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copper clad
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  覆铜板
     JPCA-BM03-2003 Copper Clad Laminate for Flexible Printed Wiring Boards
     JPCA-BM03-2003挠性印制线路板用覆铜板(胶粘剂型和无胶粘剂型)
短句来源
     New Synthesis Process of Brominized Epoxy Resin for FR-4 Copper Clad Panel
     FR-4覆铜板专用溴化环氧树脂合成新工艺
短句来源
     Causes and Prevention of Copper Clad Laminate and PCB Warpage
     覆铜板和PCB板翘曲成因与预防措施
短句来源
     Various polyimide was synthesized from 3-BAPP with various dianhydrides. The application of the polyimiders to two-layer flexible copper clad laminate(2L-FCCL)was researched.
     用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。
短句来源
     Development of Novel Green Environment-friendly P-N-ATH Copper Clad Laminate
     新型环保绿色P-N-ATH型覆铜板的研制
短句来源
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  覆铜箔
     Halogen-free Copper Clad Laminate for Test Method-JPCA-ES-01-1999
     无卤型覆铜箔层压板的试验方法——玻纤布基材环氧树脂 JPCA-ES-01-1999
短句来源
     Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000
     印制线路板用无卤型覆铜箔层压板——玻纤布·环氧树脂 JPCA-ES-04-2000
短句来源
     Halogen-free Copper Clad Laminate for Multilayer PCB-JPCA-ES-05-2000
     多层印制线路板用无卤型覆铜箔层压板——玻纤布基材环氧树脂 JPCA-ES-05-2000
短句来源
     This article introduces the performance of chinese alumnium hydroxides(Al 2O 3·nH 2O) and its application to CEM 3 type Copper Clad laminate(CCL).
     本文介绍了国产氢氧化铝 ( Al2 O3· n H2 O)填料的性能指标及其在 CEM- 3型覆铜箔层压板 ( CCL)中的应用工艺、CCL性能。
短句来源
     Cure kinetics of diglycidyl ether of bisphenol-A/dicyandiamide system for copper clad laminates
     覆铜箔层压板专用双酚A二缩水甘油醚/双氰胺体系的固化反应动力学
短句来源
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  铜包铝
     MACHINING PROCEDURE AND SOLID-STATE BONDING MECHANISM OF CLAD-PROCESS WELDING COPPER CLAD ALUMINUM WIRE
     包复焊接铜包铝线加工工艺与固相结合机理研究
短句来源
     Quality analysis and production process of T2 Copper Clad Aluminum
     铜包铝紫铜带的生产工艺与质量分析
短句来源
     Standardization for copper clad aluminium wire
     铜包铝线标准化
短句来源
     Microstructure and mechanical properties of copper clad aluminum wire by drawing at room temperature
     铜包铝线材室温拉变形后的显微组织和力学性能
短句来源
     The present and future of the manufacturing technology for copper clad aluminium bimetallic wires
     铜包铝复合线材制造技术的发展现状与前景
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  “copper clad”译为未确定词的双语例句
     The Application of Epoxy Bromide/Novolacs in CEM-3 Copper Clad Laminate
     溴化环氧/Novolacs体系在CEM-3板中的应用
短句来源
     Study of Control Model of Induction Heating on Copper Clad Steel Contact Wire
     铜包钢接触线的感应加热控制模型研究
短句来源
     HIGH STRENGTH COPPER CLAD STAINLESS STEEL WIRE
     高强度铜包不锈钢电线
短句来源
     The Interface Quality of Copper Clad Steel Wire Produced by Liquid-solid Bonding Process
     液-固相复合工艺对铜包钢线界面质量的影响
短句来源
     Numerical Simulation on Process of Liquid and Solid Inverted Solidification of Cu/Fe in Copper Clad Steel
     包铜钢线液固相反向凝固过程的数值模拟
短句来源
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  copper clad
Plan lead missiles and those partially clad with copper often leave traces of lead along their paths, while those that are completely copper clad do not.
      
Consequently, thermal stability of copper clad laminates, a major component in printed circuit boards, is a critical issue in electronic packaging industries.
      
On the mechanism of popcorn blistering in copper clad laminates
      
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      
The substrates use copper clad films, laser drilling, and selective plating to create plane pairs.
      
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The dynamic stability in CVD Nb3Sn superconducting tapes has been studied both theoretically and experimentally. In consideration of a twodimensional model, the stability criterion has been found to bewhere ηis the volume fraction of the superconductor, ω is a parameter eharacteriging the superconducting tape geometry and the cooling condition. Using the above criterion, we show that there exists a optimum copper-clad thickness, which have maximum of the overall critical current density. This thickness...

The dynamic stability in CVD Nb3Sn superconducting tapes has been studied both theoretically and experimentally. In consideration of a twodimensional model, the stability criterion has been found to bewhere ηis the volume fraction of the superconductor, ω is a parameter eharacteriging the superconducting tape geometry and the cooling condition. Using the above criterion, we show that there exists a optimum copper-clad thickness, which have maximum of the overall critical current density. This thickness is determined by expressionwhere ξ is the ratio of the thickness of the matrix to that of the superconductor. We have discussed the effects of the conductor geometry, thickness of copper-clothing dcu, condition of cooling, applied magnetic field and transport current on the stability. With dcu reaching a certain value, a transition is made from dynamic stability to cryostatic stability. The theory is in good agreement with the results of the experiments by using simulation coils.

从理论和实验上研究了CVD Nb_3Sn超导带的动态稳定性.基于二维平板模型,给出了稳定性判据,式中η为超导体所占的体积分数,ω为表征超导带几何尺寸和所处冷却条件的传热参量.应用上述判据,可证明存在一个使超导带具有最大全电流密度的最佳敷铜厚度.最佳敷铜厚度由公式所确定,其中ξ为基体与Nb_3Sn层厚度之比.讨论了导体尺寸、敷铜厚度、冷却条件以及外磁场和传输电流的大小等因素对稳定性的影响.并且得出当敷铜厚度达到某一确定值时,就由动态稳定过渡到全稳定.采用模拟线圈所作的实验研究表明,理论和实验结果符合较好.

The configuration features of copper clad NbTi wires with 1, 55, 3025 and 6655 filaments by hydrostatic extrusion (HE) have been investigated. The results have been compared with those of the products by hot common extrusion, showing that the configuration of NbTi superconducting material produced by HE is much better than that by common processes. Moreover, HE is found to have less geometrical loss of material. Experiments prove that NbTi superconducting wires with extrafine multifila-ments (filament...

The configuration features of copper clad NbTi wires with 1, 55, 3025 and 6655 filaments by hydrostatic extrusion (HE) have been investigated. The results have been compared with those of the products by hot common extrusion, showing that the configuration of NbTi superconducting material produced by HE is much better than that by common processes. Moreover, HE is found to have less geometrical loss of material. Experiments prove that NbTi superconducting wires with extrafine multifila-ments (filament diameter < 1μm) can be obtained by HE.

本文探讨了用350吨静液挤压机加工的铌钛复铜单芯棒、55芯、3025芯及三元6655芯复合超导体的几何形状、芯线沿横断面及轴向分布情况.得出:用静液挤压法生产的Nb-Ti超导复合线,其质量超过一般加工工艺的,挤压时的几何损失少,较一般工艺成材率高.并得出,用静液挤压法加工多芯极细芯(<1μm)Nb-Ti超导复合线是可能的.

This paper introduced the research about the micro structure and the properties of the surface layer and the ferronickel core-copper clad boundary layer of dumet wire by means of AES、WDS and x-ray diffraction. The results show that the good surface layer consisting of a mixture of Cu2O and noncrystalline borax;The wettability between the glass and dumet wire depends on both the cleanliness and constitution of surface layer and the heating conditions.

利用AES、WDS和x-射线衍射等方法,研究了杜美丝表面层、铁镍芯与覆铜层界面的微观结构与特性。结果表明:良好的表面层应由Cu2O和非晶态的硼砂构成;玻璃与杜美丝的润湿性决定于表面层的净化程度和构成及加热条件。

 
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