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光收发器件    
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  optical transceiver
    The results demonstrate that the flip chip technology can implement high precise and reliable interconnect between the chip and the substrate. The technology used in the photoelectric device can realize miniaturization and batch production of optical devices, and can highly improve the transmitting speed of the optical transceiver modules.
    试验结果表明,倒装芯片技术可实现芯片与基板的高精度、高可靠性的互连,这种技术用于光收发器件的封装,可实现光电子器件的小型化和批量化生产,并能大大提高光收发模块的传输速率.
短句来源
  optical transceiver
    The results demonstrate that the flip chip technology can implement high precise and reliable interconnect between the chip and the substrate. The technology used in the photoelectric device can realize miniaturization and batch production of optical devices, and can highly improve the transmitting speed of the optical transceiver modules.
    试验结果表明,倒装芯片技术可实现芯片与基板的高精度、高可靠性的互连,这种技术用于光收发器件的封装,可实现光电子器件的小型化和批量化生产,并能大大提高光收发模块的传输速率.
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  optical transceiver
Optical communication systems are described like a waveguide grating based wavelength demultiplexer, an optical transceiver using self aligned detector and emitter as well as a tapered fibre coupler, and an integrated optical amplifier.
      
To understand the performance limits of the system using an EAM as the optical transceiver, we vary the optical modulation index (OMI) of the transmitter for different bias voltages to the EAM.
      
A simple wavelength splitter within the SLR2000 optical transceiver would divert the incoming communications photons to a separate optical receiver.
      
A system block diagram of an optical transceiver rent, ISS, turning off the other transistor.
      
A simple noise filter is mandatory for the power lines for the TOSLINK optical receiving module and optical transceiver module.
      
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The situation of photo receiving technology opplied in optical transmission system is introduced, especially the development level of optical external modulation technology such as electroabsorption (EA) modulator、LiNbO3 modulator and UTC-PD is described. It is indicated that the certain trend of photo receiver/transmitter is ultra-broadband 、high-speed and high integration.

介绍了光收发器技术在光纤传输系统中的应用现状,重点叙述了光外调制技术(比如电吸收型调制器、LiNbO3调制器等)、单行载流子光电管(UTC-PD)的发展水平,指出高宽带、高速率、高集成化是光收发器件发展的必然趋势。

The requirements for the substrate and the solder are analyzed in the flip_chip technology used in photoelectronics device packaging. The solder pump structure for the flip chip bonding of the laser diode and the photoelectric detector are designed and fabricated in the silicon substrate, and the die bonding tests are implemented by using the automatic die bonder. The results demonstrate that the flip chip technology can implement high precise and reliable interconnect between the chip and the substrate. The...

The requirements for the substrate and the solder are analyzed in the flip_chip technology used in photoelectronics device packaging. The solder pump structure for the flip chip bonding of the laser diode and the photoelectric detector are designed and fabricated in the silicon substrate, and the die bonding tests are implemented by using the automatic die bonder. The results demonstrate that the flip chip technology can implement high precise and reliable interconnect between the chip and the substrate. The technology used in the photoelectric device can realize miniaturization and batch production of optical devices, and can highly improve the transmitting speed of the optical transceiver modules.

分析了倒装芯片技术在光电子器件封装中应用时对基板和焊料的性能要求,在硅基板上设计和制作了用于激光芯片和光电探测器贴片的焊料凸点结构,并应用全自动贴片设备进行了贴片工艺试验.试验结果表明,倒装芯片技术可实现芯片与基板的高精度、高可靠性的互连,这种技术用于光收发器件的封装,可实现光电子器件的小型化和批量化生产,并能大大提高光收发模块的传输速率.

 
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