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   semiconductor 在 有机化工 分类中 的翻译结果: 查询用时:0.168秒
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semiconductor
相关语句
  半导体
    Reliability of Adhesional sealing Optoelectronic Semiconductor Devices
    胶封半导体光电器件的可靠性
短句来源
    REVIEW OF SEMICONDUCTOR PHOTOCATALYST AND ITS MODIFICATION
    半导体光催化剂及其改性技术进展
短句来源
    Assembly and Characterization of Nanoscale Conducting Polymer and Semiconductor film
    纳米结构导电聚合物和半导体膜的组装和表征
短句来源
    Characteristics development on ultra pure water pmduction procese in semiconductor industry
    半导体工业中超纯水制备工艺的特点和发展
短句来源
    The gas sensors and its' transmitters are studied, especially about the NH3 sensor, TGS824, which is semiconductor sensor, and SO_2 sensor, SO_2-BF ,which is electronic-chemical sensor.
    针对本课题的实际应用背景,对用于检测NH_3的半导体气体传感器TGS824以及用于检测SO_2的电化学气体传感器SO_2-BF及其各自的变送器进行了介绍,并且制作了TGS824传感器的变送器。
短句来源
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  半导体
    Reliability of Adhesional sealing Optoelectronic Semiconductor Devices
    胶封半导体光电器件的可靠性
短句来源
    REVIEW OF SEMICONDUCTOR PHOTOCATALYST AND ITS MODIFICATION
    半导体光催化剂及其改性技术进展
短句来源
    Assembly and Characterization of Nanoscale Conducting Polymer and Semiconductor film
    纳米结构导电聚合物和半导体膜的组装和表征
短句来源
    Characteristics development on ultra pure water pmduction procese in semiconductor industry
    半导体工业中超纯水制备工艺的特点和发展
短句来源
    The gas sensors and its' transmitters are studied, especially about the NH3 sensor, TGS824, which is semiconductor sensor, and SO_2 sensor, SO_2-BF ,which is electronic-chemical sensor.
    针对本课题的实际应用背景,对用于检测NH_3的半导体气体传感器TGS824以及用于检测SO_2的电化学气体传感器SO_2-BF及其各自的变送器进行了介绍,并且制作了TGS824传感器的变送器。
短句来源
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  “semiconductor”译为未确定词的双语例句
    (3) The paper give more discussion on the Cu/n-p mixed semiconductor catalysts and Cu/La_2O_3-NiO catalysts.
    而对Cu/La_2O_3-NiO系列催化剂催化效果的研究可以分为三块,分开主要取决于此催化剂前驱体La_2O_3-NiO的制备方法。
短句来源
    Adsorption property and photo-stimulated surface reaction of CO_2 and C_3H_6 on the loaded metal Cu coupled semiconductor V_2O_5-TiO_2 catalyst was studied by IR、 TPD、 UV-Vis and photo-microreactor techniques.
    用IR、TPD、UV-Vis和微型光反应器技术研究了CO2和C3H6在Cu/V2O5-TiO2表面上的吸附特性和光催化反应性能.
短句来源
    Then the CdSe or CdSe/ZnS-polymer composites were successfully obtained by using PS microspheres and surfactant-coated semiconductor quantum dots through swelling technique.
    以氯仿/正丁醇为混合溶胀剂,将聚合物微球与CdSe量子点或CdSe/ZnS复合,制得含有两种或两种以上的不同量子点的高分子复合荧光微球。
短句来源
    Detection of Methane Gas with Fibre Correlation Spectroscopy, Using Semiconductor Laser Diode Pumped Tin-doped Fibre Source
    采用Tm光纤光源的甲烷气体相关光谱检测
短句来源
    Recent progress in research on semiconductor blue green laser diodes
    低压合成甲醇含锆催化剂的电镜研究
短句来源
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查询“semiconductor”译词为用户自定义的双语例句

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  semiconductor
CdS semiconductor nano-films were grown on ITO glass substrates by means of chemical bath deposition (CBD), with Cd(NO3)2 as Cd ion and (NH2)2CS as S ion sources.
      
The sensitive unit of the accelerometer is the metal-oxide semiconductor (MOS) ROs located on silicon beams.
      
The coupling ratio of the two MMI couplers deviates from 50:50 but the deviation is nearly the same, which is decided by good uniformity of semiconductor planar lightwave circuit (PLC) process.
      
An ultrasonic linear motor is proposed and fabricated by using the longitudinal and bending vibration double mode bolt-clamped Langevin type transducer to meet high power and speed requirements in the aerospace and semiconductor industries.
      
The electronic properties of SWCNTs can be modified by adsorbate atoms and metal-semiconductor and semiconductor-semi-conductor transitions can be achieved by the doping of alkali atoms.
      
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It is well known that polyimide has thermal stability, excellent insulating properties and resistance to radiativity. The membrane is made of soluble polyamic acid, and then is changed into polyimide at high temprature. However, the polyamic acid solution degrades easily in room temprature and the storage time is short. Besides it has no photosensitivity and cannot form the images. Thus, its application is very limited in the electronics industry. We found that the degradation of the polyamic acid could be prevented...

It is well known that polyimide has thermal stability, excellent insulating properties and resistance to radiativity. The membrane is made of soluble polyamic acid, and then is changed into polyimide at high temprature. However, the polyamic acid solution degrades easily in room temprature and the storage time is short. Besides it has no photosensitivity and cannot form the images. Thus, its application is very limited in the electronics industry. We found that the degradation of the polyamic acid could be prevented if the acid was in the solid state and that the behaviors of polyimide were improved when the polyamic acid was fractionated. Besides we selected suitable resists for the masks and used wet or dry etching, for the lithography of polyimide. The result was satisfactory. It will be of great use in the passivation and interlever insulation of semiconductor chips. And therefore, it can be widely used in the electronics industry.

聚酰亚胺以它卓越的耐热性、绝缘性和抗辐射性能著称。在使用时,通常先由可溶性的聚酰胺酸制成薄膜,再经加温处理转变为不溶不熔的聚酰亚胺。然而由于聚酰胺酸溶液在室温下容易降解,保存期极短,而且没有感光性,不能直接形成图象,这就限制了它在电子工业中的应用。本文对以上问题进行研究,发现以固体形式保存的聚酰胺酸基本上控制了降解,大大地延长了保存期,同时对聚酰胺酸进行了分子量分级精制,获得了性能更为优越的聚酰亚胺。此外,我们选择了适当的光刻胶作掩蔽,采用湿法或干法腐蚀已成功地形成所需的聚酰亚胺薄膜图象,从而解决了聚酰亚胺用于半导体器件的表面钝化和多层布线绝缘的技术问题,展示了聚酰亚胺在电子工业中应用的广阔前景。

The PAN fiber treated by Lewis acids (e.g. stannic chloride) could be transformed into a macromolecular conducting fiber by further heat treatment. The resistance of the fiber varied from 103 to 1012Ω.cm owing to different thermal treatment, and kept stable after hydrolysis. The fiber had enough strength to be processed by using various means. This is a new kind of macromolecular conducting fibers having some analogies to the characteristics of organic semiconductors.

经四氯化锡处理的聚丙烯腈纤维,在进一步热处理过程中可以成为一种高分子半导纤维。它具有如下四个特点:1.纤维电阻率在10~3—10~(12)欧姆·厘米范围内可以控制热处理温度而随意调节。2.水解处理干燥后纤维的电阻值基本不变。3.有足够的机械强度可以进行多种形式的加工。4.纤维的电阻-温度、电导率-频率依赖关系,直流伏-安特性的试验结果表明它具有有机半导体特性,是一种兼有良好电性能和力学性能的高分子半导纤维。

In this paper is given a review on trend of the domestic and abroad technical development about the epoxy molding compounds for semiconductors and FBT flame - retardant e-poxy potting compounds, with a stress on the description of the superiority and technical characteristics of plastics encapsulation of semiconductors, the technical key about how to decrease the linear expansion coefficient and flexural modulus, increase the glass transition temperature and solder - heat resistant, and overcome...

In this paper is given a review on trend of the domestic and abroad technical development about the epoxy molding compounds for semiconductors and FBT flame - retardant e-poxy potting compounds, with a stress on the description of the superiority and technical characteristics of plastics encapsulation of semiconductors, the technical key about how to decrease the linear expansion coefficient and flexural modulus, increase the glass transition temperature and solder - heat resistant, and overcome soft error etc. , and put forward a catch up with and surpass proposal.

本文综述了国内外半导体环氧塑封料和FBT阻燃环氧灌封料技术开发动向,并提出了赶超建议。

 
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