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Effects on fatigue life of solder joint geometry, thermal and mechanical characteristics of components and substrate materials, and application conditions are discussed.


A truncated sphere structure was used to predict the solder joint geometry, and a twodimensional finiteelement (FE) method was adopted to investigate the kinetics of the dissolution of Au during the reflow process.


Extent of such field influence, and the resultant damage, will also be significantly affected by the constraints imposed by the solder joint geometry.




 By employing the minimum energy theorem,the effects of standoff height(SOH)between chip component and substrate on threedimensional(3D)solder joint geometry were investigated with 3D finite element method The standoff height was analyzed with the use of potential energy data of the solder joint system The results show that SOH has important effects on solder joint geometry,the SOH increases with the increase of solder volume and the decrease of pad extension length Moreover,a... By employing the minimum energy theorem,the effects of standoff height(SOH)between chip component and substrate on threedimensional(3D)solder joint geometry were investigated with 3D finite element method The standoff height was analyzed with the use of potential energy data of the solder joint system The results show that SOH has important effects on solder joint geometry,the SOH increases with the increase of solder volume and the decrease of pad extension length Moreover,a regression model for the relationship between SOH,solder volume and pad extension length was put forward  基于能量最小原理，采用三维有限元方法，考察了片式元件与基板的间隙对ＳＭＴ焊点三维形态的影响，利用焊点系统的能量数据，分析元件与基板的间隙。研究表明，元件与基板的间隙对焊点三维形态有重要影响，元件与基板的间隙随焊点钎料量的增加和焊盘伸出长度的减小而增加，提出了间隙与钎料量、焊盘伸出长度关系的回归模型  Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.The relationship of the stand off height between chip and substrate vs.the design parmeters and process parameters of solder joints were investigated.It was found there existed a critical eutectic solder volume ... Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.The relationship of the stand off height between chip and substrate vs.the design parmeters and process parameters of solder joints were investigated.It was found there existed a critical eutectic solder volume V critical .When the volume of eutectic solder was smaller than V critical ,the stand off height of solder joint was equal to the radius of solder bump on chip;when the volume is greater than V critical ,the stand off height was greater than the radius of solder bump and increased with the increase of eutectic solder volume,Besides,the regression model was presented for stand off height of solder joints vs.eutectic solder volume,substrate pad size,solder bump size and chip weight in dimensionless form.All the results could be used to control the solder joint geometry,optimize the process parameters and improve the reliability of solder joint in production.  本文给出了倒装焊 (flip chip)焊点形态的能量控制方程 ,采用SurfaceEvolver软件模拟了倒装焊复合SnPb焊点 (高Pb焊料凸点 ,共晶SnPb焊料焊点 )的三维形态 .利用焊点形态模拟的数据 ,分析了芯片和基板之间SnPb焊点的高度与焊点设计和焊接工艺参数的关系 .研究表明 :共晶SnPb焊料量存在临界值 ,当共晶SnPb焊料量小于临界值时 ,焊点的高度等于芯片上高Pb焊料凸点的半径值 ;当共晶SnPb焊料量大于临界值时 ,焊点的高度随共晶SnPb焊料量的增加而增加 .另外 ,采用无量纲的形式给出了焊点高度与共晶焊料量、焊盘尺寸、芯片凸点的尺寸 ,芯片重量之间的关系模型 ,研究结果对倒装焊焊点形态的控制、工艺参数的优化和提高焊点可靠性具有指导意义 .  By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.Based on the calculated potential energy data for the solder joint system,the stand off height and the self alignment effects for misaligned placement were investigated.The results show that the stand off height increases near linearly with the increase of solder volume.The increases of stand off height and solder... By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.Based on the calculated potential energy data for the solder joint system,the stand off height and the self alignment effects for misaligned placement were investigated.The results show that the stand off height increases near linearly with the increase of solder volume.The increases of stand off height and solder volume can enhance the self alignment of chip component.Moreover,a regression model for stand off height was put forward.  采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。基于焊点体系的势能数据 ,分析了片式元件的焊点间隙和贴片误差的自调整作用。结果表明 ,焊点间隙随焊点钎料量的增加而近似线性增加 ;焊点间隙和焊点钎料量的增加有助于贴片误差的自调整作用 ,并提出了焊点间隙的一种回归模型。   << 更多相关文摘 
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