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copper clad laminate
相关语句
  覆铜板
    STUDY ON AND SYNTHESIS OF EPOXY RESIN SPECIAL FOR FR-4 COPPER CLAD LAMINATE
    FR-4覆铜板专用环氧树脂的研究与合成
短句来源
    THERMOSETTING RESIN FOR HIGH PERFORMANCE COPPER CLAD LAMINATE
    高性能覆铜板用热固性树脂
短句来源
    Study of Halogen-free Copper Clad Laminate of Epoxy Resin with Dicyandiamide
    双氰胺固化环氧树脂制备无卤化覆铜板的研究
短句来源
    Development of Novel Green Environment-friendly P-N-ATH Copper Clad Laminate
    新型环保绿色P-N-ATH型覆铜板的研制
短句来源
    Cross-linkable polyphenylene ether resin for high performance copper clad laminate
    高性能覆铜板用交联性聚苯醚树脂
短句来源
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  覆铜箔层压板
    Using the modifiedresin system as matrix, and the glass fiber as reinforcement, and acetone as mainsolvent, the impregnant and half-cured sheet with fine properties are prepared, what’smore, the copper clad laminate based on the modified resin system show goodmechanical and dielectrical properties.
    以玻璃纤维为增强材料,改性树脂体系为基体树脂,丙酮作为主要溶剂,制备了储存稳定性优良的胶液和半固化片,压制得到的覆铜箔层压板具有良好的力学性能和电气性能。
短句来源
    The finest resin system is settled down through experiment and analysis. Thesolubility, curing kinetic and mechanism of the modified resin are studied by FTIRinfrared and DSC apparatus, as well as the confect of impregnant, impregating, drynessand laminate processing of the copper clad laminate.
    通过实验及分析确定了最佳的树脂配方体系,利用傅立叶红外光谱仪、差示扫描量热分析仪等分析手段对改性树脂体系的凝胶特性、反应特性、固化机理及反应动力学进行了详细的研究,并对覆铜箔层压板成型工艺中胶液的配制、浸胶、干燥以及热压工艺进行了深入研究,确定了各道工序的主要影响因素并最终确定了适宜的成型工艺。
短句来源
  “copper clad laminate”译为未确定词的双语例句
    The Application of Epoxy Bromide/Novolacs in CEM-3 Copper Clad Laminate
    溴化环氧/Novolacs体系在CEM-3板中的应用
短句来源
    The curing reaction and curing kinetics characteristics of PPE/TAIC system are also investigated by FTIR spectra and the program-heated DSC method,focusing on the practical fabrication process of a copper clad laminate.
    采用红外(FTIR)和程序升温的微差扫描量热(DSC)法,研究了PPE/TAIC体系的固化反应和固化动力学特征.
短句来源
    DEVELOPMENT OF THERMOSETTING PHENOLIC RESIN USED IN COPPER CLAD LAMINATE BASED ON PAPER IN CHINA
    国内纸基覆铜箔板用热固性酚醛树脂的发展
短句来源
    APPLICATION OF STYRENE-MALEIC ANHYDRIDE COPOLYMER(SMA) RESIN IN COPPER CLAD LAMINATE
    苯乙烯-马来酸酐树脂在覆铜箔板中的应用
短句来源
    Studies on a novel non-halogen flame-retarding copper clad laminate
    一种新型无卤阻燃覆铜箔板基板材料的制备
短句来源
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  copper clad laminate
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      


A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

The dielectric property requirement of high frequency printed circuit boards and preparation of thermosetting polyhenylene oxide resin are introduced.Two technical routes for preparing thermosetting polyphenylene oxide resin,the characteristics of each resin system,as well as the characteristics of copper clad laminate based on thermosetting polyphenylene oxide resin are discussed in detail.The applications of this laminate is also briefly presented.

介绍了高频印制电路板基材的介电性能要求和热固性聚苯醚树脂基材的制备 ,详细讨论了制备热固性聚苯醚树脂的两条技术路线及其树脂体系的特性 ,以及热固性聚苯醚树脂基覆铜板的特性 ,并简要介绍了热固性聚苯醚树脂基覆铜板的应用情况。

 
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