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   准快速凝固 在 金属学及金属工艺 分类中 的翻译结果: 查询用时:0.058秒
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The growth morphology and mechanism of a MC carbide (TiC type) under quasi-rapidsolidification conditions of laser surface alloyed coatings on a titantium aluminide alloy are studied. TheMC carbide under quasi-rapid solidification conditions with a cooling rate of about (4 10~2) C /s is foundto have an unique dendritic morphology having strong faceted and brick-stacking growth characteristicson dendrite arms. The growth mechanism is a brick-stacking/ double-zigzag micro-branching mechanismoriginating from lateral...

The growth morphology and mechanism of a MC carbide (TiC type) under quasi-rapidsolidification conditions of laser surface alloyed coatings on a titantium aluminide alloy are studied. TheMC carbide under quasi-rapid solidification conditions with a cooling rate of about (4 10~2) C /s is foundto have an unique dendritic morphology having strong faceted and brick-stacking growth characteristicson dendrite arms. The growth mechanism is a brick-stacking/ double-zigzag micro-branching mechanismoriginating from lateral growth on the intersecting {111} planes.

本文对TiAl合金激光表面合金化表面改性层中TiC生长形态的生长过程及机理进行了研究,发现在冷却速度为102℃/s量级的准快速凝固条件下,TiC型MC碳化物在微观上具有极为规则“砖块分叉堆砌”生长特征的发达树枝状生长形态,其生长机制是密排面生长台阶沿双“之”字形轨迹侧向推进的“砖块分叉堆砌”生长机制

The recent development of Cu Cr contact materials for high power vacuum interrupters is concluded. It includes the origination of Cu Cr alloy and technical advantages; the characteristic of Cu Cr binary diagram and the difficulties in convenient casting process; the main preparation processes of Cu Cr alloy, such as powder sinter, sinter and vacuum infiltrate and arc melting process; the influence of impurities, such as residual gases, residual carbon and the third element in Cu Cr alloy, on the...

The recent development of Cu Cr contact materials for high power vacuum interrupters is concluded. It includes the origination of Cu Cr alloy and technical advantages; the characteristic of Cu Cr binary diagram and the difficulties in convenient casting process; the main preparation processes of Cu Cr alloy, such as powder sinter, sinter and vacuum infiltrate and arc melting process; the influence of impurities, such as residual gases, residual carbon and the third element in Cu Cr alloy, on the properties of Cu Cr alloy etc. Also, it summarizes the effect of Cu Cr alloy and its microstructure on the basic electrical properties of the vacuum contactor (such as circuit interruption ability, resistance to erosion by arc, current chop etc.). Finally, the developing direction of the Cu Cr contact materials in the future (Cr particle dispersion, alloy recycle and qui fast solidification process, and spray forming etc.) are also discussed.

综述了大功率真空开关铜铬触头材料最近的进展。主要内容包括 :铜铬合金的发明及技术上的优点 ,铜铬合金二元相图上的特点及常规铸造工艺上的困难 ;铜铬合金的主要制备工艺包括粉末烧结法、粉末烧结熔渗法以及自耗电极法等 ,铜铬合金中杂质的影响 ,包括残余气体的影响、残余碳的影响及第三组元的影响等。对铜铬合金及其材料的显微组织对真空电触头的基本电性能 (分断电流能力 ,抗电弧烧蚀能力 ,截断电流等 )的影响进行了简要的概述 ,最后对铜铬合金进一步发展方向 (如铬粒子细化 ,材料回收及准快速凝固工艺 ,喷射成型等 )进行了简要的讨论

 
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