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   冷板 在 无线电电子学 分类中 的翻译结果: 查询用时:0.763秒
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冷板
相关语句
  cold plate
    An Experimental Study on Liquid Cold Plate
    液冷冷板的研究
短句来源
    Design and Optimization of Micro-channel Liquid-cooling Cold Plate
    微通道液冷冷板设计与优化
短句来源
    This paper analyses and introduces the cureent cstatus of the thermal design of electronic equipments,relates the features and advantages of cooling by cold plate,introduces the design process of a cold plate of a typical module and finally gives the general method of designing cold plate in different conditions.
    对电子设备的热设计现状进行了分析介绍 ,叙述了冷板冷却的特点和优越性 ,介绍了某组件冷板的设计过程 ,最后 ,给出了冷板在不同条件下的一般设计方法。
短句来源
    MEASUREMENT OF THE THERMAL CONDUCTIVITY OF BeO CERAMIC COLD PLATE/HEAT-DISSIPATING PLATE IN A THERMOELECTRICALLY REFRIGERATED INFRARED DETECTOR
    热电制冷红外探测器氧化铍瓷冷板和散热板导热系数的测量
短句来源
    Thermal conductivity is a key parameter characterizing theheat-conducting capability of the cold plate/heat-dissipating plate of thesemiconductor refrigerator in a thermoelectrically refrigerated infrared detector.
    氧化铍瓷导热系数是表征热电制冷红外探测器半导体制冷器部件冷板和散热板导热能力的关键参数。
短句来源
  cold-plate
    This paper concentrates on the study of heat transfer characteristics of rectangular channels Cold-Plate used in electronic devices , The experimental way and three-dimensional numerical simulation method are applied which is just carried out in our country.
    本文通过实验和三维数值模拟方法研究电子设备冷却用矩形通道空芯冷板的换热特性,这方面的研究在我国尚处于起步阶段。
短句来源
  refrigeration board
    Refrigeration Board Manufacturing of Power Amplifier Module
    功放组件冷板的制造工艺
短句来源
  “冷板”译为未确定词的双语例句
    Numerical Simulation of Vapor-Liquid Two-phase Flow and Heat Transfer Within A New Type of Heat Pipes for Spaced Heat Sources
    间隔热源加热下新型热管冷板内部汽液两相流动与传热的数值模拟
短句来源
    No-flow Prepreg (Low Flow Prepreg) and It’s Application in Rigid-flex and Heat Sink
    不流动(低流动度)半固化片及其在刚挠性板和冷板中的应用
短句来源
    2-D Numerical Simulation on Cooling Characteristics of Ventilated Rib in Electronic Equipments
    电子设备用冷板散热特性的二维数值模拟
短句来源

 

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      cold plate
    A study is made of a laminar boundary layer near a cold plate in the regime of weak viscous -inviscid interaction in the limit in which the free-stream Mach number tends to infinity and the temperature factor to zero.
          
    Analysis of heat transfer behaviour of the conduction cold plate system
          
    The heat-transfer behaviour of the conduction cold plate system used for avionics is investigated in this paper.
          
    The steady-state temperature profile for the cold plate is derived and the relationship between the coolant mass flowrate, the heat load and the highest cold plate temperature is established.
          
    A model is proposed to describe the transient thermal rosponse of the cold plate under thermal shock condition.
          
    更多          
      cold-plate
    The cold-plate temperature was varied in the range of -60 ?C to-14 ?C.
          
    The mushy-zone characteristics, the nature and distribution of chan-nels, and the associated fluid flows were studied as a function of initial solution concentration and cold-plate temperature.
          
    Figure 6 shows the sub-sampled mode that was actually monitored for the ISS cold-plate test.
          
    Hence, about 2000 input nodes would be required for the cold-plate example.
          


    This paper presents the analysis of rectangular ducts in forced cooling using the nurmerical method of couple conduction-convection. The influnce of wall conduction on heat transfer cofficients in rectangular ducts is discussed, and the cooling of electronic equipments with cold plate structure is analyzed by this method. Finally, All of the analytical results are compared with the experimental data.

    采用对流-导热耦合数值解法对矩形通道的强迫冷却进行了分析,讨论了壁面导热对矩形通道中换热系数的影响,并用此方法对电子设备冷却中广泛使用的冷板结构进行分析,最后对分析与实验结果进行了比较.

    Thermal conductivity is a key parameter characterizing theheat-conducting capability of the cold plate/heat-dissipating plate of thesemiconductor refrigerator in a thermoelectrically refrigerated infrared detector.In this paper,the principle and method of measuring the thermal conductivity ofBeO ceramics are disscussed,the equations are deduced,the key factors influecingmeasuring accuracy and appropriate measures of improving the measuring accuracy are revealed,and the requirements for specimen manufacturing...

    Thermal conductivity is a key parameter characterizing theheat-conducting capability of the cold plate/heat-dissipating plate of thesemiconductor refrigerator in a thermoelectrically refrigerated infrared detector.In this paper,the principle and method of measuring the thermal conductivity ofBeO ceramics are disscussed,the equations are deduced,the key factors influecingmeasuring accuracy and appropriate measures of improving the measuring accuracy are revealed,and the requirements for specimen manufacturing andassembling techniques are put forward.In the last part,conclusion is drawn with thereference of an example of measurement.

    氧化铍瓷导热系数是表征热电制冷红外探测器半导体制冷器部件冷板和散热板导热能力的关键参数。本文论述了氧化铍瓷导热系数的测量原理和方法,推导了计算公式,分析了影响测量精度的关键因素并提出了相应措施,对样品制作和装配工艺提出了要求。最后,给出了样品实测实例并得出结论。

    The vertical multijunction X rays detector is prepared by vaccum thermomigration.The stable thermal gradient field is established by high pure graphite to structure hot piece and pure iron block with a water cooled to structure cool piece.Temperatures of the hot piece and the cool piece are strictly controlled.The base material of the detector is high resistance single crystalline silicon.The grooves of the silicon wafer surface are formed by laser ablation,and high pure aluminium is deposited on the grooves,and...

    The vertical multijunction X rays detector is prepared by vaccum thermomigration.The stable thermal gradient field is established by high pure graphite to structure hot piece and pure iron block with a water cooled to structure cool piece.Temperatures of the hot piece and the cool piece are strictly controlled.The base material of the detector is high resistance single crystalline silicon.The grooves of the silicon wafer surface are formed by laser ablation,and high pure aluminium is deposited on the grooves,and the wafer is put in the thermal gradient field.Aluminium on the grooves is migrated and the vertical multijunction of lamellar consisting alternate p-and n-type silicon layer is fabricated.The electrode of the detector is formed by evaporated titanium,palladium,and silver according to requirement of the detector.The window material of the detector is formed by deposited aluminium layer after surface passivation.The detectors have a excellent spectral response and higher sensitivity at the range of X rays.It can be adapted for mesument of X rays of bigger dosage radition and wider intensity change.

    用真空热迁移法,以高纯石墨作为加热元件,构成大面积均匀热板,并以纯铁为冷板,通过严格控制冷、热板的温度,形成稳定的热梯度场.采用高阻单晶硅作为探测器的基体材料,在硅片表面用激光来进行刻槽,在其表面上蒸铝后,置于热迁移场中进行热迁移.按照探测器的要求,蒸发钛-钯-银构成电极,经钝化处理后沉积适当厚度的Al层作为窗口,构成垂直多重结X射线探测器.探测器具有良好的光谱响应,对X射线有较高的灵敏度,适于较大的X射线剂量辐射测量和较宽的X射线强度变化的测量.

     
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