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solder joint shape
相关语句
  焊点形态
     FEM Analysis of the Influence of SMT Solder Joint Shape to the Internal Thermal Stress of the Joint
     SMT焊点形态对热应力分布影响的有限元分析
短句来源
     Overview on Solder Joint Shape Prediction Technology in Electronic Packaging
     电子封装软钎焊焊点形态预测技术研究现状
短句来源
     Study on SMT Solder Joint Quality Fuzzy Diagnosis Technology Based on the Theory of Solder Joint Shape
     基于焊点形态理论的SMT焊点质量模糊故障诊断技术研究
短句来源
     The shape of solder joint is related to the quality of a SMT product. Solder Joint quality can be controlled through predicting and controlling of the solder joint shape.
     表面组装技术(SMT)产品焊点质量与焊点形态有关,通过对焊点形态的预测和控制,可以达到控制焊点质量的目的。
短句来源
     The Study on MCM′s Solder Joint Shape
     MCM焊点形态研究方法探讨
短句来源
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  “solder joint shape”译为未确定词的双语例句
     A Study on the Data Processing of SMT 3-D Solder Joint Shape Based on AutoCAD
     基于AutoCAD的SMT焊点三维形态数据处理技术
短句来源
     With the change of solder joint shape including drum, concave and column, under the thermal loading, stress/strain distribution is studied in FEM.
     研究发现,在热载荷作用下,鼓形、凹形及柱形钎料焊点的最大应力\应变分布大致相同,均在钎料球的外边缘。
短句来源
     And the program of model converting was achieved. Then,an example of PBGA(Plastic Ball Grid Array) model of 3-D solder joint shape with 218 vertexes predicted by Evolver was converted successfully by the program,which could show the feasibility of the method.
     编制了模型转换程序,并以218节点PBGA焊点三维形态预测模型为例,进行了应用实例转换,得到了较为满意的转换结果。
短句来源
     The present situation of solder joint reliability in micro-jointing was reviewed based on the description of solder joint shape prediction,thermal fatigue and the numerical simulation of stress-strain field. It points out that exploring the commonality of three-dimension solder yoint prediction model which is influenced by multifactor,studyint high precision physical simulation methods and numerical simulation,researching joint reliability of the new lead-free solder are the trends of development.
     从焊点的形态预测、焊点应力应变过程的数值模拟以及其热疲劳寿命预测等三个方面对近年来国内外在微连接焊点可靠性方面的研究进行了综述,指出探索多因素作用下焊点三维形态的通用性预测模型、研究更为精确的物理模拟方法及在此基础上的数值模拟和对新型无铅钎料的可靠性进行研究将是未来的发展方向。
短句来源
  相似匹配句对
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     The Study on MCM′s Solder Joint Shape
     MCM焊点形态研究方法探讨
短句来源
     Shape prediction and reliability analysis of QFP solder joint
     QFP焊点形态预测及可靠性分析
短句来源
     Shape prediction and reliability analysis of EBGA solder joint
     EBGA焊点形态预测与可靠性分析
短句来源
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  solder joint shape
This solder bumping technology can easily control the solder joint shape and height.
      
Some studies indicate that solder joint shape may have as much to do with joint strength as the solder volume.
      
Some studies1,2 indicate that the solder joint shape may have a greater impact on the solder joint reliability than the volume.
      
By specifying a smaller angle than 90 degrees for the upper and lower parts, the user can change the solder joint shape to concave geometry easily.
      


Solder joint shapes in Surface Mount Technology(SMT)play an important role in joint reliability,the prediction of solder joint shapes and the control of joint formation have received more attention in recent years.In this paper,the finite element method was employed to calculate the three-dimensional solder joint shapes of RC 3216 chip componeht,and the effects of solder volume on solder joint shapes were investigated.Moreover,an experimental method of touch pin measurement...

Solder joint shapes in Surface Mount Technology(SMT)play an important role in joint reliability,the prediction of solder joint shapes and the control of joint formation have received more attention in recent years.In this paper,the finite element method was employed to calculate the three-dimensional solder joint shapes of RC 3216 chip componeht,and the effects of solder volume on solder joint shapes were investigated.Moreover,an experimental method of touch pin measurement to analysis solder joint shapes was put forward,the results show the calculating results and the experimental results were identical well.

由于SMT中焊点形态影响焊点质量和可靠性,国外对SMT焊点形态的预测和控制研究有所重视。文中用有限元方法对RC3216片式元件焊点三维形态进行计算,考察了焊点钎料量对焊点三维形态的影响;提出了一种用触针测量法研究焊点三维形态的实验方法,并对计算结果和实验结果进行了比较,结果表明,计算结果与实验结果吻合良好

The relation of SMT solder joint shape of ceramic chip component to the thermal stress inside the joint has been developed in FEM. The stress distribution of various joint shapes or the gap between the pad and the component (C-P gap)has been obtained when the joint endures alternating thermal action. The stress concentration inside the joint is influenced by the shape parameters (joint shape,C-P gap),and can be decreased through optimizing joint shape...

The relation of SMT solder joint shape of ceramic chip component to the thermal stress inside the joint has been developed in FEM. The stress distribution of various joint shapes or the gap between the pad and the component (C-P gap)has been obtained when the joint endures alternating thermal action. The stress concentration inside the joint is influenced by the shape parameters (joint shape,C-P gap),and can be decreased through optimizing joint shape design.The results are of importance to pad design and potimization of SMT-PCB and further formulating the soldering process.

采用线性有限元方法研究了SMT焊点形态与热应力之间的关系,得到了不同外观形状和元件—焊盘间隙的SMT焊点在受交变热作用时焊点内部的热应力分布情况。结果表明,焊点内的应力集中受到这两个形态参数的影响,并且存在着最佳的区间。这一结果对于SMT—PCB上的焊盘设计和优化以及进一步的钎焊工艺规范的制定都具有指导意义

A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.

CALCULATIONOFTHREE-DIMENSIONALSOLDERJOINTFORMATIONINMICROELECTRONICSURFACEMOUNTTECHNOLOGY¥G.Z.Wang,C.Q.WangandY.YQian(Nationa...

 
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