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   copper clad 在 金属学及金属工艺 分类中 的翻译结果: 查询用时:0.009秒
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copper clad
相关语句
  铜包铝
    MACHINING PROCEDURE AND SOLID-STATE BONDING MECHANISM OF CLAD-PROCESS WELDING COPPER CLAD ALUMINUM WIRE
    包复焊接铜包铝线加工工艺与固相结合机理研究
短句来源
    Quality analysis and production process of T2 Copper Clad Aluminum
    铜包铝紫铜带的生产工艺与质量分析
短句来源
    Microstructure and mechanical properties of copper clad aluminum wire by drawing at room temperature
    铜包铝线材室温拉变形后的显微组织和力学性能
短句来源
    Application advantage of CCAW(copper clad aluminum wire) and processing technology of clad-process welding CCAW were introduced. The effect factor of solid-state bonding during drawing the bimetal wire was analyzed.
    介绍了铜包铝线的使用优点和包复焊接铜包铝线加工工艺过程,分析了通过双金属拉拔实现金属间固相结合的影响因素;
短句来源
    This article introduces the production process of T2 Copper Clad Aluminum Analyses the factors influence surface quality of T2 CCA ,and puts forward the control measure also.
    本文简述了铜包铝紫铜带的生产工艺,并对生产中影响铜包铝紫铜带表面质量的主要因素和控制措施进行了论述。
短句来源
  “copper clad”译为未确定词的双语例句
    HIGH STRENGTH COPPER CLAD STAINLESS STEEL WIRE
    高强度铜包不锈钢电线
短句来源
    Technological experiment of manufacturing copper clad weld wire with extrusion method
    铜包钢复合线材的挤压成形工艺试验
短句来源
    Numerical Simulation on Process of Liquid and Solid Inverted Solidification of Cu/Fe in Copper Clad Steel
    包铜钢线液固相反向凝固过程的数值模拟
短句来源
    The Interface Quality of Copper Clad Steel Wire Produced by Liquid-solid Bonding Process
    液-固相复合工艺对铜包钢线界面质量的影响
短句来源
    Application of Pre-coating Copper Process without Cyanogen to Production of Copper Clad Steel Wire
    无氰预镀铜工艺在铜包钢丝生产中的应用
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  copper clad
Plan lead missiles and those partially clad with copper often leave traces of lead along their paths, while those that are completely copper clad do not.
      
Consequently, thermal stability of copper clad laminates, a major component in printed circuit boards, is a critical issue in electronic packaging industries.
      
On the mechanism of popcorn blistering in copper clad laminates
      
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      
The substrates use copper clad films, laser drilling, and selective plating to create plane pairs.
      
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This paper introduced the research about the micro structure and the properties of the surface layer and the ferronickel core-copper clad boundary layer of dumet wire by means of AES、WDS and x-ray diffraction. The results show that the good surface layer consisting of a mixture of Cu2O and noncrystalline borax;The wettability between the glass and dumet wire depends on both the cleanliness and constitution of surface layer and the heating conditions.

利用AES、WDS和x-射线衍射等方法,研究了杜美丝表面层、铁镍芯与覆铜层界面的微观结构与特性。结果表明:良好的表面层应由Cu2O和非晶态的硼砂构成;玻璃与杜美丝的润湿性决定于表面层的净化程度和构成及加热条件。

The transverse compression and rolling deformation of explosion-formed steel-copper clad plate were investigated by tests on compression machine and rolling mill This paper gives a mathematical model of the stress and strain state coefficient of the deformation zone,The predictions by the model are in agreement with the experimental results.

利用压力试验机和二辊轧机,在外力和压下方向平行于复合面的变形方式下进行了实验提出了确定变形区应力状态系数Q_p的方法,建立了Q_p数学模型。并对Q_p模型进行了实验验证,表明模型精度较好。

To establish the physics model of conductivity property in copper-clad and tinning copper-clad steel wire,give the way of calculating the basic parameter of them through design of plating technology and extract plating machine,meanwhile being checked by a set of test data,it shows that theory calculation results consist well with test results.

建立了铜包钢线及镀锡铜包钢线导电特性的物理模型,给出了电镀工艺和引镀机设计中计算铜包钢线及镀锡铜包钢线基本参数的方法,并用一组实验数据进行验算,结果证明理论计算和实验结果具有很好的一致性。

 
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