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cu matrix composites
相关语句
  铜基复合材料
     MECHANICAL PROPERTIES OF Ti_2SnC PARTICULATE REINFORCED Cu MATRIX COMPOSITES
     Ti_2SnC颗粒增强铜基复合材料的力学性能
短句来源
     Study on Cu matrix composites strengthened with TiB_2 particle
     TiB_2颗粒增强铜基复合材料的研究
短句来源
     Preparation of SiC Particulate Reinforced Cu Matrix Composites by Mechanical Alloying
     机械合金化制备SiC弥散强化铜基复合材料
短句来源
     Preparation of Disperoids Cu Matrix Composites
     弥散强化铜基复合材料的制备
短句来源
     Continuous-fiber-reinforced Cu matrix composites were fabricated based on the electrochemical infiltration technique (ECI).
     基于电化学浸渗技术(ECI)在室温下制备了连续铜纤维、碳纤维和玻璃纤维增强铜基复合材料
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  cu基复合材料
     Production of In-situ Al_2O_3/Cu Matrix Composites by Thermal Reducing Reaction Process
     用热还原生成法制备自生Al_2O_3/Cu基复合材料
短句来源
     Microstructure of the WC-10%Co Particulate Reinforced Cu Matrix Composites Fabricated by Selective Laser Sintering
     选区激光烧结WC-10%Co颗粒增强Cu基复合材料的显微组织
短句来源
     Preparation of C/CF reinforced Cu Matrix Composites with Antifrictional and Biomedical Function
     摩阻和生物功能C/CF/Cu基复合材料的制备
短句来源
     The prepared C/CF reinforced Cu matrix composites with good sound interface and higher tensile strength may be obtained,preferably with C/CF wire preform in 40~60 μm copper plating thickness.
     在C/CF先驱丝表面镀铜厚度为 40~ 60 μm ,有助于制备界面结合良好和抗拉强度较高的C/CF/Cu基复合材料
短句来源
     The sub-micro WC-10%Co particle reinforced Cu matrix composites were prepared using selective laser sintering(SLS).
     利用选区激光烧结制备了亚微米WC-10%Co颗粒增强Cu基复合材料
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  铜复合材料
     Researching Progress of C/Cu Matrix Composites
     碳/铜复合材料研究进展
短句来源
     The development of C (CF, GF, G)/Cu matrix composites, including the researching progressin matrix alloying, surface treatment of carbon reinforcement, production techniques, properties and applicationswas briefly reviewed.
     简要回顾了碳/铜复合材料的发展过程,综述了在基体合金化、碳增强的表面处理、制备工艺、性能及应用等方面的研究进展。
短句来源
  “cu matrix composites”译为未确定词的双语例句
     In this paper, the Cu matrix composites reinforced by Al_2O_3 particulates have been prepared by the process of briquet sintering plus repress and resintering.
     本文采用压坯烧结加复压复烧工艺制备出Al_2O_3/Cu 复合材料, 研究了制备工艺对复合材料性能的影响。
短句来源
     Al_2O_3 particle with the sizes of 2 μm,7 μm and 10 μm and volume fractions of 5%,10% and 15% reinforced Cu matrix composites were fabricated by briquette sintering plus repress and resintering.
     采用压坯烧结以及复压、复烧工艺制备出Al2O3/Cu复合材料。 Al2O3增强颗粒的尺寸分别为2μm、7μm、10μm,体积分数分别为5%、10%、15%。
短句来源
     This equipment would meet the need of Al or Cu matrix composites prepared by pressureless infiltration or vacuum infiltration in a high vacuum or special atmosphere.
     可以实现常见金属基复合材料在较高真空或特定气氛下的无压浸渗或真空浸渗制备工艺,并可实现试样的不同冷却方式凝固。
短句来源
     SiC particle reinforced Cu matrix composites were fabricated via hot isostaticprocessing for electronic packaging. The results indicate that the coefficient of thethermal expansion (CTE) of composites depends on the SiC particle size and its volumefraction.
     采用热等静压的方法制备了SiCp/Cu电子封装复合材料.材料热膨胀系数(CTE)和导热率的测定表明,增加SiC体积分数和减小SiC颗粒的尺寸有利于降低CTE值;
短句来源
     Disperoids Cu matrix composites have been prepared by blowing ceramic particle into liquid Cu with high-speed gas-flow to investigate the effects of particle surface treatment on wettability of Cu-ceramic particle interface and bonding strength between Cu and ceramic particle.
     为了改善铜-陶瓷颗粒界面的浸润性,提高铜与陶瓷颗粒的结合强度,用高速气流将陶瓷颗粒吹入熔融铜液中制备成弥散铜系列复合材料。
短句来源
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  cu matrix composites
Effect of Matrix Strength on the Fracture Mechanism of SiC Particle Reinforced Al-Cu Matrix Composites Under Dynamic Loading
      


Dispersion hardening Al2O3-Cu matrix composites have been fabricated by internal oxidation technique and the microstructure properties of the composites were studied. Results have shown that this technique is simple and easy to carry out, and the amount of A12O3 particles is increased with the increase of the content of aluminum in copper matrix.

用内氧化技术制备了弥散硬化Al_2O_3-Cu基复合材料,研究了其显微组织特性。结果表明,该技术简单、易行,复合材料中的Al_2O_3。粒子数量随基体中铝含量的增加而增加。

SiC particle reinforced Cu matrix composites were fabricated via hot isostaticprocessing for electronic packaging. The results indicate that the coefficient of thethermal expansion (CTE) of composites depends on the SiC particle size and its volumefraction. The minimal CTE value has been obtained from an annealing for releasingresidual stress. The thermal conductivity is found to be higher when the volume fractionof Cu exceeds a threshold because of the matrix formed a continuous phase....

SiC particle reinforced Cu matrix composites were fabricated via hot isostaticprocessing for electronic packaging. The results indicate that the coefficient of thethermal expansion (CTE) of composites depends on the SiC particle size and its volumefraction. The minimal CTE value has been obtained from an annealing for releasingresidual stress. The thermal conductivity is found to be higher when the volume fractionof Cu exceeds a threshold because of the matrix formed a continuous phase.

采用热等静压的方法制备了SiCp/Cu电子封装复合材料.材料热膨胀系数(CTE)和导热率的测定表明,增加SiC体积分数和减小SiC颗粒的尺寸有利于降低CTE值;SIC质量分数超过26%这一临界值后,材料导热率会明显下降.减小残余应力有利于降低材料的CTE值.

In this paper,the fabrication of carbon fiber/Ag(Cu)matrix composites and its application in electrical contact device has been studied.Their application in switch electrical contact and electrical brush shows that the properties and service life of these composite were improved apparently by adding carbon fiber.

本文研究了碳纤维/银(铜)基复合材料的制造方法,并应用于开关触点、电刷等。结果表明,碳纤维的加入明显改善了复合材料的性能,其使用寿命大幅度提高。

 
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