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copper clad
相关语句
  覆铜板
    Development of PPO/Epoxy Glassfiber Cloth Copper Clad Laminate
    PPO/环氧玻璃布覆铜板的研制
短句来源
    Rheometer Application in Copper Clad Laminate Working Procedure
    流变仪在覆铜板工序中的应用
短句来源
    Polyimide Film for Flexible Copper Clad Laminate
    用于挠性覆铜板的聚酰亚胺膜
短句来源
    Flexible Copper Clad Laminate
    挠性覆铜板
短句来源
    JPCA-BM03-2003 Copper Clad Laminate for Flexible Printed Wiring Boards
    JPCA-BM03-2003挠性印制线路板用覆铜板(胶粘剂型和无胶粘剂型)
短句来源
更多       
  覆铜箔
    Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000
    印制线路板用无卤型覆铜箔层压板——玻纤布·环氧树脂 JPCA-ES-04-2000
短句来源
    Halogen-free Copper Clad Laminate for Multilayer PCB-JPCA-ES-05-2000
    多层印制线路板用无卤型覆铜箔层压板——玻纤布基材环氧树脂 JPCA-ES-05-2000
短句来源
    Halogen-free Copper Clad Laminate for Test Method-JPCA-ES-01-1999
    无卤型覆铜箔层压板的试验方法——玻纤布基材环氧树脂 JPCA-ES-01-1999
短句来源
    Trial of Test Methods for Bow and Twist of as Received and After Heated Cellulose Paper and Composite Copper Clad Laminates
    纸基·复合基覆铜箔板常态及受热后的翘曲测试方法的试用
短句来源
    This paper introduces the test methods and try using for bow and twist as received and after heated forcellulose paper and composite copper clad laminated sheets.
    概述了一种纸基·复合基覆铜箔板常态及受热后的翘曲测试方法及试用情况。
短句来源
  “copper clad”译为未确定词的双语例句
    The Present Situation of Manufacturing Copper Clad Laminates With UV-block
    紫外光屏蔽覆铜板de生产现状
短句来源
    Research of Epoxy Resin Polymer (ERP) and Acrylic Resin Polymer (ARP)——Interconnected Structure Flexible Copper Clad Laminates (ISFCCL) for FPC
    挠性印制板用环氧聚合物与聚丙烯酸脂共聚物——互穿网络挠性基材的研究
短句来源
    As environment and health become more and more seriously concerned in the world,the electronic packaging material and process are facing the challenge of changeover to "green" This paper reviews the state of the art of the development of lead free solders,lead free coatings,copper clad laminate flame retardants and environment protection cleaning Considerations and directions in further research and development are discussed
    随着环境、健康问题成为全球的关注焦点 ,电子封装材料和工艺面临着向“绿色”转变的挑战。 文章讨论了电子封装无铅焊料、无铅涂层、印制电路敷铜基板阻燃剂、环保型清洗的研究状况 ,并指出了进一步开发需要注意的问题和发展的方向。
短句来源
    Of the low expansion coefficient copper clad laminates based on thus modified BT resin and quartz fabric, the expansion coefficient is 3.1106C1 (x-y orientation) and 1.3105C1 (z orientation).
    其平面方向热膨胀系数为3.1106℃1,厚度方向为1.3105℃1,优于国外同类产品;
短句来源
    The recognition and category of the flaw of Copper Clad Laminates were achieved in this paper.
    对铜箔基板生产过程中产生的疵点进行了有效的识别与分类。
短句来源
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  copper clad
Plan lead missiles and those partially clad with copper often leave traces of lead along their paths, while those that are completely copper clad do not.
      
Consequently, thermal stability of copper clad laminates, a major component in printed circuit boards, is a critical issue in electronic packaging industries.
      
On the mechanism of popcorn blistering in copper clad laminates
      
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      
The substrates use copper clad films, laser drilling, and selective plating to create plane pairs.
      
更多          


This paper introduces technical progress in high frequency copper clad used in circuit at home & aboard ,mainly studies the adhesive of isocyanate modified with epoxy resin.The results of the research show that laminates made of the adhesive and E glass fiber cloth have advantages of low cost and good dielectric property.

本文介绍了国内外高频电路用覆铜板的技术进展 ,着重研究了一种环氧改性异氰酸酯类粘合剂 ,结果表明采用该粘合剂 /E型玻璃纤维布制备的层压板产品具有成本低、介电性能良好等特点

The significance of R & D of environmentally friendly flame-retarded copper clad laminates of epoxy resin is presented. Discussed is how to develop the above-said product by means of the followings: non-halogen flame-retarded epoxy resins containing nitrogen; phosphorus; silicon fire-proofing hardeners containing phosphorus, nitrogen or phosphorus and nitrogen; and additives of organic phosphorous fire-proofing agents, inorganic flame retarded compounds such as aluminum hydroxide. The tendency of the study...

The significance of R & D of environmentally friendly flame-retarded copper clad laminates of epoxy resin is presented. Discussed is how to develop the above-said product by means of the followings: non-halogen flame-retarded epoxy resins containing nitrogen; phosphorus; silicon fire-proofing hardeners containing phosphorus, nitrogen or phosphorus and nitrogen; and additives of organic phosphorous fire-proofing agents, inorganic flame retarded compounds such as aluminum hydroxide. The tendency of the study in this field is also discussed.

论述了环境友好阻燃环氧树脂覆铜板研究开发的意义。提出通过开发并使用含氮、磷或硅的非卤阻燃型环氧树脂,含磷、氮或磷-氮的功能性阻燃固化剂和在体系中添加有机磷阻燃剂、氢氧化铝等无机阻燃剂等途径来开发环境友好阻燃环氧树脂覆铜板。并对我国在今后该领域的研究作了展望。

As environment and health become more and more seriously concerned in the world,the electronic packaging material and process are facing the challenge of changeover to "green" This paper reviews the state of the art of the development of lead free solders,lead free coatings,copper clad laminate flame retardants and environment protection cleaning Considerations and directions in further research and development are discussed

随着环境、健康问题成为全球的关注焦点 ,电子封装材料和工艺面临着向“绿色”转变的挑战。文章讨论了电子封装无铅焊料、无铅涂层、印制电路敷铜基板阻燃剂、环保型清洗的研究状况 ,并指出了进一步开发需要注意的问题和发展的方向。

 
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