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失效模式和机理
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  failure mode and mechanism
     DISTRIBUTION OF FAILURE MODE AND MECHANISM FOR SATELLITE—BORNE SEMICONDUCTOR DEVICES
     卫星用半导体器件失效模式和机理分布
短句来源
     The failure mode and mechanism of connectors with spring clip structure are analysed, and some improvement suggestions for enhancing the reliability of this kind of connectors are presented.
     主要对卡圈结构的连接器的失效模式和机理进行了分析,并对如何提高卡圈结构的连接器的可靠性提出了多项改进方案。
短句来源
  failure model and mechanism
     The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
     通过对多芯片组件(MCM)的结构、失效模式和机理的分析,提出了适合我国生产实际的MCM 失效率预计模型。
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  “失效模式和机理”译为未确定词的双语例句
     This paper analyzes the failure modes and failure mechanism for DC/DC converter, and demonstrates the deficiency in the reliability inspection methods of stabilizing temperature.
     本文在分析了DC/DC变换器失效模式和机理的基础上,论证了稳定温度可靠性检测方法的不足之处。
     Mechanism and Mode for TWT Failure and Analysis of its Quality Information Collection
     行波管的失效模式和机理及质量信息反馈的分析
短句来源
     The physical mechanismof die fracture is introduced and the impacts of the wafer thinning, dicing, ejector pin and mouldingprocesses of IC cards to the fracture of thin/ultra-thin silicon dies are investigated with regard to thearts and crafts and failure analysis of IC cards.
     本文分析了芯片碎裂的失效模式和机理,并结合实际IC卡制造工艺以及IC卡失效分析实例,就硅片减薄、划片、顶针及卡片成型工艺对薄IC芯片碎裂的影响进行深入探讨。
短句来源
  相似匹配句对
     The mechanism of the failure mode is anallyzed.
     分析了产生这种失效模式机理
短句来源
     Failure mode and mechanism of a MEMS relay
     MEMS开关的失效模式机理的分析
短句来源
     The failure modes and mechanisms were analyzed.
     研究了模块的失效模式失效机理
短句来源
     The Basic Failure Modes and Mechanisms of GaAs Microwave Monolithic Integrated Circuit (MMIC)
     GaAs微波单片集成电路的主要失效模式机理
短句来源
     Main Default Modes and Failure Mechanisms of Domestic Optoelectronic Coupler
     国产光电耦合器主要故障模式失效机理
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  failure mode and mechanism
A cumulative compendium of failure mode and mechanism data, quantified by providing their relative probabilities of occurrence.
      


Based on the gradually appeared failure model of wear-out failure,an extended test method is developed with the help of the stable wear stage theory.The method regards the wear life of main friction pair as the useful life of a product.On the condition of the failure mode and mechanism being unchanged,the method can be used to predict life characteristic value.Meanwhile,the samples are not needed to be tested until failure and the test time is reduced as well.

根据耗损失效产品的渐发性故障模型,应用稳定磨损阶段的理论,提出了一种延拓试验方法。该方法将产品关键摩擦副的磨损寿命作为产品的使用寿命,在失效模式和机理不变的情况下,既不需要试验样品做到失效,又缩短了试验时间,延拓预测产品寿命特征值。

Based on a few hundreds failure analysis reports completedwithin the period of 1987 to 1990 by Electronic Components ReliabilityCenter,CAST,MAS,a number of distribution patterns of pre—dissectionfailure modes and failure mechanisms for satellite—borne semiconductordevices have been obtained. The relevant percentages for failure modes are:logic out of control 36.3%,open circuit 22.2%,ect. The relevant percenta-ges for failure mechanisms are:aluminium corrosion 16.3%,mi(?)use 14.6%,ect.For the first time this...

Based on a few hundreds failure analysis reports completedwithin the period of 1987 to 1990 by Electronic Components ReliabilityCenter,CAST,MAS,a number of distribution patterns of pre—dissectionfailure modes and failure mechanisms for satellite—borne semiconductordevices have been obtained. The relevant percentages for failure modes are:logic out of control 36.3%,open circuit 22.2%,ect. The relevant percenta-ges for failure mechanisms are:aluminium corrosion 16.3%,mi(?)use 14.6%,ect.For the first time this work points out entirely and systematically thefailure modes and failure mechanisms for satellite—borne devices,wherebyprovides important basis for taking measures in satellite reliability designand optimally selecting devices and manufacturers.

以中国空间技术研究院电子元器件可靠性中心1987~1990四个年度数百份失效分析报告为依据,得到卫星用半导体器件解剖前失效模式分布:逻辑失控占36.3%,开路占22.2%等;失效机理分布:铝腐蚀占1 6.3%,使用不当占14.6%等。该项研究以第一手数据首次全面、系统指出卫星用器件失效模式和机理。为卫星可靠性设计、优选器件厂及器件厂采取措施提供重要依据。

The fracture of thin/ultra-thin silicon dies accounts for half of the failures of IC cards,and its failure modes and failure mechanism are not well understood then. The physical mechanismof die fracture is introduced and the impacts of the wafer thinning, dicing, ejector pin and mouldingprocesses of IC cards to the fracture of thin/ultra-thin silicon dies are investigated with regard to thearts and crafts and failure analysis of IC cards.

薄/超薄芯片的碎裂占据IC卡早期失效的一半以上,其失效模式、失效机理亟待深入研究。本文分析了芯片碎裂的失效模式和机理,并结合实际IC卡制造工艺以及IC卡失效分析实例,就硅片减薄、划片、顶针及卡片成型工艺对薄IC芯片碎裂的影响进行深入探讨。

 
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