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copper clad laminate
相关语句
  覆铜板
    Study on PPO/epoxy glass cloth copper clad laminate
    聚苯醚/环氧玻璃布覆铜板的研制
短句来源
    PPE/glass-cloth copper clad laminate
    聚苯醚/玻璃纤维布基覆铜板
短句来源
    This article introduces the production process and the key point of CEM 3 type copper clad laminate production process .
    论文简述了 CEM- 3覆铜板的工艺路线和工艺要点 ,讨论了填料、固化剂以及工艺参数对产品性能的影响
短句来源
    This article introduces the continuous laminate process of environment friendly copper clad laminate and solventless soak glue.
    论文介绍了环保型覆铜板的无溶剂上胶、连续层压生产的新工艺
短句来源
    Moreover,other modified researches of benzoxaines in interlayer dielectric materials,insulation material,copper clad laminate,flame retardant material and electronic packaging material are introduced.
    并对高性能苯并口恶嗪树脂的改性进行了综述,另外还介绍了苯并口恶嗪树脂在夹层电介质材料、电绝缘材料、覆铜板、阻燃材料和高填充电子封装材料方面的改性研究。
短句来源
  覆铜箔层压板
    Application of Chinese Aluminium Hydrorides to CEM-3 Type Copper Clad laminate
    国产氢氧化铝填料在CEM-3型覆铜箔层压板中的应用
短句来源
    This article introduces the performance of chinese alumnium hydroxides(Al 2O 3·nH 2O) and its application to CEM 3 type Copper Clad laminate(CCL).
    本文介绍了国产氢氧化铝 ( Al2 O3· n H2 O)填料的性能指标及其在 CEM- 3型覆铜箔层压板 ( CCL)中的应用工艺、CCL性能。
短句来源
  “copper clad laminate”译为未确定词的双语例句
    The authors obtained a modified resin system with high performance for copper clad laminate,which was prepared from 4,4' diphenylbismaleimide,diallylbisphenol A,bromic epoxy and dicyandiamide with suitable proportion and pre polymerization.
    以 4 ,4’-双马来酰亚胺基二苯甲烷、二烯丙基双酚 A、溴化环氧树脂、双氰胺等为主要原料 ,采用预聚法工艺获得性能优良的改性树脂体系。
短句来源
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  copper clad laminate
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      


The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad...

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.

介绍了高可靠电镀Ni/Au工艺在PTFE微波印制电路上的应用,并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ni/Au镀层之间附着力的措施。。通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。

This paper introduces a new technics of producing light colour phenolic paper copper-clad laminate and summarizes the main effects on the laminates colour.

本文介绍了一种生产浅色覆铜箔酚醛纸层压板的工艺 ,总结了影响层压板颜色的因素。

The authors obtained a modified resin system with high performance for copper clad laminate,which was prepared from 4,4' diphenylbismaleimide,diallylbisphenol A,bromic epoxy and dicyandiamide with suitable proportion and pre polymerization.Using the modified resin system as matrix,glass fiber as reinforcement,and acetone as main solvent,the impregnant and half cured sheet with fine properties were prepared according to experiment and analysis results.With corresponding heat laminating process,the copper...

The authors obtained a modified resin system with high performance for copper clad laminate,which was prepared from 4,4' diphenylbismaleimide,diallylbisphenol A,bromic epoxy and dicyandiamide with suitable proportion and pre polymerization.Using the modified resin system as matrix,glass fiber as reinforcement,and acetone as main solvent,the impregnant and half cured sheet with fine properties were prepared according to experiment and analysis results.With corresponding heat laminating process,the copper clad laminate shows good mechanical and dielectric properties.The authors also studied the gel time,curing processibity by DSC and other apparatus,as well as the confect of impregnant,impregnating,dryness and lamination processing of the copper clad laminate.

以 4 ,4’-双马来酰亚胺基二苯甲烷、二烯丙基双酚 A、溴化环氧树脂、双氰胺等为主要原料 ,采用预聚法工艺获得性能优良的改性树脂体系。以玻璃纤维为增强材料 ,改性树脂为基体树脂 ,丙酮为主要溶剂 ,通过试验及分析确定了最佳的树脂配方体系 ,制备了贮存稳定性优良的胶液和半固化片。半固化片经合适的压制工艺热压得到的覆铜箔板具有较佳的力学和电气性能。对覆铜箔板成型工艺中胶液的配制、浸胶、干燥及热压工艺进行了研究 ,确定了各道工序的主要影响因素并最终确定了适宜的成型工艺。利用 DSC等手段对改性树脂体系的凝胶特性、固化工艺等进行了初步研究。

 
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