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clad laminate
相关语句
  “clad laminate”译为未确定词的双语例句
     Halogen-free Copper Clad Laminate for Test Method-JPCA-ES-01-1999
     无卤型覆铜箔层压板的试验方法——玻纤布基材环氧树脂 JPCA-ES-01-1999
短句来源
     JPCA-BM03-2003 Copper Clad Laminate for Flexible Printed Wiring Boards
     JPCA-BM03-2003挠性印制线路板用覆铜板(胶粘剂型和无胶粘剂型)
短句来源
     Halogen-free Copper Clad Laminate for PCB-fiber Glass Epoxy Resin-JPCA-ES-04-2000
     印制线路板用无卤型覆铜箔层压板——玻纤布·环氧树脂 JPCA-ES-04-2000
短句来源
     Halogen-free Copper Clad Laminate for Multilayer PCB-JPCA-ES-05-2000
     多层印制线路板用无卤型覆铜箔层压板——玻纤布基材环氧树脂 JPCA-ES-05-2000
短句来源
     This article introduces the performance of chinese alumnium hydroxides(Al 2O 3·nH 2O) and its application to CEM 3 type Copper Clad laminate(CCL).
     本文介绍了国产氢氧化铝 ( Al2 O3· n H2 O)填料的性能指标及其在 CEM- 3型覆铜箔层压板 ( CCL)中的应用工艺、CCL性能。
短句来源
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  相似匹配句对
     Flexible Copper Clad Laminate
     挠性覆铜板
短句来源
     Copper Clad Laminate Technology (Ⅺ)
     覆铜板技术(11)
短句来源
     Laminate floor maintenance
     层压合成地板的清洁保养
短句来源
     Reliability of Composite Laminate
     复合材料迭层板可靠性分析
短句来源
     ALUMINUM CLAD STEEL PLATE
     铝复合钢板
短句来源
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  clad laminate
1.Inhibition of fracture in clad laminate composites is caused both by the barrier effect of the interlayer interface and also by plastic relaxation at the tip of the main crack when it approaches the cladding layer.
      
The material used is the DuPont? Pyralux? AP 8525R double-sided copper-clad laminate, formed by a Kapton foil with a copper layer on each side.
      
A novel epoxidized soybean oil (ESO) internally toughened phenolic resin(ESO-IT-PR) with both good toughness and excellent thermal stability was prepared as the matrix resin of copper clad laminate (CCL).
      
The upper layer was created by printing and etching of a polyimide single clad laminate.
      
This paper covers the effects of this process on wrinkles in the dry film resist and on the dimensional stability of clad laminate.
      


A general description is given to the technical conditions for the synthesis of epoxy resin EX23-A28 and to the properties of FR-4 copper clad laminates made from this resin.

本文主要介绍FR-4覆铜板专用环氧树脂EX23-A80的研制、合成工艺的选择和制成FR-4覆铜板的性能。

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates...

The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process.

介绍了高可靠电镀Ni/Au工艺在PTFE微波印制电路上的应用,并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ni/Au镀层之间附着力的措施。。通过实验及应用证明了与直接镀金工艺相比,在软基材PTFE敷铜箔板上镀Ni/Au工艺能大大提高微波电路的可焊性、高温稳定性和长期可靠性,并且用其所制作的微波器件的高频性能也优于直接镀金工业。

The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

 
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