The Si SiO x N y Al capacitors are fabricated on both <100>and <111> oriented Si by Rapid Thermal Nitridation (RTN)10nm SiO 2 films with a tungsten halogen lamp as radiation source heating.
用卤素钨灯作辐射热源快速热氮化 (RTN) 10 nm Si O2 膜 ,制备了〈10 0〉和〈111〉晶向 Si衬底上的 Si- Si Ox Ny-Al电容结构 .
By the rapid thermal nitridation (RTN) of ultra thin (10 nm) SiO 2 films, the ultra thin SiO x N y dielectric films had been prepared with tungsten halogen lamp as radiation source, and the Al/n Si/SiO x N y /Al capacitors had been fabricated too.
The Si SiO x N y Al capacitors are fabricated on both <100>and <111> oriented Si by Rapid Thermal Nitridation (RTN)10nm SiO 2 films with a tungsten halogen lamp as radiation source heating.
用卤素钨灯作辐射热源快速热氮化 (RTN) 10 nm Si O2 膜 ,制备了〈10 0〉和〈111〉晶向 Si衬底上的 Si- Si Ox Ny-Al电容结构 .
By the rapid thermal nitridation (RTN) of ultra thin (10 nm) SiO 2 films, the ultra thin SiO x N y dielectric films had been prepared with tungsten halogen lamp as radiation source, and the Al/n Si/SiO x N y /Al capacitors had been fabricated too.
The thermal-grow ultrathin (4 ~23nm) SiO2 was put in the rapid thermal processing (RTP) system in which there are tungstem--halogen lamps as thermal radiation sources system and the ultrathin SiO. N, films have been preparaed by rapid thermal nitridation (RTN) processing.
It is shown that thermal nitridation of the surface layers of the glass samples at a temperature of 375-495°C and a pressure of 0.1-1.0 MPa for 1-20 h brings about the breaking of the Si-O-Si bonds and the formation of the Si-N-Si and Si-N bonds.
The degree of structural transformation in the surface layer depends on the conditions of thermal nitridation and on the chemical composition of the glass.
Rapid thermal nitridation of SiO2 (96 ?) has been performed at three different temperatures: 1150°, 1200°, and 1250°C for a nitridation time up to 150 s.
For enhanced radiation hardness and impurity masking capability as well as higher permittivity, rapid thermal nitrided oxides may be a potential choice deserving further evaluation.
Rapid thermal nitridation of SiO2 (96 ?) has been performed at three different temperatures: 1150°, 1200°, and 1250°C for a nitridation time up to 150 s.
The rapid thermal nitridation of titanium films used as diffusion barriers between aluminum and silicon, has a major impact on shallow junction complementary metal oxide semiconductor technologies.
During the process of rapid thermal nitridation, the dopants in the junctions undergo a redistribution and affect the electrical properties of shallow junction structures.