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copper clad laminates
相关语句
  覆铜板
    A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.
    本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。
短句来源
    Preparation of Copper Clad Laminates Based on Polytetrafluoroethylene with Blending Modification
    共混改性聚四氟乙烯覆铜板的制备
短句来源
    The content of alkali in the first etherification is 50% of total content and the temperatures of etherification and ring-closing reaction are 90C,70C respectively, the synthetic DGEBA can meet the demand of copper clad laminates and the amount of by-product of high-molecular weight is the lowest.
    第一步醚化反应的碱量控制在50%,醚化反应温度及闭环反应温度分别控制在90℃,70℃时最适宜,合成的DGEBA的各项理化性能均能满足制造覆铜板的要求,而DGEBA中的高分子量副产物含量也最小。
短句来源
    High characteristic copper clad laminates( CCL) was prepared and the formulation of recipe was designed based on the study on the flame retardance of phosphor fire retardant,phosphor nitrogen fire retardant and phosphor nitrogen ATH flame resins The properties of the prepared product were better than those of the conventional FR 4,especially the content of halogen could meet the need for environment protection
    研制出了环保型产品———高性能FR -4型基板。 它是阻燃性、电性能、耐热性等性能比传统的FR -4更好的覆铜板 ,特别是溴氯等卤素的的含量 ,完全符合环境保护的要求
短句来源
    Finally, we successfully use it in some respects of thick copper-foil (0.4-0.5mm) clad epoxy and glass fibrous cloth laminates. The copper clad laminates possess the characteristics of high peel strength, good planeness and excellent electric properties.
    最后将其成功地应用到一种厚铜箔(0.4~0.5mm)环氧玻璃布层压板上,得到的覆铜板样品具有剥离强度高、平整度好、电性能优良等特点。
短句来源
更多       
  覆铜箔层压板
    Synthesis and reaction kinetics of diglycidyl ether of bisphenol-A for copper clad laminates
    覆铜箔层压板专用双酚A二缩水甘油醚的合成及反应动力学
短句来源
    STUDY ON THE CURE KINETICS OF BROMINATED EPOXY RESIN/ DICYANDIAMIDE SYSTEM FOR COPPER CLAD LAMINATES
    覆铜箔层压板专用低溴环氧树脂/双氰胺体系的固化反应动力学
短句来源
    The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates
    覆铜箔层压板专用环氧树脂的合成与性能
短句来源
    A basic material for copper clad laminates, diglycidyl ether of bisphenol-A (DGEBA) was synthesized through two-step method. The technological process which proved mature had been realized in industry and filled the vacancy of China.
    本文采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚(DGEBA),探索出其成熟的工艺路线,此工艺已在苏州树脂厂实现工业化,填补了国内空白。
短句来源
    A basic material for copper clad laminates, diglycidyl ether of bisphenol A (DGEBA), was synthesized through a two step method. The effect of reaction conditions on chloride content, epoxy equivalent weight, molecular weight and its distribution of products was investigated.
    采用二步法合成了覆铜箔层压板专用的双酚A二缩水甘油醚 ,考察了不同反应条件对产物的总氯含量、环氧值、分子量及分子量分布的影响。
短句来源
更多       
  “copper clad laminates”译为未确定词的双语例句
    SYNTHESIS OF BROMINE CONTAINING EPOXY RESIN SPECIAL FOR COPPER CLAD LAMINATES
    敷铜板专用含溴环氧树脂的合成
短句来源
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  copper clad laminates
Consequently, thermal stability of copper clad laminates, a major component in printed circuit boards, is a critical issue in electronic packaging industries.
      
On the mechanism of popcorn blistering in copper clad laminates
      


A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

The dielectric property requirement of high frequency printed circuit boards and preparation of thermosetting polyhenylene oxide resin are introduced.Two technical routes for preparing thermosetting polyphenylene oxide resin,the characteristics of each resin system,as well as the characteristics of copper clad laminate based on thermosetting polyphenylene oxide resin are discussed in detail.The applications of this laminate is also briefly presented.

介绍了高频印制电路板基材的介电性能要求和热固性聚苯醚树脂基材的制备 ,详细讨论了制备热固性聚苯醚树脂的两条技术路线及其树脂体系的特性 ,以及热固性聚苯醚树脂基覆铜板的特性 ,并简要介绍了热固性聚苯醚树脂基覆铜板的应用情况。

 
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