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微孔腐蚀
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     Corrosion
     腐蚀
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     Erosion Corrosion
     磨损腐蚀
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     MICROCELLULAR FOAM POLYMER MATERIALS
     微孔发泡高分子材料
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     Peraparation of Micropore Fiberglass
     微孔玻璃纤维的研制
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  pore corrosion
It is also shown in this work that pore corrosion has a kinship with creep corrosion.
      
It should be valuable to investigate the process and mechanism of pore corrosion, and then differentiate it with creep corrosion.
      
Pore corrosion on noble metal plated materials has been a conjunction topic with creep corrosion for many years.
      


The corrosion characteristics of as-cast SiCp/ 2024 al composites in chloride (Cl-) media were investigated using scanning micro reference electrode technique,electrochemical analysis and scanning electron microscopy. The composites have less resistant to pit initiation than the corresponding aluminum alloy. The increase in volume fraction of SiCp reinforced phase resulted in a signiflcant decrease of pitting potential. In situ mapping of the active centers in composites revealed that local breakdown of passivity...

The corrosion characteristics of as-cast SiCp/ 2024 al composites in chloride (Cl-) media were investigated using scanning micro reference electrode technique,electrochemical analysis and scanning electron microscopy. The composites have less resistant to pit initiation than the corresponding aluminum alloy. The increase in volume fraction of SiCp reinforced phase resulted in a signiflcant decrease of pitting potential. In situ mapping of the active centers in composites revealed that local breakdown of passivity and micropitting corrosion could happen even at the open-circuit potentials, and the increase of volume fraction of SiC particles reinforced phase in the composites led t0 a significant increase of active centers on their surfaces. Pitting corrosion attack occured preferentially at the interfaces of SiC / al, and al2Cu or (Cu, Fe, Mn)al6 inclusions / al for the composites.

本文研究了碳化硅颗粒(SiCp)的体积分数和介质中的Cl-含量对于SiCp/2024al铝基复合材料腐蚀性能的影响.用扫描微参比电极测量系统首次显示和跟踪了复合材料点蚀发生及发展的微区动态行为.动电位循环极化法研究表明,SiCp/2024al复合材料比相应的纯铝基金属有较大的腐蚀敏感性.SiCp体积分数和介质中的Cl-含量的增加均引起复合材料的点蚀电位的显著负移.扫描微电极技术研究表明,表面钝化膜的局部破坏和微孔腐蚀可在远负于点蚀发生电位的开路电位下发生.SiCp的体积分数的增加引起复合材料活性中心的明显增加.点腐蚀主要发生在SiC/al基体界面和第二相夹杂物/al基体界面.

The effect of chemical passivation in CeCl 3 solution on the pitting behavior of as cast SiCp/2024 Al metal metrix composites was investigated. Potentiodynamic polarization techniques, a c impedance techniques, and potentiostatic current time plots technique were used to characterize the properties of protective surface layers. Statistically significant improved results were noted for the chemical passivation. In addition, increase of period of immersion of the MMCs in CeCl 3 solution from 3 days to...

The effect of chemical passivation in CeCl 3 solution on the pitting behavior of as cast SiCp/2024 Al metal metrix composites was investigated. Potentiodynamic polarization techniques, a c impedance techniques, and potentiostatic current time plots technique were used to characterize the properties of protective surface layers. Statistically significant improved results were noted for the chemical passivation. In addition, increase of period of immersion of the MMCs in CeCl 3 solution from 3 days to 14 days led to a significant increase of the pitting potential. However, the effectiveness of corrosion protection methods decreased with increasing reinforcement concentration. Electrochemical impedance spectroscopy and potentiostatic current time plots revealed that the quality and stability of passive oxide layers formed on the composites were improved after immersion in CeCl 3 solution.

研究了氯化铈表面化学处理对于SiCp/2024 Al铝基复合材料在含氯离子介质中的耐蚀性的影响.研究结果表明,氯化铈表面化学处理使该复合材料的点蚀电位(Ep)发生显著正移(P <0.01).处理后点蚀电位与自腐蚀电位之差(ΔE = Ep- Ecorr)也显著增大.而随着铝基复合材料中SiCp 的体积分数的增加,表面处理的效果显著下降.交流阻抗谱和电流-时间谱测试表明,经过氯化铈化学处理的铝基复合材料相比未处理前在0.1 m ol/LNaCl溶液中浸泡不易出现局部破坏和微孔腐蚀现象.

Gold plating is used widely on the connector surfaces to prevent corrosion, which may cause failure. However, the formation of pores is unavoidable in gold plating, for the gold plating is not thick enough. Corrosion may grow through these pores. Porosity is one of the important factors to evaluate the quality of gold plating on connectors. A quick and convenient method for measuring the porosity of gold plating on connectors is to accelerate corrosion with wet SO2 gas and to analyze with a microscope. Some...

Gold plating is used widely on the connector surfaces to prevent corrosion, which may cause failure. However, the formation of pores is unavoidable in gold plating, for the gold plating is not thick enough. Corrosion may grow through these pores. Porosity is one of the important factors to evaluate the quality of gold plating on connectors. A quick and convenient method for measuring the porosity of gold plating on connectors is to accelerate corrosion with wet SO2 gas and to analyze with a microscope. Some coaxial connectors have been tested with the method and their porosity been found over 600/cm2 when the gold plating less than 1 mm. When the thickness reaches to over 3 mm, the porosity bargains to reduce rapidly until below 60 /cm2.

为防止连接器在空气中污染腐蚀而导致电接触失效,广泛采用表面镀金工艺。但镀金层较薄,不可避免地出现微孔,形成微孔腐蚀。微孔率是评价连接器镀金质量的重要参数之一。采用潮湿SO2气体加速腐蚀,并配以显微镜分析是一种方便、快速的连接器镀金微孔率检测方法。采用这种方法检测同轴连接器镀金层,发现镀金层厚度不足1 mm时,微孔率大于600个/cm2,随镀金层厚度增加至3 mm以上,微孔率急剧减少,低于60 个/cm2。

 
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