接可靠性研究进展
短句来源
     Reliability of cutting Tool
     切削刀具的可靠性
短句来源
     (5) Structual Reliability;
     结构可靠性;
短句来源
     Bus Bonding Technology
     大客车粘接技术
短句来源
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  bonding reliability
For the samples that were fabricated on the basis of the present technique, the bonding reliability has been evaluated.
      
Tests were carried out in order to determine their modulus of elasticity, bending strength and shear modulus; the bonding reliability was also evaluated by means of delamination and shear tests in the glue lines.
      
Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability
      
The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied.
      
Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps.
      


The bonding process of copper electrode and carbon fiber/epoxy resin composites and the effect of different surface treating methods of the copper electrode (such as mechanical polish, chemical treating and surface electroplating) on bonding strength and electrical conductivity were studied. Through the hydrothermal aging tests the bonding reliability was compared. The results showed that the surface chemical treating process got the best bonding strength up to 1. 34 MPa,the retained strength of 76% after aging...

The bonding process of copper electrode and carbon fiber/epoxy resin composites and the effect of different surface treating methods of the copper electrode (such as mechanical polish, chemical treating and surface electroplating) on bonding strength and electrical conductivity were studied. Through the hydrothermal aging tests the bonding reliability was compared. The results showed that the surface chemical treating process got the best bonding strength up to 1. 34 MPa,the retained strength of 76% after aging and the electrical resistivity of 4.19 Ω· m,and after aging the resistivity was increased by 4. 8% .

研究铜电极与碳纤维/环氧复合材料的粘接工艺,比较铜的表面处理方法对于粘接强度和导电性的影响,并验证粘接的可靠性。首先分别用机械打磨、化学表面处理、表面电镀方法对铜片进行处理,然后通过铜粉导电胶与碳纤维/环氧复合材料粘接,测试粘接强度及电阻率,再通过湿热老化实验,对粘接的可靠性进行比较。测试结果表明,经化学表面处理的铜片与碳纤维/环氧复合材料粘接强度达到1.34MPa,老化后强度保留率为76%;电阻率为4.19Ω·m,老化后电阻率增加率为4.8%。从而确定化学表面处理方法得到的粘接强度和导电效果较佳。

In order to resolve the part distortion problem of 16Mn scaleboard used in the sluiceway of No.5 and No.6 BF because of heavy erosion-corrosion wear,casting basalt scaleboard that has good properties of resisting corrosion and resisting wear was adopted.An anti-skidding lattice pattern on the back of the basalt board was designed and a hole was kept to rivet by bolt.Therefore,bonding reliability was increased between the casting basalt scaleboard and the grouting stuff,using CGM stuff to adhibit basalt scaleboard...

In order to resolve the part distortion problem of 16Mn scaleboard used in the sluiceway of No.5 and No.6 BF because of heavy erosion-corrosion wear,casting basalt scaleboard that has good properties of resisting corrosion and resisting wear was adopted.An anti-skidding lattice pattern on the back of the basalt board was designed and a hole was kept to rivet by bolt.Therefore,bonding reliability was increased between the casting basalt scaleboard and the grouting stuff,using CGM stuff to adhibit basalt scaleboard in building operation.The time limit of the project was only four days and the casting basalt scaleboard had little abrasion checked three years later.

为解决 5 #、6#高炉冲渣沟原 16Mn衬板因冲蚀、腐蚀磨损严重 ,局部翘曲变形的问题 ,采用耐蚀性及耐磨性均较好的玄武岩铸石板作为冲渣沟内衬。设计铸石板结构为防滑形并预留孔用螺栓锚固 ,增加了铸石板与底部灌浆料粘接的可靠性 ,采用 CGM自流型灌浆料施工 ,工期仅为 4天。应用 3年后检查 ,铸石板仅有微量磨损。

The electrical conduction mechanisms and bonding process of Anisotropic Conductive Adhesives (ACA) in electronics application are presented. Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction. Open circuit, short circuit, and the relationship of contact resistance with bonding pressure and temperature cycling are discussed in ACA bonding process.

介绍各向异性导电胶导电机理和粘接工艺,以及影响它的粘接可靠性因素和最佳参数的研究,如粘接温度、固化时间、粘接压力、粒子含量等。对各向异性导电胶粘接可靠性中的开路、短路、接触电阻与粘接压力和温度循环的关系进行了讨论,并介绍了各向异性导电胶可靠性的理论计算模型。

 
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