助手标题  
全文文献 工具书 数字 学术定义 翻译助手 学术趋势 更多
查询帮助
意见反馈
   solder joint 的翻译结果: 查询用时:0.008秒
图标索引 在分类学科中查询
所有学科
金属学及金属工艺
无线电电子学
电力工业
更多类别查询

图标索引 历史查询
 

solder joint
相关语句
  焊点
     The Study of the Fatigue Property of 42Sn58Bi 96.5Sn3.5Ag System Solder Joint
     42Sn58Bi-96.5Sn3.5Ag系焊点疲劳性能的研究
短句来源
     Effect of Lanthanum on Driving Force for Cu_6Sn_5 Growth and Improvement of Solder Joint Reliability
     镧对Cu_6Sn_5长大驱动力及焊点可靠性的影响
短句来源
     Study on Shear Strength for Sn-3Ag-3Bi Solder Joint
     Sn-3Ag-3Bi焊点剪切强度的研究
短句来源
     Effect of Aging on the Interface Microstructure of Sn3.0Ag2.8CuCu Solder Joint
     等温时效对Sn3.0Ag2.8Cu/Cu焊点界面层组织的影响
短句来源
     The Darveaux’s equation was used to predict the thermal fatigue life of the Sn3.5Ag0.75Cu solder joint. The Sn3.5Ag0.75Cu solder joint’s life is longer than the 63Sn37Pb solder joint’s by contrasting with each other.
     本文选用以能量为基础的Darveaux寿命预测模型,预测了无铅钎料Sn3.5Ag0.75Cu焊点初始产生裂纹的循环次数和焊点的热疲劳寿命,并和63Sn37Pb钎料的焊点热疲劳寿命作了对比,结果表明无铅钎料Sn3.5Ag0.75Cu焊点的热疲劳寿命大于63Sn37Pb钎料焊点的热疲劳寿命。
短句来源
更多       
  “solder joint”译为未确定词的双语例句
     CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY
     CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY
短句来源
     RELIABILITY AND CRACK PROPAGATION OF 92.5Pb5Sn2.5Ag SOLDER JOINT UNDER THERMAL CYCLING
     92.5Pb5Sn2.5Ag焊层热循环可靠性和裂纹扩展
短句来源
     Effect of Aging on Microstructure and Shear Strength of Sn57Bi0.5Ag/Cu Solder Joint
     时效处理对Sn57Bi0.5Ag/Cu钎焊接头组织及性能的影响
短句来源
     The creep- rupture life of Sn-3Ag-2. 8Cu solder joint at room temperature could be remarkably increased by minute amount of Ce, even up to 9 times morethan that of Sn-3Ag-2. 8Cu solder joints when content of Ce is 0.1% .
     微量稀土Ce可以显著延长Sn-3Ag-2. 8Cu钎料接头在室温下的蠕变断裂寿命,尤其是当稀土Ce的含量分数为0. 1 wt.%时,其蠕变断裂寿命可以达到Sn-3Ag-2. 8Cu钎料的9倍以上;
短句来源
     With the increasing of Cu in the Sn-Zn-xCu solder,the shear strength of the Sn-Zn-xCu/Cu solder joint is enhanced obviously because of the transformation of IMC type at the interface and the improving of solder strength.
     另外,随着Sn-Zn钎料中Cu含量的增加,Sn-Zn-xCu/Cu接头剪切强度因界面IM C类型的变化以及钎料合金自身强度的提高而使得钎焊接头剪切强度明显提高.
短句来源
更多       
  相似匹配句对
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     Quality and Reliability of Solder Joint
     焊点的质量与可靠性
短句来源
     On Joint Mortgage
     论共同抵押
短句来源
     Joint Operations
     联合进攻——风暴行动
短句来源
查询“solder joint”译词为用户自定义的双语例句

    我想查看译文中含有:的双语例句
例句
为了更好的帮助您理解掌握查询词或其译词在地道英语中的实际用法,我们为您准备了出自英文原文的大量英语例句,供您参考。
  solder joint
An underfill is used to fill the gap between the integrated circuit chip and substrate to improve the solder joint fatigue life in flip-chip packaging.
      
The flip-chip on organic substrates has relied on the underfill to enhance the solder joint reliability.
      
Reflection-area-based feature descriptor for solder joint inspection
      
The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.
      
Underfill encapsulant is used to couple the bilayer structure and is critical to the reliability of the flip-chip solder joint interconnects.
      
更多          


In this paper,we have described the pro-cess of the automated processing and analysisof holographic interferograms which has beenused in the Laser Holographic Inspecting Sys-tem of Bad Solder-Joint on PCB(Printed Cir-cuit Board).The precess includes removingbackground,smoothing,segmentation,thinningand fringe classification,The algorithm ofevery step has been generally analysed.

本文阐述了激光全息印刷电路板焊点缺陷检测系统中实现的激光全息干涉图自动处理与分析的全部过程.该过程包括背景分离、平滑、分割、细化、条纹分类等步骤.文中对每个步骤都给出了描述性的算法,并进行了分析.

This paper first reviews the recent development of Several inspection methods and mainly introduces the Holographic inspection system of PCB Solder joint defects, which is tried and implemented by the authors and their coleagues. Holographic inspection method is a newer one of PCB solder joint inspection. The principle of holographic inspection and the composition of the inspection system are described in detail in this paper, and the experimental result is given.

本文首先从国内外的发展现状,概述了印刷电路板缺陷焊点的几种检测手段。并着重介绍了作者与其同事们正在研制的激光全息印刷电路板焊点缺陷自动检测系统。

A Sn-base soft solder, which is heat resistant, of no pollution, technologically repeatable and stable, with a melting point of 240℃, has been deve- loped. The shear strength of the soldering joint soldered with solder 2-9 for H6 2 brass plate is up to 34 Mpa at room tempereture and 20 Mpa at 200℃, respectively.

本文介绍了锡基耐热软钎料的研制。用2-9钎料钎焊H62黄铜片(搭长为10mm),室温剪切强度大于30MPa,200℃时仍具有20MPa的剪切强度,熔点为240℃,工艺性良好,无污染。采用光学显微镜、扫描电镜作了焊缝的微区分析、成份面扫描以及断口分析。

 
<< 更多相关文摘    
图标索引 相关查询

 


 
CNKI小工具
在英文学术搜索中查有关solder joint的内容
在知识搜索中查有关solder joint的内容
在数字搜索中查有关solder joint的内容
在概念知识元中查有关solder joint的内容
在学术趋势中查有关solder joint的内容
 
 

CNKI主页设CNKI翻译助手为主页 | 收藏CNKI翻译助手 | 广告服务 | 英文学术搜索
版权图标  2008 CNKI-中国知网
京ICP证040431号 互联网出版许可证 新出网证(京)字008号
北京市公安局海淀分局 备案号:110 1081725
版权图标 2008中国知网(cnki) 中国学术期刊(光盘版)电子杂志社