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copper clad laminate
相关语句
  覆铜板
     JPCA-BM03-2003 Copper Clad Laminate for Flexible Printed Wiring Boards
     JPCA-BM03-2003挠性印制线路板用覆铜板(胶粘剂型和无胶粘剂型)
短句来源
     Causes and Prevention of Copper Clad Laminate and PCB Warpage
     覆铜板和PCB板翘曲成因与预防措施
短句来源
     Various polyimide was synthesized from 3-BAPP with various dianhydrides. The application of the polyimiders to two-layer flexible copper clad laminate(2L-FCCL)was researched.
     用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。
短句来源
     Development of Novel Green Environment-friendly P-N-ATH Copper Clad Laminate
     新型环保绿色P-N-ATH型覆铜板的研制
短句来源
     In the paper, the manufacturer and the base material including PI film and copper foil in Flexible Copper Clad Laminate (FCCL) were reviewed from 2003 to 2004. At the same, the development of technology and product was introduced.
     该文主要阐述2003年 ̄2004年间挠性覆铜板在生产厂家及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。
短句来源
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  覆铜箔层压板
     Halogen-free Copper Clad Laminate for Test Method-JPCA-ES-01-1999
     无卤型覆铜箔层压板的试验方法——玻纤布基材环氧树脂 JPCA-ES-01-1999
短句来源
     Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000
     印制线路板用无卤型覆铜箔层压板——玻纤布·环氧树脂 JPCA-ES-04-2000
短句来源
     Halogen-free Copper Clad Laminate for Multilayer PCB-JPCA-ES-05-2000
     多层印制线路板用无卤型覆铜箔层压板——玻纤布基材环氧树脂 JPCA-ES-05-2000
短句来源
     This article introduces the performance of chinese alumnium hydroxides(Al 2O 3·nH 2O) and its application to CEM 3 type Copper Clad laminate(CCL).
     本文介绍了国产氢氧化铝 ( Al2 O3· n H2 O)填料的性能指标及其在 CEM- 3型覆铜箔层压板 ( CCL)中的应用工艺、CCL性能。
短句来源
     Application of Chinese Aluminium Hydrorides to CEM-3 Type Copper Clad laminate
     国产氢氧化铝填料在CEM-3型覆铜箔层压板中的应用
短句来源
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  “copper clad laminate”译为未确定词的双语例句
     The Application of Epoxy Bromide/Novolacs in CEM-3 Copper Clad Laminate
     溴化环氧/Novolacs体系在CEM-3板中的应用
短句来源
     The curing reaction and curing kinetics characteristics of PPE/TAIC system are also investigated by FTIR spectra and the program-heated DSC method,focusing on the practical fabrication process of a copper clad laminate.
     采用红外(FTIR)和程序升温的微差扫描量热(DSC)法,研究了PPE/TAIC体系的固化反应和固化动力学特征.
短句来源
     Experiment results showed that copper and aluminum metals distributed in the slot have liberated from nonmetals around 5 mm,copper metal around 0.5 mm in the copper clad laminate was liberated from non-metals.
     试验结果表明 :插槽中的铝和铜在 5mm左右已经解离 ,电路板基板上的铜在 0 5mm左右基本获得解离 ;
短句来源
     The authors obtained a modified resin system with high performance for copper clad laminate,which was prepared from 4,4' diphenylbismaleimide,diallylbisphenol A,bromic epoxy and dicyandiamide with suitable proportion and pre polymerization.
     以 4 ,4’-双马来酰亚胺基二苯甲烷、二烯丙基双酚 A、溴化环氧树脂、双氰胺等为主要原料 ,采用预聚法工艺获得性能优良的改性树脂体系。
短句来源
     Copper clad laminate′s automation system
     铜箔覆胶机自动控制系统
短句来源
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  copper clad laminate
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      


A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad...

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.

介绍了高可靠电镀Ni/Au工艺在PTFE微波印制电路上的应用,并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ni/Au镀层之间附着力的措施。。通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

 
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