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延展性磨削
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  “延展性磨削”译为未确定词的双语例句
     STUDY ON SEMI-DUCTILE REGIME GRINDING MODEL OF Si_3N_4 CERAMICS
     氮化硅陶瓷的半延展性磨削模型研究
短句来源
     This article analyses the material - removal mechanisms in grinding ceramics, and advertences the grinding model of ceramics semi - ductile regime grinding.
     对氮化硅陶瓷磨削表面进行实验观察,从理论上分析了陶瓷材料的加工机理,提出了陶瓷的半延展性磨削模型。
短句来源
  相似匹配句对
     Grinding Ceramics
     陶瓷的磨削
短句来源
     Abrasive Machining
     磨削加工
短句来源
     STUDY ON SEMI-DUCTILE REGIME GRINDING MODEL OF Si_3N_4 CERAMICS
     氮化硅陶瓷的半延展性磨削模型研究
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     The Tractility of VI Design
     VI设计延展性研究
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Elements with supersmooth surfaces are demanded in many fields along with thedevelopment of modern science and technology, which present high contour accuracy,extremely Iow surface roughness,perfect crystalline distribution and nondamaged layers.Lots of new fabricating techniques have been applied to obtain supersmooth surfaces withsurface roughness < 1 nm and contour accuracy < 30 nm,This paper introduces theapplication of such surfaces,and from the point of stock removing mechanism,discusses 6different superpolishing...

Elements with supersmooth surfaces are demanded in many fields along with thedevelopment of modern science and technology, which present high contour accuracy,extremely Iow surface roughness,perfect crystalline distribution and nondamaged layers.Lots of new fabricating techniques have been applied to obtain supersmooth surfaces withsurface roughness < 1 nm and contour accuracy < 30 nm,This paper introduces theapplication of such surfaces,and from the point of stock removing mechanism,discusses 6different superpolishing techniques. Bowl Feed Polishing,Teflon Polishing,Ion Beanfiguring, Float Polishing,Plasma Assisted Chemical Etching,Ductile Grinding.

现代科学技术的发展,在许多领域中提出了加工超光滑表面的要求。这种表面不仅要具备较高的面形精度和极低的表面粗糙度,同时要具有完整的表面晶格排布,消除加工损伤层。近年来国际出现了不少成功的超光滑表面加工技术,可以实现表面粗糙度小于1nm,面形精度优于30nm。本文介绍了超光滑表面的主要应用领域;从去除机理的角度讨论了BFP抛光、Teflon抛光、离子束加工、PACE加工、浮法抛光、延展性磨削等六种有代表性的超光滑表面加工技术;并对国内情况作了简单分析。

The characteristic of the acoustic emission signal produced by brittle destruction and plastic deformation while the ceramics being ground are studied.And the difference between them is described.So the change of machining mechanism could be monitored in the semiductile regime grinding process of hardbrittle materials and the parameters of grinding could be changed to make the materials being ground by plastic deformation as far as possible.

实验研究了陶瓷磨削时脆性破坏和塑性变形两种材料去除机理所产生的声发射信号特征,找出了它们之间的区别,为陶瓷等硬脆材料磨削时实现实时监测其加工、改变磨削工艺参数,使其尽可能地进行半延展性磨削提出了可靠的依据.

This article analyses the material - removal mechanisms in grinding ceramics, and advertences the grinding model of ceramics semi - ductile regime grinding. This grinding model reveals the basic characteristics of material - remoual mechanisms in grinding ceramics.

对氮化硅陶瓷磨削表面进行实验观察,从理论上分析了陶瓷材料的加工机理,提出了陶瓷的半延展性磨削模型。该模型揭示了磨削加工时陶瓷材料加工机理的基本特点,为实际生产中磨削工艺参数的优选提供了理论依据。

 
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