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copper clad
相关语句
  覆铜板
    STUDY ON AND SYNTHESIS OF EPOXY RESIN SPECIAL FOR FR-4 COPPER CLAD LAMINATE
    FR-4覆铜板专用环氧树脂的研究与合成
短句来源
    THERMOSETTING RESIN FOR HIGH PERFORMANCE COPPER CLAD LAMINATE
    高性能覆铜板用热固性树脂
短句来源
    Study of Halogen-free Copper Clad Laminate of Epoxy Resin with Dicyandiamide
    双氰胺固化环氧树脂制备无卤化覆铜板的研究
短句来源
    Development of Novel Green Environment-friendly P-N-ATH Copper Clad Laminate
    新型环保绿色P-N-ATH型覆铜板的研制
短句来源
    Cross-linkable polyphenylene ether resin for high performance copper clad laminate
    高性能覆铜板用交联性聚苯醚树脂
短句来源
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  覆铜箔
    Synthesis and reaction kinetics of diglycidyl ether of bisphenol-A for copper clad laminates
    覆铜箔层压板专用双酚A二缩水甘油醚的合成及反应动力学
短句来源
    APPLICATION OF STYRENE-MALEIC ANHYDRIDE COPOLYMER(SMA) RESIN IN COPPER CLAD LAMINATE
    苯乙烯-马来酸酐树脂在覆铜箔板中的应用
短句来源
    STUDY ON THE CURE KINETICS OF BROMINATED EPOXY RESIN/ DICYANDIAMIDE SYSTEM FOR COPPER CLAD LAMINATES
    覆铜箔层压板专用低溴环氧树脂/双氰胺体系的固化反应动力学
短句来源
    Studies on a novel non-halogen flame-retarding copper clad laminate
    一种新型无卤阻燃覆铜箔板基板材料的制备
短句来源
    The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates
    覆铜箔层压板专用环氧树脂的合成与性能
短句来源
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  “copper clad”译为未确定词的双语例句
    The Application of Epoxy Bromide/Novolacs in CEM-3 Copper Clad Laminate
    溴化环氧/Novolacs体系在CEM-3板中的应用
短句来源
    The curing reaction and curing kinetics characteristics of PPE/TAIC system are also investigated by FTIR spectra and the program-heated DSC method,focusing on the practical fabrication process of a copper clad laminate.
    采用红外(FTIR)和程序升温的微差扫描量热(DSC)法,研究了PPE/TAIC体系的固化反应和固化动力学特征.
短句来源
    SYNTHESIS OF BROMINE CONTAINING EPOXY RESIN SPECIAL FOR COPPER CLAD LAMINATES
    敷铜板专用含溴环氧树脂的合成
短句来源
    TECHNICAL PROGRESS OF COPPER FOIL ADHESIVE FOR COPPER CLAD PANEL IN JAPAN
    日本覆铜板铜箔胶粘剂的技术进展
短句来源
    HIGH FREQUENCY PRINTED CIRCUIT BASIC BOARD-TRIAZINE COPPER CLAD PANEL
    高频线路板基板──三嗪覆铜板
短句来源
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  copper clad
Plan lead missiles and those partially clad with copper often leave traces of lead along their paths, while those that are completely copper clad do not.
      
Consequently, thermal stability of copper clad laminates, a major component in printed circuit boards, is a critical issue in electronic packaging industries.
      
On the mechanism of popcorn blistering in copper clad laminates
      
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      
The substrates use copper clad films, laser drilling, and selective plating to create plane pairs.
      
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An investigation was made on the patents related to the copper foil adhesives used for copper clad panels issued in Japan in recent years,and a lot of tests were made by the author. In this paper a dicussion was given to the technical progress and the characteristics of the adhesive formula design in Japan.

本文作者对近年来日本发表的覆铜板铜箔胶粘剂专利进行了研究,做了许多试验,并在此基础上对日本的技术进展和胶粘剂配方设计的特点进行了探讨。

A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The development of copper clad panel (CCP), the composition, the formula techmique and new requirements for epoxy resins were presented in this paper

本文介绍敷铜板发展概况、组成配方技术及对环氧树脂提出的新要求。

 
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