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solder joint shapes
相关语句
  焊点形态
     Solder Joint Shapes Theory of SMT andVirtual Evolving Technology of SMT Solder Joint
     SMT焊点形态理论与SMT焊点虚拟成形技术
短句来源
     In this paper, based on presenting the basic concept of solder joint shapes theory and virtual evolving technology of SMT solder joint, the application theory and methods of SMT solder joint virtual evolving technology in the field of SMC/SMD component structure design , SMT product assembling process design and assembling quality detecting are demonstrated.
     在介绍 SMT焊点形态理论和焊点虚拟成形技术基本概念的基础上 ,论述了该技术在 SMT元器件结构设计、SMT产品组装工艺设计和组装质量检测等领域中的应用原理及方法。
短句来源
     In this paper, based on presenting the basic concept of solder joint shapes theory and virtual evolving technology of SMT solder joint, the application theory and methods of SMT solder joint virtual evolving technology in the field of SMC/SMD component structure design, SMT product assembling process design and assembling quality detecting are demonstrated.
     本文在介绍SMT焊点形态理论和焊点虚拟成形技术基本概念的基础上 ,论述了该技术在SMT元器件结构设计、SMT产品组装工艺设计和组装质量检测等领域中的应用原理及方法
短句来源
     The Virtual Evolving Technology of SMT Solder Joint and Its Applications Based on Solder Joint Shapes Theory
     基于焊点形态理论的SMT焊点虚拟成形技术及其应用
短句来源
     By applying the relation between the solder joints shape parameters and thermal fatigue life,and based on the solder joint reliability,the optimization software is used in the optimal evaluating of the solder joint shapes. Consequently,the optimal solder joint shape parameters are gained.
     利用得到的焊点形态参数与热疲劳寿命的关系表达式 ,采用优化程序对基于焊点热可靠性的焊点形态进行了评价优化 ,得到了优化后的焊点形态参数。
短句来源
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  “solder joint shapes”译为未确定词的双语例句
     The Statistical Analysis and Optimal Evaluating on Thermal Fatigue Life of CCGA Based on Solder Joint Shapes
     CCGA焊点热疲劳寿命统计分析与评价优化
短句来源
     Minimal energy principle and finite element method were employed in modeling the solder joint shapes of Plastic Ball Grid Array(PBGA) device. And three\|dimensional solder joint shapes of PBGA device were predicted and analyzed.
     应用最小能量原理和有限元方法 ,建立塑料球栅阵列 (PBGA:Plastic Ball Grid Array)器件焊点三维形态预测模型 ,对 PBGA焊点三维形态进行预测和分析 .
短句来源
     Predicting Three Dimensional Solder Joint Shapes of SMT Based on Minimal Energy Principle
     基于最小能量原理的SMT焊点三维形态预测
短句来源
     Calculation and experimental measurement of three-dimensional solder joint shapes of chip component in SMT
     片式元件SMT焊点三维形态计算与试验测量
短句来源
     Predicting and Analyzing Solder Joint Shapes of Plastic Ball Grid Array
     塑料球栅阵列(PBGA)焊点三维形态预测与分析
短句来源
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  相似匹配句对
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     Modeling and Predicting Solder Joint Shapes of Ball Grid Array
     球栅阵列(BGA)器件焊点形态成形建模与预测
短句来源
     The P-Joint Hyperoperation
     P-结合超运算
短句来源
     PROTECT JOINT
     为她的关节撑把保护伞
短句来源
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Solder joint shapes in Surface Mount Technology(SMT)play an important role in joint reliability,the prediction of solder joint shapes and the control of joint formation have received more attention in recent years.In this paper,the finite element method was employed to calculate the three-dimensional solder joint shapes of RC 3216 chip componeht,and the effects of solder volume on solder joint shapes were investigated.Moreover,an experimental method of touch pin measurement to analysis...

Solder joint shapes in Surface Mount Technology(SMT)play an important role in joint reliability,the prediction of solder joint shapes and the control of joint formation have received more attention in recent years.In this paper,the finite element method was employed to calculate the three-dimensional solder joint shapes of RC 3216 chip componeht,and the effects of solder volume on solder joint shapes were investigated.Moreover,an experimental method of touch pin measurement to analysis solder joint shapes was put forward,the results show the calculating results and the experimental results were identical well.

由于SMT中焊点形态影响焊点质量和可靠性,国外对SMT焊点形态的预测和控制研究有所重视。文中用有限元方法对RC3216片式元件焊点三维形态进行计算,考察了焊点钎料量对焊点三维形态的影响;提出了一种用触针测量法研究焊点三维形态的实验方法,并对计算结果和实验结果进行了比较,结果表明,计算结果与实验结果吻合良好

The relation of SMT solder joint shape of ceramic chip component to the thermal stress inside the joint has been developed in FEM. The stress distribution of various joint shapes or the gap between the pad and the component (C-P gap)has been obtained when the joint endures alternating thermal action. The stress concentration inside the joint is influenced by the shape parameters (joint shape,C-P gap),and can be decreased through optimizing joint shape...

The relation of SMT solder joint shape of ceramic chip component to the thermal stress inside the joint has been developed in FEM. The stress distribution of various joint shapes or the gap between the pad and the component (C-P gap)has been obtained when the joint endures alternating thermal action. The stress concentration inside the joint is influenced by the shape parameters (joint shape,C-P gap),and can be decreased through optimizing joint shape design.The results are of importance to pad design and potimization of SMT-PCB and further formulating the soldering process.

采用线性有限元方法研究了SMT焊点形态与热应力之间的关系,得到了不同外观形状和元件—焊盘间隙的SMT焊点在受交变热作用时焊点内部的热应力分布情况。结果表明,焊点内的应力集中受到这两个形态参数的影响,并且存在着最佳的区间。这一结果对于SMT—PCB上的焊盘设计和优化以及进一步的钎焊工艺规范的制定都具有指导意义

A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.

CALCULATIONOFTHREE-DIMENSIONALSOLDERJOINTFORMATIONINMICROELECTRONICSURFACEMOUNTTECHNOLOGY¥G.Z.Wang,C.Q.WangandY.YQian(Nationa...

 
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