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copper clad laminate
相关语句
  覆铜板
    Development of PPO/Epoxy Glassfiber Cloth Copper Clad Laminate
    PPO/环氧玻璃布覆铜板的研制
短句来源
    Rheometer Application in Copper Clad Laminate Working Procedure
    流变仪在覆铜板工序中的应用
短句来源
    Polyimide Film for Flexible Copper Clad Laminate
    用于挠性覆铜板的聚酰亚胺膜
短句来源
    Flexible Copper Clad Laminate
    挠性覆铜板
短句来源
    JPCA-BM03-2003 Copper Clad Laminate for Flexible Printed Wiring Boards
    JPCA-BM03-2003挠性印制线路板用覆铜板(胶粘剂型和无胶粘剂型)
短句来源
更多       
  覆铜箔层压板
    Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000
    印制线路板用无卤型覆铜箔层压板——玻纤布·环氧树脂 JPCA-ES-04-2000
短句来源
    Halogen-free Copper Clad Laminate for Multilayer PCB-JPCA-ES-05-2000
    多层印制线路板用无卤型覆铜箔层压板——玻纤布基材环氧树脂 JPCA-ES-05-2000
短句来源
    Halogen-free Copper Clad Laminate for Test Method-JPCA-ES-01-1999
    无卤型覆铜箔层压板的试验方法——玻纤布基材环氧树脂 JPCA-ES-01-1999
短句来源
  “copper clad laminate”译为未确定词的双语例句
    As environment and health become more and more seriously concerned in the world,the electronic packaging material and process are facing the challenge of changeover to "green" This paper reviews the state of the art of the development of lead free solders,lead free coatings,copper clad laminate flame retardants and environment protection cleaning Considerations and directions in further research and development are discussed
    随着环境、健康问题成为全球的关注焦点 ,电子封装材料和工艺面临着向“绿色”转变的挑战。 文章讨论了电子封装无铅焊料、无铅涂层、印制电路敷铜基板阻燃剂、环保型清洗的研究状况 ,并指出了进一步开发需要注意的问题和发展的方向。
短句来源
    To cope with the challenges of lead-free,the most important issure is to increase the thermal decomposition temperature of resin in copper clad laminate and in the meantime,to take the process techniques,solder materials and soldertechnologies etc into consideration.
    着重指出:无铅化PCB的实质是提高与解决PCB耐热的可靠性问题,解决这个问题,最重要的是通过提高CCL基材中树脂的热分解温度、并与PCB工艺、焊料与焊接技术等多方面的方法,才能较全面的加以解决。
短句来源
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  copper clad laminate
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      


The significance of R & D of environmentally friendly flame-retarded copper clad laminates of epoxy resin is presented. Discussed is how to develop the above-said product by means of the followings: non-halogen flame-retarded epoxy resins containing nitrogen; phosphorus; silicon fire-proofing hardeners containing phosphorus, nitrogen or phosphorus and nitrogen; and additives of organic phosphorous fire-proofing agents, inorganic flame retarded compounds such as aluminum hydroxide. The tendency of the study...

The significance of R & D of environmentally friendly flame-retarded copper clad laminates of epoxy resin is presented. Discussed is how to develop the above-said product by means of the followings: non-halogen flame-retarded epoxy resins containing nitrogen; phosphorus; silicon fire-proofing hardeners containing phosphorus, nitrogen or phosphorus and nitrogen; and additives of organic phosphorous fire-proofing agents, inorganic flame retarded compounds such as aluminum hydroxide. The tendency of the study in this field is also discussed.

论述了环境友好阻燃环氧树脂覆铜板研究开发的意义。提出通过开发并使用含氮、磷或硅的非卤阻燃型环氧树脂,含磷、氮或磷-氮的功能性阻燃固化剂和在体系中添加有机磷阻燃剂、氢氧化铝等无机阻燃剂等途径来开发环境友好阻燃环氧树脂覆铜板。并对我国在今后该领域的研究作了展望。

As environment and health become more and more seriously concerned in the world,the electronic packaging material and process are facing the challenge of changeover to "green" This paper reviews the state of the art of the development of lead free solders,lead free coatings,copper clad laminate flame retardants and environment protection cleaning Considerations and directions in further research and development are discussed

随着环境、健康问题成为全球的关注焦点 ,电子封装材料和工艺面临着向“绿色”转变的挑战。文章讨论了电子封装无铅焊料、无铅涂层、印制电路敷铜基板阻燃剂、环保型清洗的研究状况 ,并指出了进一步开发需要注意的问题和发展的方向。

Based on the study on compatibility of PPO and epoxy,curing agent and curing system, copper clad laminate with low dielectric constant of 3.9 or high frequency application is developed.

通过对提高PPO与环氧树脂相容性的方法、PPO/环氧树脂体系固化剂、固化工艺等固化体系的研究 ,研制开发出了介电常数为 3 9的低介电常数高频电路用覆铜板。

 
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