The high speed or super-high speed grinding's force has the same variety regulation contrast to the common speed grinding, which can get the explanation from closely empirical formulas. Under the same grinding condition, the grinding force of laser trimming wheel is near to or slightly lower than the mechanical trimming wheel.
Several new techniques for frequency trimming of SAW devices are described, such-as laser trimming of metallization strips on the devices, irradiation of very thin SiO2 films by ultraviolet light, and polymer ac-tivation with high temperature, light beams and electron beams.
Fabricated with high voltage, shallow junction bipolar process and laser trimming of thin film resistors, the device has achieved a 12 bit resolution, an integrator linear error and a differential linear error less than 1/2 LSB. Operating at a ±15 V power supply, it has a power dissipation down to 225 mW.
This conventional laser trimming method to adjust the resistivity of TFRs is an indispensable technique for manufacturing elec-tronic devices such as hybrid ICs.
Various failure mechanisms within bismuth ruthernate resistor systems associated with firing, substrate, conductor termination, laser trimming, assembly, packaging, environmental testing, power loading and high voltages, respectively, are reviewed.
The possibilities for laser trimming are studied, the disadvantages of this method are revealed, and the ways of developing this approach on the basis of computer-aided design and modeling are proposed.
Use of laser trimming for the development of a project for accuracy-normalization of the resistance of resistors in hybrid integ
The issue is not so much silicon area as the cost of laser trimming, testing, and yields.