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copper clad laminates
相关语句
  覆铜板
     Shaped fiber reinforced composites and high-performance copper clad laminates
     异形纤维复合材料与高性能覆铜板
短句来源
     BT resin was also modified by polyphenyl oxide. Of the low dielectric copper clad laminates based on thus modified BT resin and glass fabric, er is as low as 3.6, at 106 Hz, and expansion coefficient 4.07105C1 (z orientation).
     另用聚苯醚改性BT,制得低介电常数的BT树脂/玻璃布覆铜板,其er可小到3.6(106 Hz),厚度方向热膨胀系数为4.07×105℃1。
短句来源
     A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.
     本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。
短句来源
     CEM-3 copper clad laminates(CCL) were made from epoxy bromide A80, curing agents of phenolic novolac(PN), bisphenol F novolac(BPFN) and bisphenol A novolac(BPAN) with accelerants of DMP-30, HMTA and 2-MZ. The effects of these three novolacs on the properties of CEM-3 CCL, such as mechanical properties, electrical properties, water absorbance and heat resistance, were discussed.
     分别以PN、BPFN和BPAN为溴化环氧A80的固化剂,以DMP_30、HMTA和2_MZ为促进剂制备CEM_3覆铜板,研究了这三种线型酚醛树脂作为固化剂对CEM_3覆铜板力学性能、电性能、吸水性和耐热性等的影响。
短句来源
     Development of high anti-tracking epoxy/ fiberglass based copper clad laminates
     高耐漏电起痕性环氧玻纤基覆铜板的开发
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  覆铜箔层压板
     Cure kinetics of diglycidyl ether of bisphenol-A/dicyandiamide system for copper clad laminates
     覆铜箔层压板专用双酚A二缩水甘油醚/双氰胺体系的固化反应动力学
短句来源
     Synthesis and reaction kinetics of diglycidyl ether of bisphenol-A for copper clad laminates
     覆铜箔层压板专用双酚A二缩水甘油醚的合成及反应动力学
短句来源
     STUDY ON THE CURE KINETICS OF BROMINATED EPOXY RESIN/ DICYANDIAMIDE SYSTEM FOR COPPER CLAD LAMINATES
     覆铜箔层压板专用低溴环氧树脂/双氰胺体系的固化反应动力学
短句来源
     A basic material for copper clad laminates, diglycidyl ether of bisphenol A (DGEBA), was synthesized through a two step method. The effect of reaction conditions on chloride content, epoxy equivalent weight, molecular weight and its distribution of products was investigated.
     采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚 ,考察了不同反应条件对产物的总氯含量、环氧值、分子量及分子量分布的影响。
短句来源
     The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates
     覆铜箔层压板专用环氧树脂的合成与性能
短句来源
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  “copper clad laminates”译为未确定词的双语例句
     Trial of Test Methods for Bow and Twist of as Received and After Heated Cellulose Paper and Composite Copper Clad Laminates
     纸基·复合基覆铜箔板常态及受热后的翘曲测试方法的试用
短句来源
     SYNTHESIS OF BROMINE CONTAINING EPOXY RESIN SPECIAL FOR COPPER CLAD LAMINATES
     敷铜板专用含溴环氧树脂的合成
短句来源
     The Present Situation of Manufacturing Copper Clad Laminates With UV-block
     紫外光屏蔽覆铜板de生产现状
短句来源
     Research of Epoxy Resin Polymer (ERP) and Acrylic Resin Polymer (ARP)——Interconnected Structure Flexible Copper Clad Laminates (ISFCCL) for FPC
     挠性印制板用环氧聚合物与聚丙烯酸脂共聚物——互穿网络挠性基材的研究
短句来源
     By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process. Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.
     通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。
短句来源
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  copper clad laminates
Consequently, thermal stability of copper clad laminates, a major component in printed circuit boards, is a critical issue in electronic packaging industries.
      
On the mechanism of popcorn blistering in copper clad laminates
      


A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad...

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.

介绍了高可靠电镀Ni/Au工艺在PTFE微波印制电路上的应用,并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ni/Au镀层之间附着力的措施。。通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

 
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