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solder joint geometry
相关语句
  焊点形态
     By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.
     采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。
短句来源
  “solder joint geometry”译为未确定词的双语例句
     Prediction of Stand-off Height Between Chip Component and Substrate and its Effects on Three-dimensional Solder Joint Geometry
     SMT焊点元件与基板间隙的预测及其对焊点三维形态的影响
短句来源
     Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.
     本文给出了倒装焊 (flip chip)焊点形态的能量控制方程 ,采用SurfaceEvolver软件模拟了倒装焊复合SnPb焊点 (高Pb焊料凸点 ,共晶SnPb焊料焊点 )的三维形态 .
短句来源
     The potential energy controlling equation for SnPb solder joint geometry was investigated, and the solder joint geometry with duplicate SnPb solders in flip chip technology was simulated by Surface Evolver. Based on the unified viscoplastic Anand constitutive equation, the viscoplastic deformation behavior of SnPb solder was described. The stress and strain distributions in duplex SnPb solder joint during thermal cycle were studied by finite element method, the thermal cycle life of duplex SnPb solder joint was predicted based on Coffin--Manson equation.
     建立了复合焊点形态的能量控制方程,采用 Surface Evolver软件模拟了复合 SnPb焊点(高 Pb焊料凸点,共晶 SnPb焊料圆角)的形态利用复合 SnPb焊点形态的计算结果,采用统一型粘塑性 Anand本构方程描述复合焊点 Pb90Sn10和 Sn60Pb40的粘塑性力学行为,采用非线性有限元方法分析复合 SnPb焊点在热循环条件下的应力应变过程。
短句来源
  相似匹配句对
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     PREDICTION OF GEOMETRY AND RELIABILITY OF DUPLEX SnPb SOLDER JOINT
     复合SnPb焊点的形态与可靠性预测
短句来源
     The results are of importance to design and optimize of geometry shape of the solder joint.
     这一结果对于焊点几何形态的设计及优化具有指导意义。
短句来源
     The P-Joint Hyperoperation
     P-结合超运算
短句来源
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  solder joint geometry
Effects on fatigue life of solder joint geometry, thermal and mechanical characteristics of components and substrate materials, and application conditions are discussed.
      
A truncated sphere structure was used to predict the solder joint geometry, and a two-dimensional finite-element (FE) method was adopted to investigate the kinetics of the dissolution of Au during the reflow process.
      
Extent of such field influence, and the resultant damage, will also be significantly affected by the constraints imposed by the solder joint geometry.
      


By employing the minimum energy theorem,the effects of stand-off height(SOH)between chip component and substrate on three-dimensional(3-D)solder joint geometry were investigated with 3-D finite element method The stand-off height was analyzed with the use of potential energy data of the solder joint system The results show that SOH has important effects on solder joint geometry,the SOH increases with the increase of solder volume and the decrease of pad extension length Moreover,a...

By employing the minimum energy theorem,the effects of stand-off height(SOH)between chip component and substrate on three-dimensional(3-D)solder joint geometry were investigated with 3-D finite element method The stand-off height was analyzed with the use of potential energy data of the solder joint system The results show that SOH has important effects on solder joint geometry,the SOH increases with the increase of solder volume and the decrease of pad extension length Moreover,a regression model for the relationship between SOH,solder volume and pad extension length was put forward

基于能量最小原理,采用三维有限元方法,考察了片式元件与基板的间隙对SMT焊点三维形态的影响,利用焊点系统的能量数据,分析元件与基板的间隙。研究表明,元件与基板的间隙对焊点三维形态有重要影响,元件与基板的间隙随焊点钎料量的增加和焊盘伸出长度的减小而增加,提出了间隙与钎料量、焊盘伸出长度关系的回归模型

Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.The relationship of the stand off height between chip and substrate vs.the design parmeters and process parameters of solder joints were investigated.It was found there existed a critical eutectic solder volume ...

Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.The relationship of the stand off height between chip and substrate vs.the design parmeters and process parameters of solder joints were investigated.It was found there existed a critical eutectic solder volume V critical .When the volume of eutectic solder was smaller than V critical ,the stand off height of solder joint was equal to the radius of solder bump on chip;when the volume is greater than V critical ,the stand off height was greater than the radius of solder bump and increased with the increase of eutectic solder volume,Besides,the regression model was presented for stand off height of solder joints vs.eutectic solder volume,substrate pad size,solder bump size and chip weight in dimensionless form.All the results could be used to control the solder joint geometry,optimize the process parameters and improve the reliability of solder joint in production.

本文给出了倒装焊 (flip chip)焊点形态的能量控制方程 ,采用SurfaceEvolver软件模拟了倒装焊复合SnPb焊点 (高Pb焊料凸点 ,共晶SnPb焊料焊点 )的三维形态 .利用焊点形态模拟的数据 ,分析了芯片和基板之间SnPb焊点的高度与焊点设计和焊接工艺参数的关系 .研究表明 :共晶SnPb焊料量存在临界值 ,当共晶SnPb焊料量小于临界值时 ,焊点的高度等于芯片上高Pb焊料凸点的半径值 ;当共晶SnPb焊料量大于临界值时 ,焊点的高度随共晶SnPb焊料量的增加而增加 .另外 ,采用无量纲的形式给出了焊点高度与共晶焊料量、焊盘尺寸、芯片凸点的尺寸 ,芯片重量之间的关系模型 ,研究结果对倒装焊焊点形态的控制、工艺参数的优化和提高焊点可靠性具有指导意义 .

By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.Based on the calculated potential energy data for the solder joint system,the stand off height and the self alignment effects for misaligned placement were investigated.The results show that the stand off height increases near linearly with the increase of solder volume.The increases of stand off height and solder...

By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.Based on the calculated potential energy data for the solder joint system,the stand off height and the self alignment effects for misaligned placement were investigated.The results show that the stand off height increases near linearly with the increase of solder volume.The increases of stand off height and solder volume can enhance the self alignment of chip component.Moreover,a regression model for stand off height was put forward.

采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。基于焊点体系的势能数据 ,分析了片式元件的焊点间隙和贴片误差的自调整作用。结果表明 ,焊点间隙随焊点钎料量的增加而近似线性增加 ;焊点间隙和焊点钎料量的增加有助于贴片误差的自调整作用 ,并提出了焊点间隙的一种回归模型。

 
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