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   aerospace material 的翻译结果: 查询用时:0.199秒
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aerospace material
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  航天材料
     In this paper,monomers and prepolymer for polyarylacetylene and their synthesis mechanism, expatiates on its shortages and improvements made by the researchers at home and abroad were preseuted and the prospect in the wide application of the aerospace material field was introduced.
     介绍了聚芳基乙炔所用单体的合成,聚合机理,阐述了其不足之处和国内外研究人员对聚芳基乙炔所做的改进,并指出其在航天材料领域广泛应用的潜力。
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  航空材料
     Argosy (shanghai) Aerospace Material Ltd. Open in Shanghai
     雅奇(上海)航空材料有限公司落户上海
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  “aerospace material”译为未确定词的双语例句
     The Research Tendency Of High-Modulus/High-Strength PBT Fibers As An Advanced Aerospace Material For The Future
     未来的宇航材料高模量高强度PBT纤维的研究动态
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  相似匹配句对
     MATERIAL
     原料
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     Material
     一、实验材料
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     Nanometer Material and Its Applications in Aerospace
     纳米材料及其在航天领域中的应用
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     Study of Ceramic Metal Antifriction Material for Aerospace
     航空用金属陶瓷减摩材料研究
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     Aerospace China
     《中国航天》2002年总目录
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  aerospace material
The main driving force in aircraft structural design and aerospace material development is to reduce weight.
      
This Index is the most current listing of Aerospace Material Specifications, enabling you to locate each document quickly and easily.
      


It is widely recognized that the weight of a structural component is inversely proportional to the specific strength or the specific stiffness of the material selected and that these properties of materials are the most important parameters to be considered in material s selection.The relation between a structural weight and strength or modulus of elasticity of materials under the conditions of a plate under tension, bending of a beam, a column subjected to compression and a hollow cylinder...

It is widely recognized that the weight of a structural component is inversely proportional to the specific strength or the specific stiffness of the material selected and that these properties of materials are the most important parameters to be considered in material s selection.The relation between a structural weight and strength or modulus of elasticity of materials under the conditions of a plate under tension, bending of a beam, a column subjected to compression and a hollow cylinder under internal pressure are analysed and appropriate expressions for effective specific strength and effective specific stiffness are obtained. In general, these two parameters are given as σx/ρ or Ey/ρ (x, y≤l) respectively, and are recommended as criteria for optimizing materials selection, in place of the specific strength σ/ρ and specific stiffness E/ρ applied commonly. Based on these expressions, it seems more effective to decrease the density of a material rather than to raise its strength or modulus of elasticity if weight is the critical problem for a design. From this point of view, it may be said that the history of developing aerospace materials is also the history of successively decreasing the densities of materials.

通常结构件的重量与所用材料的比强度或比刚度成反比,因此比强度、比刚度就成为材料选择的主要参数。本文分析了板材、型材在拉伸、弯曲作用下以及受压杆件、内压圆筒件的构件重量和材料强度、弹性模量之间的关系,求得合理的有效比强度、有效比刚度的表达式。根据计算,这两个参数可以分别表示为o~x/ρ或E~y/ρ(x,y≤1)。作者建议采用这两个参数代替常用的o/ρ和E/p,作为优化材料选择的准则。 基于以上表达式,对于重量成为设计的严重问题来说,降低材料的密度比提高材料的强度或弹性模量更为有效。从这个意义上说,宇航材料的发展史也就是材料密度不断降低的历史。

The bollow glass mterospberes bare the characteristics of low gravity, high heat resistance, low thermoconductivity, low electrocondactivity, fire-resistance and good chemical attack resistance. So it can be used to make many kinds of light sealants and ad-hesires, if it is mixed with the fluid resins or robbers. For example, fire-resisting wall sealants, thermal insulating adhasives, abrasive materials, sound-absorbing materials, low dielectric constant and dielectric loss insulating casting compounds...

The bollow glass mterospberes bare the characteristics of low gravity, high heat resistance, low thermoconductivity, low electrocondactivity, fire-resistance and good chemical attack resistance. So it can be used to make many kinds of light sealants and ad-hesires, if it is mixed with the fluid resins or robbers. For example, fire-resisting wall sealants, thermal insulating adhasives, abrasive materials, sound-absorbing materials, low dielectric constant and dielectric loss insulating casting compounds etc, they all can be used for aeronautical and aerospace materials.

空心玻璃微球具有低比重、高耐热性、低导热率、低导电率、耐化学侵蚀和耐燃性。它与液态树脂或橡胶混合后,能制造出多种轻质密封剂或胶粘剂,例如防火墙密封剂、绝热胶粘剂、可磨损材料、吸音材料、低介电常数和低电损耗的绝缘灌注料等,均可广泛应用于航空和宇航系统的材料。

The cutting ratio, usually used as a convenient measure of cutting efficiency, is unsuitable for semidiscontinuous chip formation, which occurs in cutting some aerospace materials such as titanium alloy and other high temperature alloys. In the type of cutting with inhomogensous strain, as is in the case of cutting titanium alloy, the back of the chip is serrated. The cutting ratio (as ordinarily obtained)is without meaning, for it is difficult to obtain an accurate measurement of the mean value of chip...

The cutting ratio, usually used as a convenient measure of cutting efficiency, is unsuitable for semidiscontinuous chip formation, which occurs in cutting some aerospace materials such as titanium alloy and other high temperature alloys. In the type of cutting with inhomogensous strain, as is in the case of cutting titanium alloy, the back of the chip is serrated. The cutting ratio (as ordinarily obtained)is without meaning, for it is difficult to obtain an accurate measurement of the mean value of chip thickness. To the authors' best knowledge, there is no published report on cutting ratio that is suitable for semidiscontinuous chip formation. The contributions of this paper are : (1) Dynamic cutting ratio(Eq. 12 in the full paper)is derived from experimental observations for measuring cutting efficiency in the case of semidiscontinuous chip formation. For convenience in engineering evaluation, quasi-static or equivalent cutting ratio(Eq. 16 in the full paper)is derived from dynamic cutting ratio. (2) Dynamic shear angle in orthogonal chip segmentation (Eq.18 in the full paper) is derived from Eq.(12) and Eq.(17) to replace the customary shear angle. Only when strain is essentially constant, can the customary shear angle be used. Now additional remarks will be presented to explain in some detail the authors' research. The process of chip segmentation in machining can be considered as a system with cutting speed as input and chip velocity along the tool face as output. The authors adopt film motion analysis technique to study the velocity variation of segmental chips. High speed cinematography at the rate of 5000 frames/sec records the chip segmentation process in machining titanium alloy. The film thus obtained is then analyzed with Film Motion Analyzer. The chip velocity data obtained from this analysis can be satisfactorily expressed by a second-order step-function, Eq. (4) in the full paper. Thus, the dynamic cutting ratio, Eq.(11), and quasi-static cutting ratio, Eq.(14),are derived. The shear angle does not remain constant in chip segmentation process. The dynamic shear angle in orthogonal chip segmentation may be computed with Eq.(16) in the full paper. Values calculated with Eq.(16) show good agreement with the authors' experimental results.

本文借助影片运动分析仪,对用高速摄影记录的钛合金切屑沿前刀面的流动规律进行了研究,并用系统分析法进行了描述,推导出能反映半不连续切屑不均匀变形过程的动态衡量参数,同时也导出了度量此种切屑塑性变形的准静态参数——等效切削比。

 
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