The content of alkali in the first etherification is 50% of total content and the temperatures of etherification and ring-closing reaction are 90C,70C respectively, the synthetic DGEBA can meet the demand of copper clad laminates and the amount of by-product of high-molecular weight is the lowest.
High characteristic copper clad laminates( CCL) was prepared and the formulation of recipe was designed based on the study on the flame retardance of phosphor fire retardant,phosphor nitrogen fire retardant and phosphor nitrogen ATH flame resins The properties of the prepared product were better than those of the conventional FR 4,especially the content of halogen could meet the need for environment protection
Finally, we successfully use it in some respects of thick copper-foil (0.4-0.5mm) clad epoxy and glass fibrous cloth laminates. The copper clad laminates possess the characteristics of high peel strength, good planeness and excellent electric properties.
A basic material for copper clad laminates, diglycidyl ether of bisphenol-A (DGEBA) was synthesized through two-step method. The technological process which proved mature had been realized in industry and filled the vacancy of China.
A basic material for copper clad laminates, diglycidyl ether of bisphenol A (DGEBA), was synthesized through a two step method. The effect of reaction conditions on chloride content, epoxy equivalent weight, molecular weight and its distribution of products was investigated.
The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.
The dielectric property requirement of high frequency printed circuit boards and preparation of thermosetting polyhenylene oxide resin are introduced.Two technical routes for preparing thermosetting polyphenylene oxide resin,the characteristics of each resin system,as well as the characteristics of copper clad laminate based on thermosetting polyphenylene oxide resin are discussed in detail.The applications of this laminate is also briefly presented.