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电路基板
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  circuit substrate
First, a triangular discretization method is employed to generate RC equivalent-circuit substrate models which are far less complex than those formulated by conventional techniques.
      
The detectors constructed using these films incorporated a novel hybrid technique, in which zinc-doped CdTe was pre-deposited onto a ceramic substrate and then connected to a TFT circuit substrate.
      
To facilitate this goal, the control circuit substrate usually has cutouts to fit around the taller power components such as the transformer.
      
The optical properties of the circuit substrate are included by modeling the effect of the ground plane adhesion layer and surface roughness.
      


A new type of metallizition technology for ceramic circuit substrates which has advantages of both thick and thin film process has been deve-loped.The etching behavior of ceramic substrates was studied by SEM. The adhersion strength,solderability,sheet resistance,thermal conductivity and loss at microwave frequencies were determined. Furthermore, the temperature cycling and aging and other reliability tests were performed. The results of test and application show that by using this technology copper circuit...

A new type of metallizition technology for ceramic circuit substrates which has advantages of both thick and thin film process has been deve-loped.The etching behavior of ceramic substrates was studied by SEM. The adhersion strength,solderability,sheet resistance,thermal conductivity and loss at microwave frequencies were determined. Furthermore, the temperature cycling and aging and other reliability tests were performed. The results of test and application show that by using this technology copper circuit patterns with strong adhersion can be fabricated onto the alumina ceramic substrates, which has excellent mechanical,electrical and thermal performance and good reliabili-ty,and which opens a new way for metallizition technology for microwave and hvbrid IC substrates.

研制成功一种新型的陶瓷电路基板的金属化技术,它兼容了薄膜和厚膜技术的优点,采用SEM研究了陶瓷基体的浸蚀特性。测量了金属化导体的附着强度、可焊性、薄层电阻、导热能力及微波损耗,并进行了温循和老化等可靠性试验。测试及应用结果表明,采用该技术可在氧化铝瓷基板上制作附着牢固的铜金属化电路图形,其机、电、热性能优良,可靠性好,为微波和混合集成电路衬底金属化技术开辟了新的工艺途径。

To acquire the substrate of high thermal conductivity, the technology for the growth of alumina film on aluminum substrates of high purity is investigated. The electric properties, temperature characteristic and surface topography of the aluminum substrates with alumina film are also analyzed. The results show that the substrates possess high thermal conductivity and excellent electric property, and meet the requirements of SMT.

针对当前SMT中集成电路基板散热难的问题,结合热设计方法,系统地研究了热液条件下在高纯度铝基片上生长氧化铝膜的技术,并对制成的基片电性能及其温度特性、表面形貌做了详细的测试与分析。结果表明:有氧化铝膜的铝基片既有高的散热性,又有好的电性能,完全符合SMT基板的要求,有广泛的应用前景。

The dielectric properties of epoxy resin were improved by cyanate.we used the improved epoxy resin and developed FR-4 printed circuit board with lower ε r and tgδ.The resting results of properties showed that PB not only had better dielectric properties,but also had others good properties comparable to FR 4.

本文采用氰酸酯改性环氧树脂体系 ,使之改性的环氧树脂体系介电性能提高 (低εr、低tgδ)。用此改性的树脂体系试制了高性能FR— 4印刷电路基板 ,性能测试结果表明 ,该印刷电路基板较通用FR— 4印刷电路基板介电性能优异以外 ,其它性能均达到了FR— 4同类制品的技术标准要求

 
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