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   电路基板 的翻译结果: 查询用时:0.018秒
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电路基板
相关语句
  circuit substrate
     Study of Laser Cutting Technology for Mica Plate as Special Circuit Substrate
     特种电路基板云母片的激光切割工艺研究
短句来源
     A Novel Power Circuit Substrate
     一种新型的功率电路基板
  circuit substrates
     A New Type of Metallization Technology for Ceramic Circuit Substrates
     陶瓷电路基板的新型金属化技术
短句来源
  circuit large-area
     Study of Microwave Circuit Large-Area Grounding Technology
     微波电路基板接地技术研究
短句来源
  “电路基板”译为未确定词的双语例句
     A Review of Substrate Materials for Power Hybrid Circuits
     功率混合电路基板材料评述
短句来源
     LTCC multilayer substrates can be used not only in packaging products, such as DIP, LCCC, PGA, QFP, BGA, CSP, MCM, SiP, but also in motherboard of computer, high-speed circuit board, power circuit board, electronic circuit board of the automobile, etc.
     LTCC 多层基板除可用于DIP、LCCC、PGA、QFP、BGA、CSP、MCM、SiP 等各种封装制品外,还可用于计算机主板、高速电路基板、功率电路基板、汽车电子电路基板等。
短句来源
     Advanced copper thick film material has excellent microwave performance and the thick film module can easily realize large-scale production, so the copper thick film technology is a high performance and low cost substrate production technology.
     先进的铜厚膜工艺具有微波性能好、便于大批量生产等特点 ,是一种高性能、低成本的电路基板制造技术。
短句来源
     Studies on the Anodic Oxidation Power Substrate of Aluminium
     阳极氧化铝电路基板制备的研究
短句来源
     Partially Devitrified Insulating Porcelain Enamel and Substrates Coated Therewith for Electronic Applications
     部分析晶绝缘瓷釉及其搪瓷电路基板
短句来源
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      circuit substrate
    First, a triangular discretization method is employed to generate RC equivalent-circuit substrate models which are far less complex than those formulated by conventional techniques.
          
    The detectors constructed using these films incorporated a novel hybrid technique, in which zinc-doped CdTe was pre-deposited onto a ceramic substrate and then connected to a TFT circuit substrate.
          
    To facilitate this goal, the control circuit substrate usually has cutouts to fit around the taller power components such as the transformer.
          
    The optical properties of the circuit substrate are included by modeling the effect of the ground plane adhesion layer and surface roughness.
          
      circuit substrates
    Flexible circuit substrates have been growing faster than rigid PCBs for the past few years, and will continue to find more applications in packaging.
          


    A new type of metallizition technology for ceramic circuit substrates which has advantages of both thick and thin film process has been deve-loped.The etching behavior of ceramic substrates was studied by SEM. The adhersion strength,solderability,sheet resistance,thermal conductivity and loss at microwave frequencies were determined. Furthermore, the temperature cycling and aging and other reliability tests were performed. The results of test and application show that by using this technology copper circuit...

    A new type of metallizition technology for ceramic circuit substrates which has advantages of both thick and thin film process has been deve-loped.The etching behavior of ceramic substrates was studied by SEM. The adhersion strength,solderability,sheet resistance,thermal conductivity and loss at microwave frequencies were determined. Furthermore, the temperature cycling and aging and other reliability tests were performed. The results of test and application show that by using this technology copper circuit patterns with strong adhersion can be fabricated onto the alumina ceramic substrates, which has excellent mechanical,electrical and thermal performance and good reliabili-ty,and which opens a new way for metallizition technology for microwave and hvbrid IC substrates.

    研制成功一种新型的陶瓷电路基板的金属化技术,它兼容了薄膜和厚膜技术的优点,采用SEM研究了陶瓷基体的浸蚀特性。测量了金属化导体的附着强度、可焊性、薄层电阻、导热能力及微波损耗,并进行了温循和老化等可靠性试验。测试及应用结果表明,采用该技术可在氧化铝瓷基板上制作附着牢固的铜金属化电路图形,其机、电、热性能优良,可靠性好,为微波和混合集成电路衬底金属化技术开辟了新的工艺途径。

    Bismaleimides, epoxy, acrylate and modifier were used as main materials to modify epoxy acrylate adhesive (MEA), whose curing bebavior was studied by IR and DSC and thermal stability was analyzed by TGA and DTA, Proderties of flexible polyimide film printed circuit board which is prepared from MEA adhesive were also characterized.

    本文研究了环氧丙烯酸酯的改性,采用双马来酰亚胺、环氧树脂、丙烯酸酯、改性剂为主要原料合成了改性环氧丙烯酸酯胶粘剂.运用IR、DSC等分析测试手段研究了该胶粘剂的固化行为。运用TGA、DTA等分析手段研究了该胶粘剂固化后的热稳定性.同时,用改性环氧丙烯酸酯胶粘剂制得了聚酰亚胺薄膜挠性印刷电路基板并测试了有关性能.

    Manufacturing high performance microwave modules in low cost approach is great significance to popularize and apply the complicated and costly electronic system. At present, the modules' production cost is comparatively high because the module is often produced with thin film or microwave PC board and the circuits tuning is often completed by experienced technician with manual operation. Advanced copper thick film material has excellent microwave performance and the thick film module can easily realize large-scale...

    Manufacturing high performance microwave modules in low cost approach is great significance to popularize and apply the complicated and costly electronic system. At present, the modules' production cost is comparatively high because the module is often produced with thin film or microwave PC board and the circuits tuning is often completed by experienced technician with manual operation. Advanced copper thick film material has excellent microwave performance and the thick film module can easily realize large-scale production, so the copper thick film technology is a high performance and low cost substrate production technology. Laser technology, combined with the automatic control and testing technology, can be used for automatic high precise accuracy tuning of the microwave modules. The advanced technology will greatly improve microwave modules' production efficiency and reduce the production cost.

    高性能、低成本的微波组件制造技术对复杂昂贵的电子系统的普及应用具有重要意义。目前 ,微波组件多采用薄膜或微波介质片工艺制造 ,其调试靠手工操作来完成 ,制造成本较高 ,生产一致性差。先进的铜厚膜工艺具有微波性能好、便于大批量生产等特点 ,是一种高性能、低成本的电路基板制造技术。激光技术与自动测试技术、自动控制技术相结合可实现对微波组件的高精度动态闭环自动化测试修调。采用这些先进技术 ,能提高生产效率 ,降低微波组件的制造成本。

     
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